Palomar Technologies to Exhibit at 2015 Strategies in Light Exhibition and Conference

Posted by Katie Finney on Tue, Feb 24, 2015

Carlsbad, CA – February 24, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced that they will return to exhibit at the 2015 LED-focused show, Strategies in Light, this week February 24-26 held in Las Vegas.

HB/HP LED Assembly

One of the fastest growing technologies in the world is High-Bright/High-Power LEDs. Industrial and commercial lighting contribute largely in the HB LED market growth. Other end uses are found in aircraft lighting and powerful heaters in water purification systems. These LEDs are very efficient by a factor of ~60%. They are durable, long-lasting and, over time, cost reducing. The LED enables its user to essentially get more for less. HB LEDs can drive very high currents into the hundreds of mA; some HB LEDs can emit lumens in the thousands.

HBHP_LED_Assembly

HB LED tolerances are easily obtained with Palomar Technologies' machines to meet the package requirements of LEDs. Optimal thermal conductivity is achieved through the eutectic bonding process using the Palomar Technologies designed Pulsed Heat System stage.

Precise LED die attach applications can be manufactured using silver-filled conductive epoxy dispensing and daubing methods on a 3800 Die Bonder. Palomar Technologies has been working with advanced LED designs for over seven years, and was one of the first companies to process matrix LEDs – in modules containing anywhere from six to over 1,000 die.

LED

Strategies in Light

Strategies in Light is a business conference and exhibition that focuses on solid-state lighting (SSL), which includes both light-emitting diodes (LEDs) and organic light emitting diode (OLEDs) technologies. It is the longest-running and the largest conference in the HB LED industry, and the premier annual forum for presenting current commercial developments in high-brightness LED applications and providing unparalleled networking opportunities for component and equipment suppliers, manufacturers, and end-users of HB LED devices.

Bradley Benton, our Western Regional Sales Manager, will be on-site to lead discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding. Palomar Technologies will be located at booth number 1332. Contact Palomar Technologies or visit our booth to schedule an on-site meeting at the conference.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download the 3800 Die Bonder Data Sheet:

3800 Die Bonder Data Sheet

 

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Contact

Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

Tags: 3800 die bonder, HB LED, Strategies in Light, LEDs

Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs

Posted by Rich Hueners on Wed, Feb 01, 2012

Carlsbad, CA – February 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced a precision eutectic process development for direct attach light emitting diodes (LEDs).

“Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs,” explains Donald Beck, General Manager of Palomar Technologies Assembly ServicesTM. “Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. Palomar Technologies’ Pulsed Heat System is a major contributor to this development, allowing our precision die attach systems to control LED exposure much more effectively than most other processes. The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management.”

Palomar Technologies is exhibiting at the LED-focused show, Strategies in Light 2012, in booth #709 on February 7-9 in Santa Clara, CA. Julie Adams, Director of WW Assembly Services Sales will be on site to assist in discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding.

Also on February 7-9, Palomar Technologies is exhibiting as a premier sponsor at IMAPS RF 2012 in booth #RF01, held in San Diego, CA. Bradley Benton, Western Americas Sales Manager, will be presenting an overview of Palomar Technologies’ solutions and advanced RF automated packaging processes on February 8 at 1:00pm, local conference time.

Contact Palomar Technologies to arrange an on-site meeting at either Strategies in Light 2012 or IMAPS RF 2012.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: device design, LED applications, eutectic die attach, eutectic soldering process, Contract Assembly, Complex Packaging, contract assembly in microelectronics, assembly and packaging, eutectic process, IMAPS, HB LED, complex LED modules, eutectic, Strategies in Light

Palomar Technologies Highlights Improved High Volume HB LED Assembly at Strategies in Light Conference

Posted by Rich Hueners on Thu, Feb 10, 2011

Carlsbad, CA – February 10, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its involvement in the Strategies in Light conference, held February 22-24 in Santa Clara, CA.

Assembly Services is the contract assembly division of Palomar Technologies. Assembly Services enables organizations around the globe to achieve balance between speed and reliability in precision assembly of high-volume HB LED packaging without investing in capital equipment,” stated Assembly Services general manager, Donald Beck. “We are looking forward to showcasing our HB LED assembly services as an exhibitor at the upcoming Strategies in Light conference later this month.”

Worldwide account manager for Assembly Services, Steve Buerki, will be on site at the Strategies in Light conference at booth #238. To ensure an in-person meeting with Mr. Buerki, download a free admission pass to the Strategies in Light exhibitors’ show floor.

Assembly Services provides prototyping, test, measurement and production for high accuracy and complex wire and die attach applications. To meet increasing customer demand, additional clean room space was recently added in the California-based laboratory, increasing production capacity by 50%. Assembly Services expertise includes development and production for applications such as HB LEDs, RF power modules, military hybrids and laser diode packages.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: LED applications, capital equipment, LED packaging, Contract Assembly, contract assembly in microelectronics, HB LED, Strategies in Light, low cost high volume production

Palomar Technologies To Exhibit at 2009 Strategies in Light Exhbition and Conference

Posted by Rich Hueners on Wed, Feb 11, 2009

Carlsbad, CA – February 11, 2009 – Palomar Technologies announced today it will return to exhibit at the 2009 Strategies in Light Exhibition and Conference to be held February 18 – 20, 2009 in Santa Clara, California. Palomar Technologies will be exhibiting in booth #606 at the Strategies in Light Exhibition and Conference where microelectronics experts will explain how Palomar’s wire bonding and die attach equipment perform the necessary assembly processes to achieve high brightness while achieving thermal dissipation and maximum light extraction.

Palomar Technologies is a leading provider of automated precision microelectronic assembly equipment and contract assembly services that serves industry leaders in telecommunications, medical, defense and aerospace and commercial high-technology. Added applications at Palomar Technologies in 2009 include wafe scale packaging, chip-on-flex, advanced Gold ball and stitch bonding, Gold stud bumping for GGI (Gold Gold Interconnect) as well as epoxy and eutectic solder and thermo-compression bonding processes.

Palomar Microelectronics is the development, test, and contract assembly division of Palomar Technologies. Their microelectronic assembly services include advanced wire bonding, gold stud bumping, wafer scale packaging and device bonding for GGI processes, precision component placement for high-power LEDs, optoelectronics, MEMS, microwave/RF, multichip modules (MCMs), and hybrid microcircuits. Palomar optimizes precision placement and high-thermal conductivity interconnects of high-power LED packaging through the use of field-proven automated component placement systems and pulse heat eutectic die attach equipment. Palomar’s high-density wire-bonded connections are accurately placed in tight areas,have consistent loop structure, and connections strong enough to withstand mechanical shock and stresses due to large thermal variations.

Strategies in Light is a business conference and exhibition focused on high-brightness LEDs produced by Strategies Unlimited and PennWell Corporation. It is the longest-running and the largest conference in the HB LED industry, and the premier annual forum for presenting current commercial developments in high-brightness LED applications and providing unparalleled networking opportunities for component and equipment suppliers, manufacturers, and end-users of HB LED devices.

About Palomar Technologies
Palomar Technologies (formerly part of Hughes Aircraft Company) is the world’s foremost supplier of automated high-precision wire bonders, die bonders and component placement systems combined with process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers.

Tags: die bonders, eutectic die attach, die bonding, contract assembly in microelectronics, automated component placement systems, Epoxy Die Attach, assembly and packaging, eutectic process, die bonder, eutectic, Strategies in Light