Palomar Technologies to Exhibit at 2015 Strategies in Light Exhibition and Conference

Posted by Katie Finney on Wed, Feb 25, 2015

Carlsbad, CA – February 24, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced that they will return to exhibit at the 2015 LED-focused show, Strategies in Light, this week February 24-26 held in Las Vegas.

HB/HP LED Assembly

One of the fastest growing technologies in the world is High-Bright/High-Power LEDs. Industrial and commercial lighting contribute largely in the HB LED market growth. Other end uses are found in aircraft lighting and powerful heaters in water purification systems. These LEDs are very efficient by a factor of ~60%. They are durable, long-lasting and, over time, cost reducing. The LED enables its user to essentially get more for less. HB LEDs can drive very high currents into the hundreds of mA; some HB LEDs can emit lumens in the thousands.

HBHP_LED_Assembly

HB LED tolerances are easily obtained with Palomar Technologies' machines to meet the package requirements of LEDs. Optimal thermal conductivity is achieved through the eutectic bonding process using the Palomar Technologies designed Pulsed Heat System stage.

Precise LED die attach applications can be manufactured using silver-filled conductive epoxy dispensing and daubing methods on a 3800 Die Bonder. Palomar Technologies has been working with advanced LED designs for over seven years, and was one of the first companies to process matrix LEDs – in modules containing anywhere from six to over 1,000 die.

LED

Strategies in Light

Strategies in Light is a business conference and exhibition that focuses on solid-state lighting (SSL), which includes both light-emitting diodes (LEDs) and organic light emitting diode (OLEDs) technologies. It is the longest-running and the largest conference in the HB LED industry, and the premier annual forum for presenting current commercial developments in high-brightness LED applications and providing unparalleled networking opportunities for component and equipment suppliers, manufacturers, and end-users of HB LED devices.

Bradley Benton, our Western Regional Sales Manager, will be on-site to lead discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding. Palomar Technologies will be located at booth number 1332. Contact Palomar Technologies or visit our booth to schedule an on-site meeting at the conference.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download the 3800 Die Bonder Data Sheet:

3800 Die Bonder Data Sheet

 

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Contact

Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

Tags: 3800 die bonder, HB LED, Strategies in Light, LEDs

Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs

Posted by Palomar Technologies MarCom Team on Wed, Feb 01, 2012

Carlsbad, CA – February 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced a precision eutectic process development for direct attach light emitting diodes (LEDs).

“Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs,” explains Donald Beck, General Manager of Palomar Technologies Assembly ServicesTM. “Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. Palomar Technologies’ Pulsed Heat System is a major contributor to this development, allowing our precision die attach systems to control LED exposure much more effectively than most other processes. The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management.”

Palomar Technologies is exhibiting at the LED-focused show, Strategies in Light 2012, in booth #709 on February 7-9 in Santa Clara, CA. Julie Adams, Director of WW Assembly Services Sales will be on site to assist in discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding.

Also on February 7-9, Palomar Technologies is exhibiting as a premier sponsor at IMAPS RF 2012 in booth #RF01, held in San Diego, CA. Bradley Benton, Western Americas Sales Manager, will be presenting an overview of Palomar Technologies’ solutions and advanced RF automated packaging processes on February 8 at 1:00pm, local conference time.

Contact Palomar Technologies to arrange an on-site meeting at either Strategies in Light 2012 or IMAPS RF 2012.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: device design, LED applications, eutectic die attach, eutectic soldering process, Contract Assembly, Complex Packaging, contract assembly in microelectronics, assembly and packaging, eutectic process, IMAPS, HB LED, complex LED modules, eutectic, Strategies in Light

Palomar Technologies Discusses Pulsed Heat Eutectic Solder and Chain Wire Bonding for HB LEDs at IMAPS 2011

Posted by Palomar Technologies MarCom Team on Tue, Oct 04, 2011

Carlsbad, CA – October 4, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at IMAPS 2011 in Long Beach, California on October 11-13, in booth #231.

Palomar Technologies is presenting two HB LED technical papers in the Advanced Technologies Track at IMAPS 2011. Palomar Assembly ServicesTM general manager, Donald Beck, has co-authored “High-Yield Process Improvements for High-Reliability HB-LED Automated Assembly” and “Evaluation of AuSn Eutectic Die Attach Materials Designed for High-Brightness LED Packaging.” Beck will be on-site at IMAPS to discuss recent advancements in the LED industry.

“Today’s HB LED applications require maximum thermal transfer to achieve performance results. Precision eutectic soldering provides high-quality, low-risk performance,” stated Beck. “Reaching performance and cost targets requires continuous improvements in LED devices and packaging designs. Close LED proximity is one of several paths that help to extract every possible lumen per watt. This is best achieved using a pulsed heat eutectic die attach and chain wire bonding.”

Palomar Technologies offers a Pulsed Heat System (PHS), designed especially for the ultra-flexible 3800 Die Bonder. The PHS allows for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. Computer-controlled software provides a highly regulated temperature profile and data feedback throughout the process.

