Palomar Technologies 3800 Die Bonder Offers Flexible Solutions to Support LED Development in China

Posted by Rich Hueners on Mon, Mar 12, 2012

Carlsbad, CA – March 13, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit with Asia Science and Technology (AST) at SEMICON China 2012, held in Shanghai on March 20-22.

Palomar Technologies, Hybond and AST will exhibit together in booth #3153 in Hall E3. A Palomar 3800 Die Bonder and manual Hybond equipment will be on-site for demonstrations.

Mr. PH Chan, Palomar Technologies Asia Director, recently wrote a blog summarizing the LED markets in Asia, specifically recounting how LEDs relate to China’s 12th five-year plan.

“By 2015, China intends its manufacturing standards to be globally viable for the volume production market. By that time, China’s LED industry is estimated to reach $75 billion,” stated Mr. Chan. “The 3800 Die Bonder is capable of ultra-high precision and high-reliability eutectic and epoxy die attach processes. This robust system is in production with several major players in the Asia-based LED market today. The 3800 Die Bonder embodies great versatility to accommodate multiple processes on a single 710in2 work envelope as well as tremendous flexibility to remain vigilant for the future of component packaging.”

Mr. Chan will be attending SEMICON China and is available during the conference for any on-site meetings.

In addition to the ultra-flexible 3800 Die Bonder, Palomar Technologies offers several complementing bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the 8000 Wire Bonder is a large area, high-reliability wire bonder and ball bumper with deep access capabilities. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, wire bonder, wire bonds, wire bonding, LED matrix assembly, LED applications, wire bonders, capital equipment, LED packaging, wafer scale packaging, automated component placement systems, automated packaging systems, Hybond, 8000 wire bonder, 6500 die bonder, automation vs. manual, field services support, Bonder Boot Camp, made in china, SEMICON China, wire bond testing

Palomar Technologies Discusses Pulsed Heat Eutectic Solder and Chain Wire Bonding for HB LEDs at IMAPS 2011

Posted by Rich Hueners on Tue, Oct 04, 2011

Carlsbad, CA – October 4, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at IMAPS 2011 in Long Beach, California on October 11-13, in booth #231.

Palomar Technologies is presenting two HB LED technical papers in the Advanced Technologies Track at IMAPS 2011. Palomar Assembly ServicesTM general manager, Donald Beck, has co-authored “High-Yield Process Improvements for High-Reliability HB-LED Automated Assembly” and “Evaluation of AuSn Eutectic Die Attach Materials Designed for High-Brightness LED Packaging.” Beck will be on-site at IMAPS to discuss recent advancements in the LED industry.

“Today’s HB LED applications require maximum thermal transfer to achieve performance results. Precision eutectic soldering provides high-quality, low-risk performance,” stated Beck. “Reaching performance and cost targets requires continuous improvements in LED devices and packaging designs. Close LED proximity is one of several paths that help to extract every possible lumen per watt. This is best achieved using a pulsed heat eutectic die attach and chain wire bonding.”

Palomar Technologies offers a Pulsed Heat System (PHS), designed especially for the ultra-flexible 3800 Die Bonder. The PHS allows for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. Computer-controlled software provides a highly regulated temperature profile and data feedback throughout the process.

Chain bonding has become a reliable and cost-effective alternative to wedge bonding. Using ball bond technology on the high-reliability 8000 Wire Bonder, chain bonding follows a ball-loop-stitch-loop-stitch process, producing “chains” of loop shapes traditionally generated by a wedge bonder. Wedge emulation with a ball bonder using chain bonding can be an excellent alternative to using a wedge bonder to perform interconnects. To learn more, download "The Great Debate: Ball vs. Wedge" technical paper.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, LED matrix assembly, trade shows, 8000 wire bonder, IMAPS, HB LED, AuSn, hi-rel wire bonds