Palomar Technologies to Present and Exhibit at IMAPS 2016

Posted by Katie Finney on Tue, Oct 04, 2016

Carlsbad, CA – October 4, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be presenting a technical paper and exhibiting at the IMAPS 49th International Symposium on Microelectronics in Pasadena, CA being held on October 10-13, 2016 in booth #702.

Palomar Technologies’ Chief Technical Officer, Dan Evans, will present the paper “Wedge Bonding Wire and Ribbon to Support RF and Optoelectronic Packaging” on Thursday, October 13th at 10:30am. This paper will provide a survey of RF and optoelectronic packages, and the common wire and ribbon bond requirements. It will also survey the packaging challenges and solutions available to process engineers. Collaborations between manufacturer and equipment supplier with helpful tips leveraging each other’s strengths to transition from concept to production will also be discussed.

In addition, SST Vacuum Reflow Systems, as part of Palomar Technologies total solutions for eutectic die bonding and advanced packaging systems, will present their technical paper “Achieving Low Voiding with Lead Free Solder Paste for Power Devices”, and will be performing live demos of their 5100 Vacuum Pressure Furnace. SST’s Process Development Engineer, Pierino Zappella, will present this paper on Thursday, October 13th at 1:00pm. The processes discussed in this session will show how low void levels can be achieved while using solder paste on different materials in a vacuum reflow oven.

Don’t forget to also stop by booth 702 during the Palomar Technologies sponsored Dessert Happy Hour and during the exhibition to learn more about Palomar Technologies and SST Vacuum Reflow Systems.

IMAPS_Pasadena_2016.jpg

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

Tags: Announcements, trade shows, IMAPS, IMAPS 2016

Palomar Technologies Exhibits at the IMAPS 48th Annual Symposium on Microelectronics

Posted by Katie Finney on Tue, Oct 27, 2015

Carlsbad, CA – October 27, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will be exhibiting at the IMAPS 48th International Symposium on Microelectronics. Visit us at booth #511 on October 27-29 at the Rosen Center Hotel in Orlando, Florida to learn more about our products, including the NEW 3880 Die Bonder.

The 3880 Die Bonder is an ultra-versatile, ultra-flexible die bonder with an all new Z-theta bidirectional bond head with voice coil technology. The 3880 can solve various applications challenges: MEMS, HB/HP LED assembly, RF power amplifiers, and microwave modules. Read more about the 3880 and view more applications examples here.

3880 Die Bonder

Technical Programs
In addition to the exhibits, the symposium will feature exciting keynotes, industry panels, and technical speakers on “The Future of Packaging”. This forum is the largest exchange of technical information and industry leaders, encompassing 3 days, 30 sessions, 5 keynote speakers and 160+ speakers on microelectronics, assembly, interconnect, and packaging. Our own Chief Technical Officer, Dan Evanswill be presenting on copper wire refinements and alternatives at a technical session on Wednesday. For more information on the conference and the other technical sessions being offered, go to www.imaps2015.org

Also, don’t forget to grab a delicious treat during the Dessert “Happy Hour”, sponsored by Palomar Technologies, Tuesday from 3:15-4:15pm. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: Announcements, IMAPS, microelectronics

Palomar Technologies Exhibits “The Future of Packaging” at IMAPS 2014

Posted by Katie Finney on Tue, Oct 07, 2014

Carlsbad, CA – October 7, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced product demos at the IMAPS 47th International Symposium on Microelectronics. The 8000i Wire Bonder with Intelligent Interactive Graphical Interface® (i2Gi®) will be showcased through live demonstrations in booth #221 on October 14-15 at the Town and Country Resort & Convention Center in San Diego, CA.