Chain bonding has become a reliable and cost-effective alternative to wedge bonding. Using ball bond technology on the high-reliability 8000 Wire Bonder, chain bonding follows a ball-loop-stitch-loop-stitch process, producing “chains” of loop shapes traditionally generated by a wedge bonder. Wedge emulation with a ball bonder using chain bonding can be an excellent alternative to using a wedge bonder to perform interconnects. To learn more, download "The Great Debate: Ball vs. Wedge" technical paper.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, LED matrix assembly, trade shows, 8000 wire bonder, IMAPS, HB LED, AuSn, hi-rel wire bonds

Palomar Technologies To Exhibit at Electronic Components and Technology Conference and Discusses HB LED Assembly in Free On-Demand Webcast

Posted by Palomar Technologies MarCom Team on Tue, May 24, 2011

Carlsbad, CA – May 24, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at the 2011 Electronic Components and Technology Conference (ECTC) in Orlando, FL, May 31 – June 3.

Palomar Technologies is offering complimentary passes to ECTC 2011. Dale Perry, regional sales manager for the Eastern Americas, will be at booth #419 to discuss the latest features and advancements in high-accuracy die attach and high-precision wire bond and ball bump processes. Palomar Technologies’ 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Visit with Mr. Perry to learn more about the 3800 Die Bonder and its microelectronic packaging capabilities.

Assembly Services (a division of Palomar Technologies) has developed an efficient process flow in HB LED application production. Julie Adams, director of worldwide sales for Assembly Services, will be on-site at ECTC 2011 to engage in discussions regarding precision microelectronic contract assembly solutions. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast “Automated Precision Assembly for High-Volume HB LED.” Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, LED applications, eutectic die attach, eutectic soldering process, LED packaging, eutectic process, die bonder, HB LED, eutectic, AuSn, gold tin die attach, NPI Awards, ECTC

Palomar Technologies Performs Live Demonstrations of 3800 Die Bonder and 8000 Wire Bonder at SMT Hybrid Packaging 2011 and Hosts Free On-Demand HB LED Webcast

Posted by Palomar Technologies MarCom Team on Mon, Apr 25, 2011

Carlsbad, CA – April 25, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will perform live demonstrations of the 3800 Die Bonder and 8000 Wire Bonder systems at SMT Hybrid Packaging 2011 in Nuremberg, Germany, on May 3-5.

Palomar Technologies will be showcasing the application capabilities of the high-accuracy 8000 Wire Bonder and the ultra-flexible 3800 Die Bonder— a recent winner of the 2011 New Product Introduction Awards announced on April 12, 2011. Palomar Technologies will be exhibiting in the Optoelectronic Booth, #6-115D (hall #6).

Julie Adams, director of worldwide sales for Assembly Services (a division of Palomar Technologies), will be on-site at the conference to engage in discussions regarding precision microelectronic contract assembly solutions.

"Assembly Services offers a practical and reliable solution for companies in need of contract assembly, process development and application prototyping,” states Julie Adams. “We offer unique solutions such as 2-micron component placement accuracy supported by best-in-class die attach and wire bond equipment along with in-house application engineering experts to tackle your most challenging microelectronic packaging needs—a company that can prepare your organization and products for volume manufacturing, all while abiding by strict customer confidentiality and maintaining IP.”

Assembly Services has developed an efficient process flow in HB LED application production. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast “Automated Precision Assembly for High-Volume HB LED.” Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, ball bonder, LED applications, die bonders, LED packaging, Contract Assembly, ball bumping, contract assembly in microelectronics, 8000 wire bonder, HB LED, complex LED modules, wire bond demo, SMT, ball bump, NPI Awards

Palomar Technologies Highlights Improved High Volume HB LED Assembly at Strategies in Light Conference

Posted by Palomar Technologies MarCom Team on Thu, Feb 10, 2011

Carlsbad, CA – February 10, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its involvement in the Strategies in Light conference, held February 22-24 in Santa Clara, CA.

Assembly Services is the contract assembly division of Palomar Technologies. Assembly Services enables organizations around the globe to achieve balance between speed and reliability in precision assembly of high-volume HB LED packaging without investing in capital equipment,” stated Assembly Services general manager, Donald Beck. “We are looking forward to showcasing our HB LED assembly services as an exhibitor at the upcoming Strategies in Light conference later this month.”

Worldwide account manager for Assembly Services, Steve Buerki, will be on site at the Strategies in Light conference at booth #238. To ensure an in-person meeting with Mr. Buerki, download a free admission pass to the Strategies in Light exhibitors’ show floor.

Assembly Services provides prototyping, test, measurement and production for high accuracy and complex wire and die attach applications. To meet increasing customer demand, additional clean room space was recently added in the California-based laboratory, increasing production capacity by 50%. Assembly Services expertise includes development and production for applications such as HB LEDs, RF power modules, military hybrids and laser diode packages.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: LED applications, capital equipment, LED packaging, Contract Assembly, contract assembly in microelectronics, HB LED, Strategies in Light, low cost high volume production