Palomar Technologies Presents Sub-5um Die Attach Placement Accuracy Webcast

Posted by Rich Hueners on Tue, Jun 12, 2012

Carlsbad, CA – June 12, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that the company can support high-precision die attach to less than 5µm placement accuracies.

“As the trend to build smaller electronics pushes the limits of semiconductor packaging abilities, the need for high-accuracy and high-precision component placement often presents a challenge in itself,” stated Donald Beck, Palomar Technologies Assembly ServicesTM General Manager. “We are able to support [application dependent] requirements for ultra-high placement accuracies on our eutectic/epoxy 3800 Die Bonder and 6500 Die Bonder systems.”

The ultra flexible 3800 Die Bonder is designed for fully automatic, precision microelectronics assembly. The tightly regulated,computer-controlled work cell can perform up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. The 3800 Die Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions.

The 6500 Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless and medical applications. This eutectic die bonder is designed for fully automatic precision component assembly—even up to 1.5µm placement accuracy (application dependent)—making component assembly practical and cost effective. Wafer Scale Packaging (WSP) eutectic die attach on the 6500 Die Bonder provides customers with a complete microelectronic solution for P-side down laser diode attachment (die-to-wafer), a pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, a wafer stage with steady state heating, and waffle or gel pack presentation of laser diode applications.

Mr. Beck is presenting a 30-minute live webcast on June 13 at 12:00pm Eastern Time, discussing new developments for ultra high-precision component packaging: “<5micron Placement Accuracy" target="_self">High-Reliability Component Attachment Process for <5micron Placement Accuracy ".

The webcast will cover a process solution for <5µm component attach" target="_self">automating <5µm component attach specific to organizations requiring high-reliability device packaging. In this webinar, Mr. Beck will cover methods that have been proven through real-world experiences related to the high-reliability microelectronics industry. Joining Mr. Beck will be Mr. Zeger Bok (Sr. Application Engineer) and Mr. Daniel Martinez (Assembly Services Lab Manager & Manufacturing Engineer) for live Q&A after the formal presentation.

Register now for the live webcast, presented on June 13 at Noon Eastern Time. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, Announcements, device design, die bonders, eutectic die attach, eutectic soldering process, die bonding, gold tin eutectic die attach, 6500 die bonder, eutectic process, die bonder, IMAPS, eutectic, eutectic tutorial, gold tin die attach, placement accuracy of microelectronic components

Palomar Technologies Exhibits at SEMICON West 2011 and Offers Trade-In Credit for Used Die Attach Systems

Posted by Rich Hueners on Sun, Jul 10, 2011

Carlsbad, CA – July 7, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at SEMICON West 2011 in San Francisco, CA from July 12-14 in booth #5780.

“Palomar Technologies has been a 35-year SEMICON West exhibitor,” states Bruce Hueners, president and CEO of Palomar Technologies. “Our teams are looking forward to discussing product advancements and microelectronic packaging solutions to a high-caliber and captive audience—it is through this environment that the real-life challenges of microelectronic assembly services are met.”

The 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction Award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Current owners of 3500-III Die Bonders have the opportunity to trade in their system for substantial credit towards the 3800 Die Bonder through Palomar Technologies’ Bonder Buy-Back Program.

The Bonder Buy-Back Program offers engineering support for a seamless transition of production programs to the latest in automated die attach systems. The 3800 Die Bonder expands on the proven technology of ultra-high-accuracy die bonder series, backed by decades of industry expertise and evidenced by performance in demanding production facilities worldwide at better than 90% uptime.

