Latest news in micoelectronics, optoelectronics, LED assembly and complex hybrid packaging from Palomar Technologies.

PTI Press Releases

Palomar Technologies Performs Live Demonstrations at Productronica 2015

Posted by Katie Finney on Tue, Nov 10, 2015

Carlsbad, CA—November 10, 2015—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be performing live demonstrations of the 8000i Wire Bonder, 9000 Wedge Bonder, and SST International’s Model 5100 Vacuum Pressure Furnace at productronica, held in Munich on November 10-13, 2015. The demonstrations will be taking place at their booth located in Hall B3, Booth 302 at this year’s international trade fair for innovative electronics development and production.

8000i Wire Bonder 9000 Wedge Bonder


Productronica is the perfect platform for live demonstrations of the latest products and solutions, concentrated to a world-wide audience of hybrid manufacturers. It is not only the perfect opportunity for attendees to learn more about and see Palomar Technologies’ products in action, but it is also a perfect opportunity for attendees to learn more about SST International’s products including their Model 5100. Recently, Palomar Technologies acquired SST International as a partner in providing customers with total solutions. We look forward to sharing with attendees how our systems complement one another, as well as demonstrating our existing products live.

About SST International
SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment. For more information, visit www.sstinternational.com.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information:

8000i Data Sheet 9000 Wedge Bonder SST Model 5100
 8000i wire bonder, ball bumper, i2Gi  9000 Wedge Bonder data sheet  Model 5100 acuum pressure furnace, SST Microelectronics

 

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EMEA Contact
Mr. Josef Schmidl
Managing Director
Palomar Technologies GmbH
jschmidl@palomartechnologies.de | +49 (9131) 48009-30

Media Contact
Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760.931.3680

Topics: Announcements, productronica

New Wire Bonder Demos at productronica 2013 – 8000i Wire Bonder with i2GiTM Technology

Posted by Katie Finney on Tue, Nov 05, 2013

Carlsbad, CA – November 5, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced live demonstrations of a new wire bonder at productronica 2013: the 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM). The 8000i Wire Bonder with i2Gi will be showcased in Hall B2 Booth 205 at the 20th international trade fair for innovative electronics production, held in Munich on November 12 - 15, 2013.

In an interview with the productronica 2013 team, Josef Schmidl, Palomar Technologies GmbH Managing Director, recognized that, “Palomar Technologies has exhibited at productronica for more than 30 years. It has become one of the most important exhibitions in Europe with regards to Palomar's evolving product portfolio.”

“productronica is the perfect platform for live demonstrations of the latest products and solutions, concentrated to a world-wide audience of hybrid manufacturers. productronica will be a milestone for Palomar Technologies—this is the first opportunity for attendees to see and to test drive new products,” Mr. Schmidl affirmed.

Intelligent Interactive Graphical Interface (i2Gi) on the new 8000i Wire Bonder
i2Gi (cleverly pronounced “iggy”) is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.

i2Gi technology supports advanced wire bond control through three key critical command tools, which work in concert to provide a dynamic and intuitive user experience.

  1. Part Tree Display defines relationships between part programming objects: parts, wires, pads

  2. Part Graphical Display provides geometric representation of the overall XY workspace and package elements

  3. Man-Machine Interface (MMI) + Video Graphical Display enables interaction with live video for teaching and locating parts combined with a graphical overlay representation of the program.

i2Gi, 8000i wire bonder, wire bond control software

The new 8000i Wire Bonder comes equipped with i2Gi technology. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

Read More About i2Gi
Integration von i2Gi™ in 8000 Ball Bonder (Integrating i2Gi™ onto an 8000 Wire Bonder)

Watch the i2Gi Video Demo

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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EMEA Contact
Mr. Josef Schmidl
Managing Director
Palomar Technologies GmbH
jschmidl@palomartechnologies.de | +49 (9131) 48009-30

Corporate Contact
Mrs. Jessica Sylvester
Manager, Marketing Communications
Palomar Technologies, Inc.
jsylvester@bonders.com | +1 760-931-3681

Topics: Announcements, 8000i Wire Bonder, i2Gi, Palomar Europe, productronica

Palomar Technologies gibt die Teilnahme an der Productronica 2011 bekannt und stellt Large Work Area Wire- u. Die Bonder vor

Posted by Palomar Technologies MarCom Team on Tue, Nov 08, 2011

Carlsbad, CA –  8 November 2011 – Palomar Technologies gibt heute ihre Teilnahme an der Productronica in München vom 15.-18.November 2011 bekannt.

Sie finden den weltweit führenden Hersteller für vollautomatische und hochpräzise Fertigungsanlagen (Wire- und Diebonder) in Halle B2, Stand 315.

