Latest news in micoelectronics, optoelectronics, LED assembly and complex hybrid packaging from Palomar Technologies.

PTI Press Releases

Palomar Technologies to Provide Live Demonstrations of the 3500-III Die Bonder at SEMICON China 2011

Posted by Palomar Technologies MarCom Team on Mon, Mar 14, 2011

CARLSBAD, CA - March 14, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will showcase live demonstrations of the 3500-III Die Bonder at SEMICON China 2011 in Shanghai.

Palomar Technologies will exhibit a 3500-III Die Bonder at booth #3615 at the SEMICON China 2011 conference on March 15-17. In conjunction with the high-precision die bonder machine, Palomar Technologies will offer demonstrations of a Royce Instruments DE35-ST Mechanized pick-and-place system and a Hybond, Inc., UDB-141 Semi-automatic Eutectic Die Bonder. Palomar Technologies Asia Director, Mr. PH Chan, will be on-site at SEMICON China 2011 to engage in discussions of Palomar Technologies high-accuracy die attach and wire bonder systems and solutions.

Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is Odd-Form Factor Package Wire Bond Case Studies, a technical paper exploring the wire bonding requirements of several device cases considered odd form factor package formats when compared to mainstream semiconductor packaging. Solutions to wire bond packages in the RF, automotive, and optical markets are also discussed.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Topics: die bonders, eutectic die attach, die bonding, Epoxy Die Attach, 3500 Die Bonder, SEMICON China, eutectic process, die bonder, eutectic, large area bonder, inline assembly, odd form factor

Palomar Technologies Again Achieves Year-Over-Year Revenue Growth and Profitability

Posted by Palomar Technologies MarCom Team on Thu, Jan 13, 2011

Carlsbad, CA – January 13, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it sustained growth for the fourth consecutive year. “I am pleased to announce the closure of another successful fiscal year at Palomar Technologies. The hard work and dedication of Palomar’s worldwide team has resulted in our fourth consecutive year of positive growth in revenue and profitability,” stated Bruce W. Hueners, president and CEO of Palomar Technologies. “Our performance has provided a solid foundation for continued expansion of the company to better serve our customers.”

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world. For more information on current open positions, please email resumes@bonders.com.

Last year, Palomar Technologies launched its newest high accuracy die attach machine, the 3800 Die Bonder. Built on the proven platform of the 3500 Die Bonder, the 3800 enables customers to achieve up to 2600 UPH with 3.5 micron-3 sigma repeatability. This capability is achieved across a large 35.5”x20” (710 sq in) work area where multiple eutectic, epoxy, die ejection, wafer handling and inline assembly options can be integrated. A new ergonomic user interface, linear motors and the most advanced production software ensures high reliability and control in micro/optoelectronic packaging.

Assembly Services is the precision contract assembly services division of Palomar Technologies, providing prototyping, test, measurement and production for high accuracy and complex wire and die attach applications. To meet customer demand, an additional clean room space was recently added, increasing production capacity by 50%. Assembly Services expertise includes development and production for applications such as HB LEDs, RF Power Modules, Military Hybrids and Laser Diode Packages.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Topics: 3800 die bonder, die bonders, eutectic die attach, eutectic soldering process, die bonding, Contract Assembly, contract assembly in microelectronics, Epoxy Die Attach, eutectic process, die bonder, eutectic, large area bonder, inline assembly

Palomar Technologies To Exhibit at 2009 Strategies in Light Exhbition and Conference

Posted by Palomar Technologies MarCom Team on Wed, Feb 11, 2009

Carlsbad, CA – February 11, 2009 – Palomar Technologies announced today it will return to exhibit at the 2009 Strategies in Light Exhibition and Conference to be held February 18 – 20, 2009 in Santa Clara, California. Palomar Technologies will be exhibiting in booth #606 at the Strategies in Light Exhibition and Conference where microelectronics experts will explain how Palomar’s wire bonding and die attach equipment perform the necessary assembly processes to achieve high brightness while achieving thermal dissipation and maximum light extraction.

