SEMICON Taiwan 2014 Highlights Advanced Packaging Technology

Posted by Katie Finney on Wed, Sep 03, 2014

Carlsbad, CA – September 2, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its participation at SEMICON Taiwan 2014, held in Taipei on September 3-5 at the TWTC Nangang Exhibition Hall.

SEMICON Taiwan is the largest and most influential microelectronics exhibition in Taiwan. Driven by Taiwan's investment in commercial and consumer electronics, the broad microelectronics industry—led by semiconductors, LEDs, MEMS, and displays—has seen continued growth. SEMICON Taiwan continues to be held at the new state-of-the-art venue that provides world-class facilities and more room to engage an audience of more than 30,000 professional attendees.

stackeddie

This year, SEMICON Taiwan will be offering Technology Programs such as an Advanced Packaging Technology Symposium, IC Design Summit, and MEMS Forum. The Advanced Packaging Technology Symposium will be “aimed at discussing key strategies for the innovative advanced package solutions as well as the core technologies to fulfill future product requirements in the Mobile Era. In this seminar, presenters will cover from marketing trends to product applications, from various packaging/assembly solutions (wire bond/flip chip/hybrid) to advanced equipment and material development, from testing and reliability to pinpoint the technology readiness. With all experts involved, [the] audience can well understand the whole picture of supply chain and keep the pace with [the] most advanced technology development direction.” 

The output value of Taiwan's integrated circuit (IC) packaging and testing sector could rise more than 5 percent in the third quarter from a quarter earlier because of peak season effects, according to a government research report. Taiwan IC packaging and testing output may rise over 5% in Q3. The third quarter output value of the domestic IC testing sector is forecasted to rise 5.3 percent from a quarter earlier.

With the opening of its demonstration and applications development office located in Singapore, the Palomar Asia facility builds upon the established base of customer support, evolving into a “one-stop shop” to offer full-capacity support. For example, the facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: 
http://www.palomartechnologies.com/contact-palomar-technologies-asia

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Palomar Asia Contact
Mr. PH Chan
Managing Director
phchan@bonders.com
(+65) 6686-3096

Palomar Technologies Media Contact
Mrs. Claudia Haskin
Marketing Communications Manager
chaskin@bonders.com
+1 (760) 931-3681

Tags: Palomar Asia, MEMS packaging, IC packaging, SEMICON Taiwan 2014

Automated Wire Bonding Production System Demonstrations at SEMICON China 2014

Posted by Katie Finney on Mon, Mar 17, 2014

Carlsbad, CA – March 17, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today the live demonstration of the 8000i Wire Bonder at SEMICON China 2014. SEMICON China is celebrating its 26th year, held this year at the Shanghai New International Expo Center on March 18-20.

Palomar Technologies' new 8000i Wire Bonder comes equipped with i2Gi® technology. The8000i wire bonder 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

Intelligent Interactive Graphical Interface (i2Gi) on the new 8000i Wire Bonder
i2Gi (cleverly pronounced “iggy”) is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.

8000i Data Sheet

8000i wire bonder, ball bumper, i2Gi 

i2Gi Data Sheet

i2Gi, intelligent interactive graphical interface, modern wire bond control software 

i2Gi supports modern automated wire bonding for complex hybrid production. Watch the video:

An 8000i Wire Bonder will be available for live demonstrations throughout the duration of SEMICON China in the Asia Science & Technology (AST) booth #3287 with supplemental information about our 3800 Die Bonder available also in the BE FIRST booth #3703. Mr. PH Chan, Palomar Technologies Asia managing director, will be onsite at the show to discuss automated wire bonding, die attach and full factory automation requirements. The Palomar Asia office may also be contacted online: http://www.palomartechnologies.com/contact-palomar-technologies-asia/.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly, and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Janine Hueners
Marketing Communications, Palomar Technologies
jhueners@bonders.com | +1 760-931-3680

Tags: 3800 die bonder, Announcements, Palomar Asia, 8000i Wire Bonder, i2Gi, SEMICON China

Upcoming Microelectronic Packaging Courses to be Held in Singapore

Posted by Katie Finney on Tue, Feb 04, 2014

CARLSBAD, CA – February 4, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced microelectronic packaging training courses to be presented by TJ Green Associates at the Palomar Technologies (SE Asia) Pte Ltd. facility in Singapore on February 24-28.

