Hi-Rel Wire Bonder & Universal Bond Tester Demonstrations at SMT Nuremberg 2012

Posted by Rich Hueners on Tue, May 01, 2012

Carlsbad, CA – May 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at SMT Nuremberg 2012, May 8-10, with live wire bonder demonstrations.

Palomar Technologies will exhibit in Hall 6 Booth #433 and will showcase an 8000 Wire Bonder and a Royce 650 Universal Bond Tester.

The 8000 Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

Palomar Technologies offers several complementing die bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the ultra flexible 3800 Die Bonder, which supports up to three channels of adhesive dispense, component placement, epoxy and eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

Mr. Josef Schmidl, director of Palomar Technologies Europe located in Erlangen, Germany, will be attending SMT Nuremberg and is available during the conference for any on-site meetings.

Mr. Dale Perry, Regional Manager of the Eastern North/South Americas, will also attend SMT Nuremberg. Mr. Perry is available during the duration of the conference to discuss Palomar Technologies Assembly ServicesTM capabilities and solutions.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: wire bonder, wire bonding, bonders, wire bonders, capital equipment, ball bumping, semiconductor vs. hybrid, Eastern Europe, ball-bumping process, 8000 wire bonder, wire bond testing, Palomar Europe, Royce Instruments, wire bond demo, Contract Assembly in Europe, palomar 8000, SMT

Palomar Technologies Performs Live Demonstrations of 3800 Die Bonder and 8000 Wire Bonder at SMT Hybrid Packaging 2011 and Hosts Free On-Demand HB LED Webcast

Posted by Rich Hueners on Mon, Apr 25, 2011

Carlsbad, CA – April 25, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will perform live demonstrations of the 3800 Die Bonder and 8000 Wire Bonder systems at SMT Hybrid Packaging 2011 in Nuremberg, Germany, on May 3-5.

Palomar Technologies will be showcasing the application capabilities of the high-accuracy 8000 Wire Bonder and the ultra-flexible 3800 Die Bonder— a recent winner of the 2011 New Product Introduction Awards announced on April 12, 2011. Palomar Technologies will be exhibiting in the Optoelectronic Booth, #6-115D (hall #6).

Julie Adams, director of worldwide sales for Assembly Services (a division of Palomar Technologies), will be on-site at the conference to engage in discussions regarding precision microelectronic contract assembly solutions.

"Assembly Services offers a practical and reliable solution for companies in need of contract assembly, process development and application prototyping,” states Julie Adams. “We offer unique solutions such as 2-micron component placement accuracy supported by best-in-class die attach and wire bond equipment along with in-house application engineering experts to tackle your most challenging microelectronic packaging needs—a company that can prepare your organization and products for volume manufacturing, all while abiding by strict customer confidentiality and maintaining IP.”

Assembly Services has developed an efficient process flow in HB LED application production. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast “Automated Precision Assembly for High-Volume HB LED.” Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, ball bonder, LED applications, die bonders, LED packaging, Contract Assembly, ball bumping, contract assembly in microelectronics, 8000 wire bonder, HB LED, complex LED modules, wire bond demo, SMT, ball bump, NPI Awards