Palomar Technologies is a leading provider of automated precision microelectronic assembly equipment and contract assembly services that serves industry leaders in telecommunications, medical, defense and aerospace and commercial high-technology. Added applications at Palomar Technologies in 2009 include wafe scale packaging, chip-on-flex, advanced Gold ball and stitch bonding, Gold stud bumping for GGI (Gold Gold Interconnect) as well as epoxy and eutectic solder and thermo-compression bonding processes.

Palomar Microelectronics is the development, test, and contract assembly division of Palomar Technologies. Their microelectronic assembly services include advanced wire bonding, gold stud bumping, wafer scale packaging and device bonding for GGI processes, precision component placement for high-power LEDs, optoelectronics, MEMS, microwave/RF, multichip modules (MCMs), and hybrid microcircuits. Palomar optimizes precision placement and high-thermal conductivity interconnects of high-power LED packaging through the use of field-proven automated component placement systems and pulse heat eutectic die attach equipment. Palomar’s high-density wire-bonded connections are accurately placed in tight areas,have consistent loop structure, and connections strong enough to withstand mechanical shock and stresses due to large thermal variations.

Strategies in Light is a business conference and exhibition focused on high-brightness LEDs produced by Strategies Unlimited and PennWell Corporation. It is the longest-running and the largest conference in the HB LED industry, and the premier annual forum for presenting current commercial developments in high-brightness LED applications and providing unparalleled networking opportunities for component and equipment suppliers, manufacturers, and end-users of HB LED devices.

About Palomar Technologies
Palomar Technologies (formerly part of Hughes Aircraft Company) is the world’s foremost supplier of automated high-precision wire bonders, die bonders and component placement systems combined with process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers.

Topics: die bonders, eutectic die attach, die bonding, contract assembly in microelectronics, automated component placement systems, Epoxy Die Attach, assembly and packaging, eutectic process, die bonder, eutectic, Strategies in Light

Palomar Technologies Presents Latest Version of Award-Winning Automatic 3500-III Die Bonder

Posted by Palomar Technologies MarCom Team on Mon, Mar 12, 2007

Designed for fully automatic, high accuracy, precision microelectronics assembly, the flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area. Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules, and hybrid microcircuits.

The 3500-III is capable of performing automated eutectic die attach utilizing backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets. Palomar’s patented eutectic process is key for high yield and reliability because eutectic die attach is one of the most difficult processes to control. Palomar’s pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.

Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-III’s sub-micron axis resolution yields typical placement repeatability of better than ±12 micron (0.5 mil), 3 sigma with fluids, ±5 micron (0.2 mil), 3 sigma with pulse heat eutectic applications.

With the 3500-III, placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms. Relative-to-die placement algorithms place the die so that the second, third, and each die or substrate thereafter is placed relative to the final location of the last placed component rather than the package. This provides greater accuracy from component to component. It also controls the subsequent wire length and position, ensuring that the wires are parallel and the lengths are the same, factors important for high frequency electrical performance.

The machine base is a honeycomb core optical table that provides vibration damping and thermal settling response superior to granite. Its work area is the largest available. The cantilever design permits unobstructed, open access on three sides for set-up. Soft touchdown or non-contact laser height sensing mechanisms assist in precise pickup and placement of fragile devices such as gallium arsenide. An 8-position turret head can rapidly change tools on the fly without a space and time-consuming tool dock assembly.    Because it is constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.

The 3500-III employs an infrared light curtain around the entire open perimeter of the assembly cell. This safety curtain sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation. When the system is in operation and the safety curtain is violated, the system immediately (within ~ 3 milliseconds) shorts the inputs to the digital servo driven motors, bringing all motion to a near instant stop.

The system uses a Windows XPTM operating system, employing Cognex Corporation’s latest Series 8000 gray-scale pattern recognition systems. The graphical, user-friendly interface assists in bonding set-up, operation, diagnostics, and calibration.The new, high-visibility, flat screen displays on the 3500-III greatly improve the unit’s ergonomics. It is SMEMA compatible and can be configured with loaders to provide small island operations or complete in-line system
solutions. From wafer to eutectic die attach, handling options are fully programmable.