At a Glance: Ultra-Flexible 3800 Die Bonder

  • Winner—2010 Global Technology Award
  • Winner—2011 New Product Introduction Award
  • Latest technology with advancements in mechanics, software and ergonomic technologies
  • Increased precision and accuracy (+/-7um)
  • Process camera for live view of pick tool
  • User-friendly GUI
  • Integrated Pulsed Heat System client for high-precision eutectic die attach into centralized bonder control system
  • 3500-III programs portable to 3800—seamless transition into production
  • Increased speed for improvements in throughput and yield (application dependent)
  • Quiet high-speed linear motors
  • Familiar large work envelope (35.5” x 20”)

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, die bonders, die bonding, automated component placement systems, bonder buying options, die bonder, Bonder Buy Back Program, SEMICON West 2011, AuSn

Palomar Technologies Performs Live Demonstrations of 3800 Die Bonder and 8000 Wire Bonder at SMT Hybrid Packaging 2011 and Hosts Free On-Demand HB LED Webcast

Posted by Rich Hueners on Mon, Apr 25, 2011

Carlsbad, CA – April 25, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will perform live demonstrations of the 3800 Die Bonder and 8000 Wire Bonder systems at SMT Hybrid Packaging 2011 in Nuremberg, Germany, on May 3-5.

Palomar Technologies will be showcasing the application capabilities of the high-accuracy 8000 Wire Bonder and the ultra-flexible 3800 Die Bonder— a recent winner of the 2011 New Product Introduction Awards announced on April 12, 2011. Palomar Technologies will be exhibiting in the Optoelectronic Booth, #6-115D (hall #6).

Julie Adams, director of worldwide sales for Assembly Services (a division of Palomar Technologies), will be on-site at the conference to engage in discussions regarding precision microelectronic contract assembly solutions.

"Assembly Services offers a practical and reliable solution for companies in need of contract assembly, process development and application prototyping,” states Julie Adams. “We offer unique solutions such as 2-micron component placement accuracy supported by best-in-class die attach and wire bond equipment along with in-house application engineering experts to tackle your most challenging microelectronic packaging needs—a company that can prepare your organization and products for volume manufacturing, all while abiding by strict customer confidentiality and maintaining IP.”

Assembly Services has developed an efficient process flow in HB LED application production. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast “Automated Precision Assembly for High-Volume HB LED.” Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, ball bonder, LED applications, die bonders, LED packaging, Contract Assembly, ball bumping, contract assembly in microelectronics, 8000 wire bonder, HB LED, complex LED modules, wire bond demo, SMT, ball bump, NPI Awards

Palomar Technologies to Provide Live Demonstrations of the 3500-III Die Bonder at SEMICON China 2011

Posted by Rich Hueners on Mon, Mar 14, 2011

CARLSBAD, CA - March 14, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will showcase live demonstrations of the 3500-III Die Bonder at SEMICON China 2011 in Shanghai.

Palomar Technologies will exhibit a 3500-III Die Bonder at booth #3615 at the SEMICON China 2011 conference on March 15-17. In conjunction with the high-precision die bonder machine, Palomar Technologies will offer demonstrations of a Royce Instruments DE35-ST Mechanized pick-and-place system and a Hybond, Inc., UDB-141 Semi-automatic Eutectic Die Bonder. Palomar Technologies Asia Director, Mr. PH Chan, will be on-site at SEMICON China 2011 to engage in discussions of Palomar Technologies high-accuracy die attach and wire bonder systems and solutions.

Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is Odd-Form Factor Package Wire Bond Case Studies, a technical paper exploring the wire bonding requirements of several device cases considered odd form factor package formats when compared to mainstream semiconductor packaging. Solutions to wire bond packages in the RF, automotive, and optical markets are also discussed.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: die bonders, eutectic die attach, die bonding, Epoxy Die Attach, 3500 Die Bonder, SEMICON China, eutectic process, die bonder, eutectic, large area bonder, inline assembly, odd form factor

Palomar Technologies Again Achieves Year-Over-Year Revenue Growth and Profitability

Posted by Rich Hueners on Thu, Jan 13, 2011

Carlsbad, CA – January 13, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it sustained growth for the fourth consecutive year. “I am pleased to announce the closure of another successful fiscal year at Palomar Technologies. The hard work and dedication of Palomar’s worldwide team has resulted in our fourth consecutive year of positive growth in revenue and profitability,” stated Bruce W. Hueners, president and CEO of Palomar Technologies. “Our performance has provided a solid foundation for continued expansion of the company to better serve our customers.”

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world. For more information on current open positions, please email resumes@bonders.com.

