Palomar Technologies Performs Live Demonstrations at SEMICON China 2016

Posted by Katie Finney on Tue, Mar 08, 2016

Carlsbad, CA—March 8, 2015—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced they will be present at SEMICON China March 15-17, 2016 at the Shanghai New International Exhibition Center. SEMICON China “connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China”.

Palomar Technologies is looking forward to showcasing and providing live demonstrations of their 9000 Wedge Bonder and their new 3880 Die Bonder. To view the live demonstrations and learn more about Palomar, stop by the Be First Technology Co., Ltd. booth located at booth #4667. You can also learn more about Palomar Technologies by stopping by the Beijing Asia Science & Technology Co., Ltd booth located at booth #2443.

Palomar Technologies' new 3880 Die Bonder features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boat, and carriers. Custom stages are also available.3880_Bond_Head.png

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. The 9000 Wedge Bonder offers ultimate control and flexibility to change from a 45-60° wire feed range to 90° deep access with only a clamp change on the robust, theta-rotation bond head. No need for multiple expensive bond heads! Modern Wedge Bonding eBook

 The Palomar Asia office may be contacted online: www.palomartechnologies.com/contact-palomar-technologies-asia/

Download these resouces for more information:

3880 Data Sheet Epoxy Die Attach eBook 9000 Data Sheet
3880 die bonder epoxy die attach,daubing, epoxy dispensing, high-precision component attach 9000 Wedge Bonder data sheet

 

Tags: SEMICON China, 9000 Wedge Bonder, 3880 Die Bonder

Palomar Technologies’ CTO to Present at SEMICON China 2015

Posted by Katie Finney on Mon, Mar 16, 2015

Carlsbad, CA – March 16, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at SEMICON China 2015. SEMICON China is celebrating its 27th year anniversary and will be held at the Shanghai New International Exhibition Center on March 17-20.

9000_pic17_hi_res

Dan Evans, Palomar Technologies’ Chief Technical Officer, will be presenting his technical paper titled “Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies” at this year’s SEMICON China conference.

Mr. Evan’s technical paper discusses both VCSEL and EEL technologies from a packaging architectural view with case studies showing high accuracy pick and place of the laser die, photo detector, and lens attachments. He also presents example cases to show the challenges and solutions to high accuracy die attach active optical cables. The paper is applicable to process engineers and managers who currently, or plan to, assemble Active Optical Cable transceivers or other similar packages using high accuracy pick and place systems. 

In addition to Dan Evan’s presentation of his technical paper, Palomar Technologies is also looking forward to showcasing their 9000 Wedge Bonder as well as performing live demonstrations of their 3800 Die Bonder and 8000i Wire Bonder at this year’s SEMICON China.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90° deep access on a single large work area. There are 7 key differentiators to the 9000 Wedge Bonder, which help customers achieve modern wedge bond requirements.  
7 key differentiators

The ultra-flexible 3800 Die Bonder is designed for fully automatic, precision microelectronic assembly. The 3800 is versatile, powerful and can provide specialized functions in addition to its primary functions.

Palomar Technologies’ 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. 

The Palomar Asia office may be contacted online: www.palomartechnologies.com/contact-palomar-technologies-asia/. 

Download these resouces for more information:

9000 Data Sheet 3800 Data Sheet 8000i Data Sheet
9000 Wedge Bonder data sheet 3800 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

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Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com| +1 760-931-3681

Tags: 3800 die bonder, 8000i Wire Bonder, SEMICON China, 9000 Wedge Bonder

Automated Wire Bonding Production System Demonstrations at SEMICON China 2014

Posted by Katie Finney on Mon, Mar 17, 2014

Carlsbad, CA – March 17, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today the live demonstration of the 8000i Wire Bonder at SEMICON China 2014. SEMICON China is celebrating its 26th year, held this year at the Shanghai New International Expo Center on March 18-20.

Palomar Technologies' new 8000i Wire Bonder comes equipped with i2Gi® technology. The8000i wire bonder 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

Intelligent Interactive Graphical Interface (i2Gi) on the new 8000i Wire Bonder
i2Gi (cleverly pronounced “iggy”) is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.