The 8000i Wire Bonder comes equipped with i2Gi technology. It is a fully automated thermosonic high-8000i-Ergo_Technician-smallspeed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. It is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

Professional Development Courses and Technical Program
In addition to the exhibits, the symposium will feature exciting keynotes, industry panels, and technical speakers on “The Future of Packaging”. This forum is the largest exchange of technical information and industry leaders, encompassing 3 days, 28 sessions and 190 speakers on microelectronics, assembly, interconnect and packaging. Some of the Professional Development Courses that are being offered include: Introduction to Microelectronics Packaging, Wire Bonding, MEMS and nanoMEMS Devices and Applications, and Packaging and Testing of Implanted Medical Devices (just to mention a few). For more information on the PDCs being offered or the symposium itself, go to www.imaps2014.org.

dessert-sponsor3-IMAPS2013

Also, don’t forget to grab a delicious treat during the Dessert “Happy Hour” Tuesday from 3:25-4:30pm that is sponsored by Palomar Technologies!

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Claudia Salerno
Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681

Tags: Announcements, 8000i Wire Bonder, i2Gi, IMAPS

High-Accuracy Processes for RF, Optoelectronics & Automotive Microelectronics Assembly

Posted by Rich Hueners on Thu, Sep 06, 2012

Carlsbad, CA – September 6, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that lead engineers will be presenting three highly technical talks at the IMAPS 2012 conference, held September 11-13 at the San Diego Town & Country Convention Center. Palomar Technologies will exhibit in booth #322.

1. High-Reliability Component Attachment Process for <5μm Placement Accuracy
Speaker: Donald J. Beck

2. Mixed Attachment Technology Studies in RF & Optoelectronic Packages Requiring High-Accuracy Placement

Speaker: Daniel D. Evans, Jr.

3. Gold Ball Wire Bonding with Heated Tool for Automotive Microelectronics
Speaker: David J Rasmussen

The complete IMAPS session agenda is available online at http://www.imaps.org/programs/IMAPS2012.pdf.

Palomar Technologies has also collaborated with IMAPS to host an on-demand webcast on "High-Reliability Component Attachment Process for <5um Placement Accuracy". Palomar Technologies Assembly Services general manager originally presented the webcast live in mid-June. The complimentary webcast recording is available at http://www.imaps.org/webcasts/2012may_palomar.htm

Palomar Technologies is accepting meeting requests throughout the duration of IMAPS 2012. Requests may be submitted online at http://www.palomartechnologies.com/contact-us.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: RF Packaging, gold ball bumping, optoelectronic packaging, gold ball bonder, eutectic soldering process, automated component placement systems, automated packaging systems, assembly and packaging, IMAPS, eutectic diagrams, eutectic tutorial, optoelectronic, RF devices

Palomar Technologies Presents Sub-5um Die Attach Placement Accuracy Webcast

Posted by Rich Hueners on Tue, Jun 12, 2012

Carlsbad, CA – June 12, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that the company can support high-precision die attach to less than 5µm placement accuracies.

“As the trend to build smaller electronics pushes the limits of semiconductor packaging abilities, the need for high-accuracy and high-precision component placement often presents a challenge in itself,” stated Donald Beck, Palomar Technologies Assembly ServicesTM General Manager. “We are able to support [application dependent] requirements for ultra-high placement accuracies on our eutectic/epoxy 3800 Die Bonder and 6500 Die Bonder systems.”

The ultra flexible 3800 Die Bonder is designed for fully automatic, precision microelectronics assembly. The tightly regulated,computer-controlled work cell can perform up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. The 3800 Die Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions.

The 6500 Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless and medical applications. This eutectic die bonder is designed for fully automatic precision component assembly—even up to 1.5µm placement accuracy (application dependent)—making component assembly practical and cost effective. Wafer Scale Packaging (WSP) eutectic die attach on the 6500 Die Bonder provides customers with a complete microelectronic solution for P-side down laser diode attachment (die-to-wafer), a pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, a wafer stage with steady state heating, and waffle or gel pack presentation of laser diode applications.

Mr. Beck is presenting a 30-minute live webcast on June 13 at 12:00pm Eastern Time, discussing new developments for ultra high-precision component packaging: “<5micron Placement Accuracy" target="_self">High-Reliability Component Attachment Process for <5micron Placement Accuracy ".