TJ Green Associates LLC is once again proud to present an entire week of public courses as part of the 2014 Singapore training event. Based on their success from last year, TJ Green Associates LLC will again conduct professional state of the art training classes focused on microelectronics packaging in Singapore. Train with TJ Green LLC during the day, and enjoy Singapore skylinethe beautiful city of Singapore at night. The Singapore Course Outlines & Registration Form can be found here.

The course offerings include:

Process Certification For Hybrids, Microcircuits and RF Microwave Modules
Monday Feb 24 - Wednesday Feb 26, 2014

This process certification training is a must for quality, process, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of the materials and processes used to assemble Hybrids, Microcircuits and RF Microwave Modules for high reliability Military and aerospace applications. Trained instructors with years of industry experience deliver the material in a straight-forward and easy to understand format. This fast-paced condensed 3 day course emphasizes the inspection criteria along die bond, wire bond, hermetic seal and testing and associated good manufacturing practices.

Wire Bonding Theory & DOE (Design of Experiments)
Thursday Feb 27, 2014
This is an intense one day course that covers the theory and practical aspects of forming a wire bond interconnect. Special emphasis is placed on the materials, processes and statisticalwire bond interconnect, wire bond, Tom Green microelectronics training courses methods used to optimize process yields. The necessary steps to properly conduct a controlled DOE to optimize the wire bond parameter settings along with actual DOE case studies will be reviewed and discussed in detail as the instructor shares his personal experience with performing wire bond DOEs in a classroom setting.

Pre Cap Visual Inspection Per Mil-Std-883
Friday Feb 28, 2014
Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree ofIC chip, Tom Green microelectronics packaging courses, wire bond interconnect, wire bond skill and understanding of what to look for and reject as part of the inspection process. This course defines the inspection criteria based on traditional Mil Spec requirements in conjunction with industry accepted best commercial practices.

About TJ Green Associates
TJ Green Associates LLC  provides teaching and consulting services to companies around the world with expertise in hermeticity, materials and processes used to assemble hybrids, microcircuits, multichip modules, RF/MMIC microwave modules, MEMS, Class III medical implants, optoelectronics, and other types of packaged microcircuits.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly, and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Janine Hueners
Marketing Specialist
Palomar Technologies, Inc.
jhueners@bonders.com | +1 760-931-3680

Tags: Announcements, wire bonding, Palomar Asia, training

New Palomar Asia Facility for Demonstrations, Support & Training

Posted by Rich Hueners on Tue, Aug 06, 2013

Carlsbad, CA – August 6, 2013 –Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the opening of its new demonstration and applications development office, located in Singapore, effective immediately.

Palomar Technologies opening Ribbon Cutting Palomar Technologies Asia Singapore office reveals company logo

Palomar Technologies (SE Asia) Pte Ltd., (“Palomar Asia”) has been headquartered in Singapore since its establishment in August 2000—five years after Palomar Technologies, Inc., evolved as a former subsidiary of the Hughes Aircraft’s Industrial Product Division. Since the initial opening of Palomar Asia, the office has generated substantial business growth year-after-year and quickly became recognized for its superior support of Asia-Pacific customers requiring automated wire bond and die attach equipment.

The new Palomar Asia facility builds upon the established base of customer support, evolving into a “one-stop shop”  to offer full-capacity support. For example, the new facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.

Process Development Services data sheet

 

The automated microelectronics manufacturing requirements for the APAC region spans markets from aerospace/defense, optoelectronic, LED, RF/Wireless and medical for high-accuracy die attach and high-reliability wire bonding. Even amidst recent world-wide economic strain, the APAC region has rapidly grown for Palomar Asia—for both personnel and customer installed base. Palomar Technologies’ most popular large work area die attach platform—the ultra-flexible 3800 Die Bonder— and the “workhorse” Au wire/ball bump, deep access platform—the 8000 Wire Bonder—have continually exceeded customer expectations for quality, accuracy and process expertise support.

At SEMICON West 2013 in San Francisco, CA, Palomar Technologies launched the new 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM). Cleverly pronounced “iggy”, i2Gi is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bondersi2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation. 