8000i Data Sheet

8000i wire bonder, ball bumper, i2Gi  

i2Gi Data Sheet

i2Gi, intelligent interactive graphical interface, modern wire bond control software  

i2Gi supports modern automated wire bonding for complex hybrid production. Watch the video:

An 8000i Wire Bonder will be available for live demonstrations throughout the duration of SEMICON China in the Asia Science & Technology (AST) booth #3287 with supplemental information about our 3800 Die Bonder available also in the BE FIRST booth #3703. Mr. PH Chan, Palomar Technologies Asia managing director, will be onsite at the show to discuss automated wire bonding, die attach and full factory automation requirements. The Palomar Asia office may also be contacted online: http://www.palomartechnologies.com/contact-palomar-technologies-asia/.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly, and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Janine Hueners
Marketing Communications, Palomar Technologies
jhueners@bonders.com | +1 760-931-3680

Tags: 3800 die bonder, Announcements, Palomar Asia, 8000i Wire Bonder, i2Gi, SEMICON China

Palomar Technologies 3800 Die Bonder Offers Flexible Solutions to Support LED Development in China

Posted by Rich Hueners on Mon, Mar 12, 2012

Carlsbad, CA – March 13, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit with Asia Science and Technology (AST) at SEMICON China 2012, held in Shanghai on March 20-22.

Palomar Technologies, Hybond and AST will exhibit together in booth #3153 in Hall E3. A Palomar 3800 Die Bonder and manual Hybond equipment will be on-site for demonstrations.

Mr. PH Chan, Palomar Technologies Asia Director, recently wrote a blog summarizing the LED markets in Asia, specifically recounting how LEDs relate to China’s 12th five-year plan.

“By 2015, China intends its manufacturing standards to be globally viable for the volume production market. By that time, China’s LED industry is estimated to reach $75 billion,” stated Mr. Chan. “The 3800 Die Bonder is capable of ultra-high precision and high-reliability eutectic and epoxy die attach processes. This robust system is in production with several major players in the Asia-based LED market today. The 3800 Die Bonder embodies great versatility to accommodate multiple processes on a single 710in2 work envelope as well as tremendous flexibility to remain vigilant for the future of component packaging.”

Mr. Chan will be attending SEMICON China and is available during the conference for any on-site meetings.

In addition to the ultra-flexible 3800 Die Bonder, Palomar Technologies offers several complementing bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the 8000 Wire Bonder is a large area, high-reliability wire bonder and ball bumper with deep access capabilities. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, wire bonder, wire bonds, wire bonding, LED matrix assembly, LED applications, wire bonders, capital equipment, LED packaging, wafer scale packaging, automated component placement systems, automated packaging systems, Hybond, 8000 wire bonder, 6500 die bonder, automation vs. manual, field services support, Bonder Boot Camp, made in china, SEMICON China, wire bond testing

Palomar Technologies to Provide Live Demonstrations of the 3500-III Die Bonder at SEMICON China 2011

Posted by Rich Hueners on Mon, Mar 14, 2011

CARLSBAD, CA - March 14, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will showcase live demonstrations of the 3500-III Die Bonder at SEMICON China 2011 in Shanghai.

Palomar Technologies will exhibit a 3500-III Die Bonder at booth #3615 at the SEMICON China 2011 conference on March 15-17. In conjunction with the high-precision die bonder machine, Palomar Technologies will offer demonstrations of a Royce Instruments DE35-ST Mechanized pick-and-place system and a Hybond, Inc., UDB-141 Semi-automatic Eutectic Die Bonder. Palomar Technologies Asia Director, Mr. PH Chan, will be on-site at SEMICON China 2011 to engage in discussions of Palomar Technologies high-accuracy die attach and wire bonder systems and solutions.

Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is Odd-Form Factor Package Wire Bond Case Studies, a technical paper exploring the wire bonding requirements of several device cases considered odd form factor package formats when compared to mainstream semiconductor packaging. Solutions to wire bond packages in the RF, automotive, and optical markets are also discussed.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: die bonders, eutectic die attach, die bonding, Epoxy Die Attach, 3500 Die Bonder, SEMICON China, eutectic process, die bonder, eutectic, large area bonder, inline assembly, odd form factor