Palomar Technologies to Exhibit at SEMICON China in Shanghai

Posted by Janine Powell on Thu, Mar 09, 2017

Carlsbad, CA—March 8, 2017—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be exhibiting at SEMICON China at the Shanghai New International Expo Centre in Shanghai on March 14-16 in booth #4543. Be First Technology Co. Ltd will be representing Palomar at the show, alongside some key members of the Palomar and SST Vacuum Reflow Systems teams. The 3880 Die Bonder, as well as the SST 5100 Vacuum Pressure Furnace will be showcased at the booth; SST will also be launching a new product at the show.

Talk With Palomar About Die Bonding
The 3880 Die Bonder is the next-generation die bonder with an improved bondhead design, integrated with a Z-Theta leveling mechanism and high speed bi-directional 8-tool turret. Because of the 3880’s inherent highly repeatable planarity feature, wide force range, and fast tool change, customers in the optoelectronic and RF/wireless device packaging markets have seen the greatest increases in performance and throughput.

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SST Vacuum Reflow Systems
Exhibiting with Palomar at SEMICON China will be SST Vacuum Reflow Systems. Palomar acquired SST in March of 2015, and have been actively integrating the SST solutions within Palomar’s suite of advanced packaging and assembly products. A critical feature of SST’s unique position is its expertise in designing and 5100.pngmachining graphite tooling plus process expertise. With refined process expertise, SST provides a void-free eutectic attach, hermetic package sealing, glass to metal sealing, and wafer level bonding. The Model 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. Be sure to stop by the booth to see this system live, along with their newest product addition.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About SST Vacuum Reflow Systems
SST Vacuum Reflow Systems is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment. For more information, visit www.sstinternational.com.

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APAC Contact
Mr. PH Chan
Director of North Asia Sales
Palomar Technologies (S.E. Asia) Pte Ltd | (+65) 6686-3096

Media Contact
Katie Schirmer
Marketing Communications Manager
Palomar Technologies, Inc.
kschirmer@bonders.com | +1 760.931.3680

Tags: Announcements, trade shows, SEMICON China, SST Vacuum Reflow Systems

Wedge and Die Bond Demos at SEMICON West 2016

Posted by Janine Powell on Wed, Jul 06, 2016

Carlsbad, CA – July 6, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced product demos at SEMICON West 2016. The 9000 Wedge Bonder, 3880 Die Bonder, and SST 5100 with QuikCool™ system will be showcased through live demonstrations in booth #5952 on July 12-14 at the Moscone Center in San Francisco, CA.

Test Drive the New 3880 Die Bonder at SEMICON West 2016
Palomar Technologies' new 3880 Die Bonder features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boat, and carriers. Custom stages are also available.

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In the early 1990s, Palomar developed the “tool turret” design which has become standard on all of our die bonders. This tool turret is outfitted with 8 tools and designed for customers who require maximum flexibility while maintaining throughput and yield. We designed the 3880 Die Bonder by keeping the tool turret idea and maintaining 8 tools. Several new features were added to improve capabilityspeedservice reliabilityease of operation, and cost-of-ownership.

Automated High-Speed Fine Wire Wedge & Ribbon Bonder Demos
Along with the 3880 Die Bonder, attendees at the show will be able to view a full application demo of the 9000 Wedge Bonder with inline handlers using i2Gi®: Intelligent Interactive Graphical Interface®.  The 9000 Wedge Bonder offers ultimate control and flexibility to change from a 45-60° wire feed range to 90° deep access with only a clamp change on the robust, theta-rotation bond head.

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SST Vacuum Reflow Systems Announce New QuikCool Auxiliary Cooling System
Also on exhibit in the Palomar Technologies booth will be SST’s new auxiliary cooling system option for their Model 5100 Vacuum Pressure Furnace. The New_QK_B.pngQuikCool system was a response to customers who wanted to know how they could increase batch production throughput, thus reducing costs and increasing the volume of units produced. By quickly reducing the chamber’s temperature after reflow, process cycle time is reduced, thus allowing more production cycles per hour.

Be sure to stop by the booth if you are visiting SEMICON West, check out a demo, and speak with our experts about your application challenges.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

Tags: Announcements, trade shows, SST Vacuum Reflow Systems, SEMICON West 2016