Latest news in micoelectronics, optoelectronics, LED assembly and complex hybrid packaging from Palomar Technologies.

PTI Press Releases

Palomar Technologies Presents Sub-5um Die Attach Placement Accuracy Webcast

Posted by Palomar Technologies MarCom Team on Tue, Jun 12, 2012

Carlsbad, CA – June 12, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that the company can support high-precision die attach to less than 5µm placement accuracies.

“As the trend to build smaller electronics pushes the limits of semiconductor packaging abilities, the need for high-accuracy and high-precision component placement often presents a challenge in itself,” stated Donald Beck, Palomar Technologies Assembly ServicesTM General Manager. “We are able to support [application dependent] requirements for ultra-high placement accuracies on our eutectic/epoxy 3800 Die Bonder and 6500 Die Bonder systems.”

The ultra flexible 3800 Die Bonder is designed for fully automatic, precision microelectronics assembly. The tightly regulated,computer-controlled work cell can perform up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. The 3800 Die Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions.

The 6500 Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless and medical applications. This eutectic die bonder is designed for fully automatic precision component assembly—even up to 1.5µm placement accuracy (application dependent)—making component assembly practical and cost effective. Wafer Scale Packaging (WSP) eutectic die attach on the 6500 Die Bonder provides customers with a complete microelectronic solution for P-side down laser diode attachment (die-to-wafer), a pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, a wafer stage with steady state heating, and waffle or gel pack presentation of laser diode applications.

Mr. Beck is presenting a 30-minute live webcast on June 13 at 12:00pm Eastern Time, discussing new developments for ultra high-precision component packaging: “<5micron Placement Accuracy" target="_self">High-Reliability Component Attachment Process for <5micron Placement Accuracy ".

The webcast will cover a process solution for <5µm component attach" target="_self">automating <5µm component attach specific to organizations requiring high-reliability device packaging. In this webinar, Mr. Beck will cover methods that have been proven through real-world experiences related to the high-reliability microelectronics industry. Joining Mr. Beck will be Mr. Zeger Bok (Sr. Application Engineer) and Mr. Daniel Martinez (Assembly Services Lab Manager & Manufacturing Engineer) for live Q&A after the formal presentation.

Register now for the live webcast, presented on June 13 at Noon Eastern Time. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Topics: 3800 die bonder, Announcements, device design, die bonders, eutectic die attach, eutectic soldering process, die bonding, gold tin eutectic die attach, 6500 die bonder, eutectic process, die bonder, IMAPS, eutectic, eutectic tutorial, gold tin die attach, placement accuracy of microelectronic components

Palomar Technologies To Exhibit at Electronic Components and Technology Conference and Discusses HB LED Assembly in Free On-Demand Webcast

Posted by Palomar Technologies MarCom Team on Tue, May 24, 2011

Carlsbad, CA – May 24, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at the 2011 Electronic Components and Technology Conference (ECTC) in Orlando, FL, May 31 – June 3.

Palomar Technologies is offering complimentary passes to ECTC 2011. Dale Perry, regional sales manager for the Eastern Americas, will be at booth #419 to discuss the latest features and advancements in high-accuracy die attach and high-precision wire bond and ball bump processes. Palomar Technologies’ 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Visit with Mr. Perry to learn more about the 3800 Die Bonder and its microelectronic packaging capabilities.

Assembly Services (a division of Palomar Technologies) has developed an efficient process flow in HB LED application production. Julie Adams, director of worldwide sales for Assembly Services, will be on-site at ECTC 2011 to engage in discussions regarding precision microelectronic contract assembly solutions. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast “Automated Precision Assembly for High-Volume HB LED.” Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Topics: 3800 die bonder, LED applications, eutectic die attach, eutectic soldering process, LED packaging, eutectic process, die bonder, HB LED, eutectic, AuSn, gold tin die attach, NPI Awards, ECTC

Palomar Technologies To Exhibit at MEPTEC Thermal Symposium and Shares Article on AuSi/AuSn Eutectic Die Attach

Posted by Palomar Technologies MarCom Team on Fri, Mar 18, 2011

Carlsbad, CA – March 18, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at the Microelectronic Packaging and Test Engineering Council (MEPTEC) Thermal Symposium on March 21 in San Jose, CA.

Worldwide account manager for Assembly Services, Steve Buerki, will be on site at the MEPTEC Thermal Symposium at booth #16.

Assembly Services is the precision microelectronic contract packaging division of Palomar Technologies. Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is “AuSi and AuSn Eutectic Die Attach Case Studies,” discussing three case studies providing an overview of material selection and methods for optimized utilization of eutectic solders.

Case 1: AuSi (RFSOE) 16 x 63 x 4mil and 31 x 64 x 4mil

Case 2: AuSn (P-Side Down) 12 x 10 x 12mil with preform using pulsed heat top down

Case 3: AuSn (ASIC) 453 x 274 x 12mil with preform using pulsed heat bottom up

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Topics: eutectic die attach, eutectic soldering process, customized packaging solutions, eutectic process, AuSn, eutectic diagrams, eutectic tutorial, Application Process, MEPTEC, gold tin die attach

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