Click here to read the launch press release for the 8000i Wire Bonder with i2Gi.

To meet the needs of its expanding installed base, Palomar Asia has tripled its workforce, mostly in the ranks of direct field service engineers. “Having direct field service engineers in every region with Palomar Technologies equipment has been key to our success,” affirms PH Chan, Palomar Asia Managing Director. “By offering expert hardware, process and application support directly to our customers, we are able to quickly resolve the most complex microelectronic assembly challenges at our customer’s sites.”

Since his arrival at Palomar Asia in 2010, Mr. Chan has developed and expanded a local APAC Spare Parts Depot, increased the number of APAC sales representatives and accelerated the regional marketing presence in Asia’s largest industry tradeshows.

August 2013 marks the beginning of a new era for Palomar Asia. The new Palomar Asia facility offers a new clean room and demonstration laboratory, outfitted with wire bonding and die attach capabilities, as well as measurement and test equipment.

The 8000i Wire Bonder was showcased at the Palomar Asia office grand opening event, held on Friday, August 2. The event hosted customers, suppliers and friends of Palomar Asia and included opening ceremonies such as traditional Chinese lion dance and pineapple roll for good luck.

Palomar Technologies Singapore microelectronics manufacturing center new Palomar Technologies Asia Singapore office opens with traditional Chinese prosperity ceremonies

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: http://www.palomartechnologies.com/contact-palomar-technologies-asia

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Palomar Asia Contact
Mr. PH Chan
Managing Director
phchan@bonders.com
(+65) 6686-3096

Palomar Technologies Media Contact
Mrs. Jessica Sylvester
Marketing Communications Manager
jsylvester@bonders.com
+1 (760) 931-3681

Tags: 3800 die bonder, Announcements, assembly and packaging, Palomar Asia, demonstrations, training, Assembly Services, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU)

New Demonstration Center & Expanded Spare Parts Depot to Further Support Palomar Technologies Die Bonder & Wire Bonder Customers in Asia-Pacific Region

Posted by Rich Hueners on Tue, May 29, 2012

Carlsbad, CA – May 29, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the successful expansion of the company’s Singapore-based demonstration center and spare parts depot to better support its growing Asia-Pacific customer base.

With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, Palomar Technologies has successfully expanded the Palomar Asia Spare Parts Depot and regional customer services infrastructure. Mr. PH Chan, director of Palomar Technologies Asia, recently confirmed the Palomar Asia Spare Parts Depot will be able to meet requests for overnight spare parts delivery to regional APAC customers.

In addition to the expanded Palomar Asia Spare Parts Depot, Chan has also led the development of a Singapore-based demonstration laboratory in order to support increasing demand for in-person 8000 Wire Bonder and 3800 Die Bonder demonstrations with APAC customers. Providing customer-focused private bonder demonstrations has always been part of Palomar Technologies’ niche identity. This unique one-on-one service is now available regionally to APAC companies.

UltraCleanTechnology Singapore WireBonderDieBonderDemonstrations

“In 2010, Palomar Technologies launched the 3800 Die Bonder, designed for fully automatic, precision microelectronics assembly and die attach processes,” states Chan. “The 3800 continues to be a success with our customers worldwide; however, the greatest need for the 3800 Die Bonder has proven to be within the emerging markets in Asia. The 3800 Die Bonder utilizes a large work area and various presentation tools for epoxy dispense and steady state and pulsed heat eutectic die attach—proving to be the most versatile, high-accuracy die bonder in the market for advanced microelectronics assemblies and complex hybrids.”

The new Palomar Asia demonstration laboratory is outfitted with applications and process development capabilities for both wire bond and die attach. Expert Palomar Technologies Field Service Engineers and Technical Liaisons will continue to lead demonstrations.

Palomar Technologies Asia is accepting appointments for on-site wire bonder or die attach demonstrations. Schedule a demonstration appointment by contacting Palomar Technologies Asia at (+65) 6779-2766 or online at http://www.palomartechnologies.com/contact-palomar-technologies-asia.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, capturing more value, capital equipment, Palomar Asia, demonstrations, training, 8000 wire bonder, Bonder Boot Camp