High-Accuracy Processes for RF, Optoelectronics & Automotive Microelectronics Assembly

Posted by Rich Hueners on Thu, Sep 06, 2012

Carlsbad, CA – September 6, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that lead engineers will be presenting three highly technical talks at the IMAPS 2012 conference, held September 11-13 at the San Diego Town & Country Convention Center. Palomar Technologies will exhibit in booth #322.

1. High-Reliability Component Attachment Process for <5μm Placement Accuracy
Speaker: Donald J. Beck

2. Mixed Attachment Technology Studies in RF & Optoelectronic Packages Requiring High-Accuracy Placement

Speaker: Daniel D. Evans, Jr.

3. Gold Ball Wire Bonding with Heated Tool for Automotive Microelectronics
Speaker: David J Rasmussen

The complete IMAPS session agenda is available online at http://www.imaps.org/programs/IMAPS2012.pdf.

Palomar Technologies has also collaborated with IMAPS to host an on-demand webcast on "High-Reliability Component Attachment Process for <5um Placement Accuracy". Palomar Technologies Assembly Services general manager originally presented the webcast live in mid-June. The complimentary webcast recording is available at http://www.imaps.org/webcasts/2012may_palomar.htm

Palomar Technologies is accepting meeting requests throughout the duration of IMAPS 2012. Requests may be submitted online at http://www.palomartechnologies.com/contact-us.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: RF Packaging, gold ball bumping, optoelectronic packaging, gold ball bonder, eutectic soldering process, automated component placement systems, automated packaging systems, assembly and packaging, IMAPS, eutectic diagrams, eutectic tutorial, optoelectronic, RF devices

Palomar Technologies To Exhibit at MEPTEC Thermal Symposium and Shares Article on AuSi/AuSn Eutectic Die Attach

Posted by Rich Hueners on Fri, Mar 18, 2011

Carlsbad, CA – March 18, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at the Microelectronic Packaging and Test Engineering Council (MEPTEC) Thermal Symposium on March 21 in San Jose, CA.

Worldwide account manager for Assembly Services, Steve Buerki, will be on site at the MEPTEC Thermal Symposium at booth #16.

Assembly Services is the precision microelectronic contract packaging division of Palomar Technologies. Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is “AuSi and AuSn Eutectic Die Attach Case Studies,” discussing three case studies providing an overview of material selection and methods for optimized utilization of eutectic solders.

Case 1: AuSi (RFSOE) 16 x 63 x 4mil and 31 x 64 x 4mil

Case 2: AuSn (P-Side Down) 12 x 10 x 12mil with preform using pulsed heat top down

Case 3: AuSn (ASIC) 453 x 274 x 12mil with preform using pulsed heat bottom up

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: eutectic die attach, eutectic soldering process, customized packaging solutions, eutectic process, AuSn, eutectic diagrams, eutectic tutorial, Application Process, MEPTEC, gold tin die attach