Die Anlagen von Palomar kommen für die verschiedensten Anwendungen in der Hybrid- und Halbleiterindustrie zum Einsatz.

“Palomar Technologies hat eine jahrzehntelange Erfahrung und anerkannte Fachkompetenz in den Bereichen Entwicklung, Konstruktion, Automatisierung und Meßtechnik auch für schwierigste Applikationen in der Wire- und Bestückungstechnologie“, sagte Josef Schmidl, Geschäftsführer der Palomar Technologies GmbH. “Unsere Modelle 8000 Wire Bonder sowie  3800 Die Bonder repräsentieren heute den neuesten Stand in der Wire-/ Diebond Technik. Zu den einzigartigen Maschinenkonzepten mit seinen hervorragenden Meß- u. Regelsystem, ermöglichen benutzerfreundliche Softwarelösungen eine einfache Bedienung und sind auch in Bezug auf Durchsatz und Flexibilität konkurrenzlos.”

Das Modell 8000 Wire Bonder, bietet enorme Einsatzflexibilität wie z.B. Deep Access bis zu 19.05mm Bondtiefe, Verwendung von In-Line Magazinsystemen, Erzeugung absolut flacher Stud Bumps (kein Tail), Stand-off-Stitch wires (Plazierung eines Bumps vor dem Draht) und vieles mehr. Bei einer Bondgeschwindigkeit von bis zu 0.125s/ Draht (0.077s/ Bump) und einer Gesamtgenauigkeit von ±2.5µ, 3Sigma, erzielt der 8000 Ballbonder höchste Erträge und wird daher für die Verarbeitung hochkomplexer Hybride, MCM’s usw. eingestzt.

Das Model 3800 Die Bonder ist ein vollautomatisches, extrem flexibles Pick and Place System mit einer Plaziergenauigkeit von ±7µ und einer Wiederholgenauigkeit von 3.5µ, bei 3sigma.

Der Diebonder wurde kürzlich mit dem 2011 New Product Introduction Award für seine Leistungsfähigkeit und Einsatzflexibilität ausgezeichnet, da mit ihm auch Prozesse wie eutektisches AuSi/ AuSn Löten durchgeführt werden können.

Zurzeit läuft eine Umtausch-/ Rücknahme Aktion des bewährten Vorgängermodells 3500-III gegen den Kauf eines neuen Modells 3800 (Palomar Technologies’ Bonder Buy-Back Program).

Palomar Technologies

Palomar Technologies, ein früheres Tochterunternehmen von Hughes Aircraft, ist der weltweit führende Hersteller von vollautomatischen, hochpräzisen Large Area Die- u. Wirebonder sowie Anbieter von Dienstleistungen (Produkt-/ Prozessentwicklung, Fertigung) in diesen Bereichen.

Kunden setzen die Systeme und Dienstleistungen von Palomar Technologies ein um den heutigen komplexen Anforderungen in der Mikroelektronikfertigung gerecht zu werden.

Weitere Informationen finden Sie bitte auf der Website www.palomartechnologies.com.

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Kontakt Palomar Technologies GmbH (Europe)
Josef Schmidl
Managing Director, Palomar Technologies GmbH
jschmidl@palomartechnologies.de | 49-9131-48009-30                                      

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Carlsbad, CA – November 8, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit in Hall B2, Booth 315 at Productronica 2011, held in Munich, Germany on November 15-18.

“Palomar Technologies has a long-standing presence as an industry expert in design, engineering, automation and metrology for even the most complex component placement and wire bonding applications,” said Josef Schmidl, managing director of Palomar Technologies GmbH. “Our 8000 Wire Bonder and 3800 Die Bonder  represent the latest advances in wire- and die bonding technology, incorporating leading-edge mechanical design, control architecture and user-friendly GUI to provide the highest net throughput and flexibility of any comparable tool on the market today.”

The 8000 Wire Bonder offers tremendous versatility with capabilities including deep access wire bonding of 11.10 to 19.05mm, automated in-line and magazine handlers, tailless bump mode and improved reliability with stand-off stitch wires. With cycle times up to 0.125 sec/wire and 0.077 sec/bump, and a placement accuracy of +/- 2.5 micron, 3 sigma, the overall precision of the 8000 Wire Bonder results in high-yield processing of fine-pitch high wire count applications and is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

The 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction Award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Current owners of 3500-III Die Bonders have the opportunity to trade in their system for substantial credit towards the 3800 Die Bonder through Palomar Technologies’ Bonder Buy-Back Program.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Topics: 3800 die bonder, trade shows, bonder buying options, 8000 wire bonder, productronica, Bonder Buy Back Program, AuSn

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