Latest news in micoelectronics, optoelectronics, LED assembly and complex hybrid packaging from Palomar Technologies.

PTI Press Releases

Hi-Rel Wire Bonder & Universal Bond Tester Demonstrations at SMT Nuremberg 2012

Posted by Palomar Technologies MarCom Team on Tue, May 01, 2012

Carlsbad, CA – May 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at SMT Nuremberg 2012, May 8-10, with live wire bonder demonstrations.

Palomar Technologies will exhibit in Hall 6 Booth #433 and will showcase an 8000 Wire Bonder and a Royce 650 Universal Bond Tester.

The 8000 Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

Palomar Technologies offers several complementing die bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the ultra flexible 3800 Die Bonder, which supports up to three channels of adhesive dispense, component placement, epoxy and eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

Mr. Josef Schmidl, director of Palomar Technologies Europe located in Erlangen, Germany, will be attending SMT Nuremberg and is available during the conference for any on-site meetings.

Mr. Dale Perry, Regional Manager of the Eastern North/South Americas, will also attend SMT Nuremberg. Mr. Perry is available during the duration of the conference to discuss Palomar Technologies Assembly ServicesTM capabilities and solutions.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Topics: wire bonder, wire bonding, bonders, wire bonders, capital equipment, ball bumping, semiconductor vs. hybrid, Eastern Europe, ball-bumping process, 8000 wire bonder, wire bond testing, Palomar Europe, Royce Instruments, wire bond demo, Contract Assembly in Europe, palomar 8000, SMT

Palomar Technologies Achieves Fifth Consecutive Year-Over-Year Revenue Growth and Profitability

Posted by Palomar Technologies MarCom Team on Wed, Jan 04, 2012

Carlsbad, CA – January 4, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it has sustained revenue growth and profitability for a fifth consecutive year.

“The hard work and dedication of Palomar’s worldwide team and the loyal support of our customers has resulted in our fifth consecutive year of positive growth in revenue and profitability,” stated Bruce W. Hueners, president and CEO of Palomar Technologies. “We have continued to meet our customers’ complex packaging needs by providing high-precision wire bonding and die attach solutions and significantly increasing our bandwidth to address new opportunities. Our performance in 2011 has provided a solid foundation for continued expansion of the company to better serve our customers.”

In addition to fully automated wire bonders and die attach systems, Palomar Technologies offers prototyping, test and contract assembly packaging solutions through Palomar Technologies Assembly ServicesTM. Palomar Technologies Customer Services provides services such as bonder training and on-site support from Field Service Engineers and Process Development Consultants to ensure customers are achieving maximum performance on their systems.

Palomar Technologies was recognized for seven awards in 2011, including the New Product Introduction Award for the 3800 Die Bonder—the ultra flexible, high accuracy die attach machine launched in 2010—and the 2011 IMAPS Corporate Recognition Award.

Palomar Technologies continues its strong alliance channels with Hybond (manual bonder systems), GPD Global (precision fluid dispensing systems) and Royce Instruments (pull/shear testing equipment) to further support the complex microelectronic packaging needs among its large worldwide installed base.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore, employing a highly specialized staff of service technicians located around the world. For more information on current open positions, please email resumes@bonders.com.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Topics: 3800 die bonder, capital equipment, contract assembly in microelectronics, Awards, Hybond, Royce Instruments, GPD Global

Wire Bonding Company, Palomar Technologies, Forms Alliances With GPD Global, Royce Instruments and Hybond

Posted by Palomar Technologies MarCom Team on Wed, Apr 22, 2009

CARLSBAD, CA - April 22, 2009 - Palomar Technologies, a world leader in providing solutions for microelectronic and optoelectronic packaging and experts in precision wire bonding, gold wire bond and high accuracy component placement systems, announced today it has formed alliances with GPD Global, Hybond, Inc., and Royce Instruments, Inc.

"The systems that these firms provide are very complementary to our precision wire bonding, automatic wire bonders and die bonders," said Bruce W. Hueners, President and CEO of Palomar Technologies. "These alliances will enable us to offer our worldwide customer base the most comprehensive options available, and truly make Palomar the 'one-stop-solution-shop' for microelectronic and optoelectronic packaging solutions."

GPD Global, headquartered in Grand Junction, CO, is a premier manufacturer of automated precision fluid dispensing systems. "We are excited about our new relationship with Palomar. With this alliance, our advanced precision dispense systems are now available as part of a complete microelectronics assembly line," said Sven Wedekin, Vice-President and General Manager of GPD Global.

Hybond, Inc., based in Escondido, CA, is a world-renowned designer and manufacturer of manual wire bonders, die bonders and wedge bonders. Since 1980, Hybond products have been instrumental in microelectronics development and production. Felix Mayorca, Vice-President of Sales and Marketing, said, "It's a natural alliance... wherever you see a Palomar system you could also see a Hybond system."

Royce Instruments, Inc., located in Napa, CA, is an industry leader in bond testers and die sorters. The company provides compact bond testers with built-in SPC and networking, and versatile, low cost die sorters. Diane Cox, President, said, "With a 25 year record of innovation and excellent customer support, Royce Instruments looks forward to a fruitful and dynamic collaboration with Palomar."

About Palomar Technologies
Palomar Technologies, formerly part of Hughes Aircraft, is the world's foremost provider of high-precision wire bonders, gold wire bonders, die bonders and automated component placement systems. Palomar combines process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers in the telecommunications, medical, defense and aerospace and commercial high technology industries. For more information, visit www.palomartechnologies.com.

Topics: wire bonder, wire bonds, wire bonding, bonders, wire bonders, Factory Automation, Hybond, Royce Instruments, GPD Global

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