Palomar Technologies 3800 Die Bonder Offers Flexible Solutions to Support LED Development in China

Posted by Rich Hueners on Tue, Mar 13, 2012

Carlsbad, CA – March 13, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit with Asia Science and Technology (AST) at SEMICON China 2012, held in Shanghai on March 20-22.

Palomar Technologies, Hybond and AST will exhibit together in booth #3153 in Hall E3. A Palomar 3800 Die Bonder and manual Hybond equipment will be on-site for demonstrations.

Mr. PH Chan, Palomar Technologies Asia Director, recently wrote a blog summarizing the LED markets in Asia, specifically recounting how LEDs relate to China’s 12th five-year plan.

“By 2015, China intends its manufacturing standards to be globally viable for the volume production market. By that time, China’s LED industry is estimated to reach $75 billion,” stated Mr. Chan. “The 3800 Die Bonder is capable of ultra-high precision and high-reliability eutectic and epoxy die attach processes. This robust system is in production with several major players in the Asia-based LED market today. The 3800 Die Bonder embodies great versatility to accommodate multiple processes on a single 710in2 work envelope as well as tremendous flexibility to remain vigilant for the future of component packaging.”

Mr. Chan will be attending SEMICON China and is available during the conference for any on-site meetings.

In addition to the ultra-flexible 3800 Die Bonder, Palomar Technologies offers several complementing bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the 8000 Wire Bonder is a large area, high-reliability wire bonder and ball bumper with deep access capabilities. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, wire bonder, wire bonds, wire bonding, LED matrix assembly, LED applications, wire bonders, capital equipment, LED packaging, wafer scale packaging, automated component placement systems, automated packaging systems, Hybond, 8000 wire bonder, 6500 die bonder, automation vs. manual, field services support, Bonder Boot Camp, made in china, SEMICON China, wire bond testing

Palomar Technologies To Exhibit at Electronic Components and Technology Conference and Discusses HB LED Assembly in Free On-Demand Webcast

Posted by Rich Hueners on Tue, May 24, 2011

Carlsbad, CA – May 24, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at the 2011 Electronic Components and Technology Conference (ECTC) in Orlando, FL, May 31 – June 3.

Palomar Technologies is offering complimentary passes to ECTC 2011. Dale Perry, regional sales manager for the Eastern Americas, will be at booth #419 to discuss the latest features and advancements in high-accuracy die attach and high-precision wire bond and ball bump processes. Palomar Technologies’ 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Visit with Mr. Perry to learn more about the 3800 Die Bonder and its microelectronic packaging capabilities.

Assembly Services (a division of Palomar Technologies) has developed an efficient process flow in HB LED application production. Julie Adams, director of worldwide sales for Assembly Services, will be on-site at ECTC 2011 to engage in discussions regarding precision microelectronic contract assembly solutions. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast “Automated Precision Assembly for High-Volume HB LED.” Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, LED applications, eutectic die attach, eutectic soldering process, LED packaging, eutectic process, die bonder, HB LED, eutectic, AuSn, gold tin die attach, NPI Awards, ECTC

Palomar Technologies Performs Live Demonstrations of 3800 Die Bonder and 8000 Wire Bonder at SMT Hybrid Packaging 2011 and Hosts Free On-Demand HB LED Webcast

Posted by Rich Hueners on Mon, Apr 25, 2011

Carlsbad, CA – April 25, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will perform live demonstrations of the 3800 Die Bonder and 8000 Wire Bonder systems at SMT Hybrid Packaging 2011 in Nuremberg, Germany, on May 3-5.

Palomar Technologies will be showcasing the application capabilities of the high-accuracy 8000 Wire Bonder and the ultra-flexible 3800 Die Bonder— a recent winner of the 2011 New Product Introduction Awards announced on April 12, 2011. Palomar Technologies will be exhibiting in the Optoelectronic Booth, #6-115D (hall #6).

Julie Adams, director of worldwide sales for Assembly Services (a division of Palomar Technologies), will be on-site at the conference to engage in discussions regarding precision microelectronic contract assembly solutions.

"Assembly Services offers a practical and reliable solution for companies in need of contract assembly, process development and application prototyping,” states Julie Adams. “We offer unique solutions such as 2-micron component placement accuracy supported by best-in-class die attach and wire bond equipment along with in-house application engineering experts to tackle your most challenging microelectronic packaging needs—a company that can prepare your organization and products for volume manufacturing, all while abiding by strict customer confidentiality and maintaining IP.”

Assembly Services has developed an efficient process flow in HB LED application production. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast “Automated Precision Assembly for High-Volume HB LED.” Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, ball bonder, LED applications, die bonders, LED packaging, Contract Assembly, ball bumping, contract assembly in microelectronics, 8000 wire bonder, HB LED, complex LED modules, wire bond demo, SMT, ball bump, NPI Awards

Palomar Technologies Highlights Improved High Volume HB LED Assembly at Strategies in Light Conference

Posted by Rich Hueners on Thu, Feb 10, 2011

Carlsbad, CA – February 10, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its involvement in the Strategies in Light conference, held February 22-24 in Santa Clara, CA.

Assembly Services is the contract assembly division of Palomar Technologies. Assembly Services enables organizations around the globe to achieve balance between speed and reliability in precision assembly of high-volume HB LED packaging without investing in capital equipment,” stated Assembly Services general manager, Donald Beck. “We are looking forward to showcasing our HB LED assembly services as an exhibitor at the upcoming Strategies in Light conference later this month.”

Worldwide account manager for Assembly Services, Steve Buerki, will be on site at the Strategies in Light conference at booth #238. To ensure an in-person meeting with Mr. Buerki, download a free admission pass to the Strategies in Light exhibitors’ show floor.

Assembly Services provides prototyping, test, measurement and production for high accuracy and complex wire and die attach applications. To meet increasing customer demand, additional clean room space was recently added in the California-based laboratory, increasing production capacity by 50%. Assembly Services expertise includes development and production for applications such as HB LEDs, RF power modules, military hybrids and laser diode packages.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: LED applications, capital equipment, LED packaging, Contract Assembly, contract assembly in microelectronics, HB LED, Strategies in Light, low cost high volume production