“The Model 3500-III is a workhorse machine, yet it is the most flexible, precise, accurate die bonder available,” said Palomar Technologies president, Bruce Hueners. “It has been referred to as the ‘Swiss Army Knife of bonders’.”

Customers seeking to extend the service life and increase productivity of their Model 3500-II Automatic Component Placement Systems can now order a 3500-III upgrade directly from Palomar and achieve the same high level of reliability and productivity as a new Model 3500-III. The 3500-III upgrade includes a faster 32-bit computing system, Windows XP operating system, faster and more versatile Cognex 8000 Pattern Recognition system, energy-efficient space- saving flat panel displays, and a suite of powerful software tools featuring Bond Data Miner (BDM) which includes improved process development tools, automated SPC data documentation and component traceability. Customer trials indicate an increase in productivity measured in raw throughput of up to 18%, depending on materials and application.

About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the photonics, wireless, microwave, automotive, aerospace, medical, and life sciences industries.


Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, and active optical align and attach. Palomar’s Process Development and Prototyping Services assists companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. For more information, visit www.palomartechnologies.com or contact 760-931-3600.

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Let Us Help You
We would be happy to evaluate your process application need and propose a solution. Please call us at (760) 931-3600.

Topics: die bonders, eutectic die attach, die bonding, automated component placement systems, automated packaging systems, Epoxy Die Attach, 3500 Die Bonder, eutectic process, die bonder

Honored for 3500-II Die Bonder Automatic Component Placement Cell

Posted by Palomar Technologies MarCom Team on Sat, Jul 01, 2006

Carlsbad, Calif. –Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announces that it received the Editors’ Choice Best Product Award for its Model 3500-II Automatic Component Placement Cell. Presented annually by Semiconductor International magazine, the award honors products that are making a difference in semiconductor manufacturing.

Palomar Technologies received the award in a ceremony held July 12, 2006 during the SEMICON West trade show in San Francisco, California. This is the second consecutive year, and the third time, that Palomar has won this award.

The Model 3500-II is designed for fully automatic, high accuracy, precision microelectronics assembly. The flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area. Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-II sub-micron axis resolution yields typical placement accuracies of better than ±12 micron (0.5 mil), 3 sigma. Applications include flip chip, stacked die, chip-on-board, fine pitch surface mount, multi-chip modules, microwave modules, and hybrid microcircuits.
Palomar's team, including some of its most experienced engineers, consistently improves this multi-functional, multi-dimensional, flexible tool to push the limits on speed and accuracy. The Model 3500-II represents the latest development in Palomar’s long history of manufacturing automatic placement systems. Beginning with the Model 2500, the technology has grown and evolved into what is now the dynamic and highly customizable Model 3500-II that Palomar continues to improve. A new generation system, the Model 3500-III is ready for introduction.

"Advances in semiconductor technology are only possible because of the kinds of products being honored in this year's Editors' Choice Best Product Awards program," said Pete Singer, Editor-in- Chief of Semiconductor International. "Chipmakers rely on these products to create electronics that are smarter, smaller, faster, less expensive, and more reliable. We congratulate the people and the companies that have had the insight and fortitude to bring these products to the market."
Semiconductor International, published by Reed Business Information and a part of Reed Elsevier's global array of information products, is the leading technical publication reaching and covering the global semiconductor manufacturing industry. It has the largest circulation to semiconductor manufacturers of any industry publication.

About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the semiconductor, photonics, wireless, microwave, automotive, aerospace, medical, and life sciences industries.

Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, ball bumping, and active optical align and attach. Palomar’s Process Development and Prototyping Services assist companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. For more information, visit www.PalomarTechnologies.com or contact 760-931-3600.

#####
Let Us Help You
We would be happy to evaluate your process application need and propose a solution. Please call us at (760) 931-3600.

Topics: bonders, die bonders, eutectic die attach, die bonding, automated component placement systems, automated packaging systems, Epoxy Die Attach, 3500 Die Bonder

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