The webcast will cover a process solution for <5µm component attach" target="_self">automating <5µm component attach specific to organizations requiring high-reliability device packaging. In this webinar, Mr. Beck will cover methods that have been proven through real-world experiences related to the high-reliability microelectronics industry. Joining Mr. Beck will be Mr. Zeger Bok (Sr. Application Engineer) and Mr. Daniel Martinez (Assembly Services Lab Manager & Manufacturing Engineer) for live Q&A after the formal presentation.

Register now for the live webcast, presented on June 13 at Noon Eastern Time. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, Announcements, device design, die bonders, eutectic die attach, eutectic soldering process, die bonding, gold tin eutectic die attach, 6500 die bonder, eutectic process, die bonder, IMAPS, eutectic, eutectic tutorial, gold tin die attach, placement accuracy of microelectronic components

Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs

Posted by Rich Hueners on Wed, Feb 01, 2012

Carlsbad, CA – February 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced a precision eutectic process development for direct attach light emitting diodes (LEDs).

“Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs,” explains Donald Beck, General Manager of Palomar Technologies Assembly ServicesTM. “Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. Palomar Technologies’ Pulsed Heat System is a major contributor to this development, allowing our precision die attach systems to control LED exposure much more effectively than most other processes. The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management.”

Palomar Technologies is exhibiting at the LED-focused show, Strategies in Light 2012, in booth #709 on February 7-9 in Santa Clara, CA. Julie Adams, Director of WW Assembly Services Sales will be on site to assist in discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding.

Also on February 7-9, Palomar Technologies is exhibiting as a premier sponsor at IMAPS RF 2012 in booth #RF01, held in San Diego, CA. Bradley Benton, Western Americas Sales Manager, will be presenting an overview of Palomar Technologies’ solutions and advanced RF automated packaging processes on February 8 at 1:00pm, local conference time.

Contact Palomar Technologies to arrange an on-site meeting at either Strategies in Light 2012 or IMAPS RF 2012.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: device design, LED applications, eutectic die attach, eutectic soldering process, Contract Assembly, Complex Packaging, contract assembly in microelectronics, assembly and packaging, eutectic process, IMAPS, HB LED, complex LED modules, eutectic, Strategies in Light

Palomar Technologies Discusses Pulsed Heat Eutectic Solder and Chain Wire Bonding for HB LEDs at IMAPS 2011

Posted by Rich Hueners on Tue, Oct 04, 2011

Carlsbad, CA – October 4, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at IMAPS 2011 in Long Beach, California on October 11-13, in booth #231.

Palomar Technologies is presenting two HB LED technical papers in the Advanced Technologies Track at IMAPS 2011. Palomar Assembly ServicesTM general manager, Donald Beck, has co-authored “High-Yield Process Improvements for High-Reliability HB-LED Automated Assembly” and “Evaluation of AuSn Eutectic Die Attach Materials Designed for High-Brightness LED Packaging.” Beck will be on-site at IMAPS to discuss recent advancements in the LED industry.

“Today’s HB LED applications require maximum thermal transfer to achieve performance results. Precision eutectic soldering provides high-quality, low-risk performance,” stated Beck. “Reaching performance and cost targets requires continuous improvements in LED devices and packaging designs. Close LED proximity is one of several paths that help to extract every possible lumen per watt. This is best achieved using a pulsed heat eutectic die attach and chain wire bonding.”

Palomar Technologies offers a Pulsed Heat System (PHS), designed especially for the ultra-flexible 3800 Die Bonder. The PHS allows for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. Computer-controlled software provides a highly regulated temperature profile and data feedback throughout the process.

Chain bonding has become a reliable and cost-effective alternative to wedge bonding. Using ball bond technology on the high-reliability 8000 Wire Bonder, chain bonding follows a ball-loop-stitch-loop-stitch process, producing “chains” of loop shapes traditionally generated by a wedge bonder. Wedge emulation with a ball bonder using chain bonding can be an excellent alternative to using a wedge bonder to perform interconnects. To learn more, download "The Great Debate: Ball vs. Wedge" technical paper.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, LED matrix assembly, trade shows, 8000 wire bonder, IMAPS, HB LED, AuSn, hi-rel wire bonds