Last year, Palomar Technologies launched its newest high accuracy die attach machine, the 3800 Die Bonder. Built on the proven platform of the 3500 Die Bonder, the 3800 enables customers to achieve up to 2600 UPH with 3.5 micron-3 sigma repeatability. This capability is achieved across a large 35.5”x20” (710 sq in) work area where multiple eutectic, epoxy, die ejection, wafer handling and inline assembly options can be integrated. A new ergonomic user interface, linear motors and the most advanced production software ensures high reliability and control in micro/optoelectronic packaging.

Assembly Services is the precision contract assembly services division of Palomar Technologies, providing prototyping, test, measurement and production for high accuracy and complex wire and die attach applications. To meet customer demand, an additional clean room space was recently added, increasing production capacity by 50%. Assembly Services expertise includes development and production for applications such as HB LEDs, RF Power Modules, Military Hybrids and Laser Diode Packages.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, die bonders, eutectic die attach, eutectic soldering process, die bonding, Contract Assembly, contract assembly in microelectronics, Epoxy Die Attach, eutectic process, die bonder, eutectic, large area bonder, inline assembly

Palomar Technologies To Exhibit at 2009 Strategies in Light Exhbition and Conference

Posted by Rich Hueners on Thu, Feb 12, 2009

Carlsbad, CA – February 11, 2009 – Palomar Technologies announced today it will return to exhibit at the 2009 Strategies in Light Exhibition and Conference to be held February 18 – 20, 2009 in Santa Clara, California. Palomar Technologies will be exhibiting in booth #606 at the Strategies in Light Exhibition and Conference where microelectronics experts will explain how Palomar’s wire bonding and die attach equipment perform the necessary assembly processes to achieve high brightness while achieving thermal dissipation and maximum light extraction.

Palomar Technologies is a leading provider of automated precision microelectronic assembly equipment and contract assembly services that serves industry leaders in telecommunications, medical, defense and aerospace and commercial high-technology. Added applications at Palomar Technologies in 2009 include wafe scale packaging, chip-on-flex, advanced Gold ball and stitch bonding, Gold stud bumping for GGI (Gold Gold Interconnect) as well as epoxy and eutectic solder and thermo-compression bonding processes.

Palomar Microelectronics is the development, test, and contract assembly division of Palomar Technologies. Their microelectronic assembly services include advanced wire bonding, gold stud bumping, wafer scale packaging and device bonding for GGI processes, precision component placement for high-power LEDs, optoelectronics, MEMS, microwave/RF, multichip modules (MCMs), and hybrid microcircuits. Palomar optimizes precision placement and high-thermal conductivity interconnects of high-power LED packaging through the use of field-proven automated component placement systems and pulse heat eutectic die attach equipment. Palomar’s high-density wire-bonded connections are accurately placed in tight areas,have consistent loop structure, and connections strong enough to withstand mechanical shock and stresses due to large thermal variations.

Strategies in Light is a business conference and exhibition focused on high-brightness LEDs produced by Strategies Unlimited and PennWell Corporation. It is the longest-running and the largest conference in the HB LED industry, and the premier annual forum for presenting current commercial developments in high-brightness LED applications and providing unparalleled networking opportunities for component and equipment suppliers, manufacturers, and end-users of HB LED devices.

About Palomar Technologies
Palomar Technologies (formerly part of Hughes Aircraft Company) is the world’s foremost supplier of automated high-precision wire bonders, die bonders and component placement systems combined with process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers.

Tags: die bonders, eutectic die attach, die bonding, contract assembly in microelectronics, automated component placement systems, Epoxy Die Attach, assembly and packaging, eutectic process, die bonder, eutectic, Strategies in Light

Palomar Technologies Presents Latest Version of Award-Winning Automatic 3500-III Die Bonder

Posted by Rich Hueners on Mon, Mar 12, 2007

Designed for fully automatic, high accuracy, precision microelectronics assembly, the flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area. Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules, and hybrid microcircuits.

The 3500-III is capable of performing automated eutectic die attach utilizing backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets. Palomar’s patented eutectic process is key for high yield and reliability because eutectic die attach is one of the most difficult processes to control. Palomar’s pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.

Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-III’s sub-micron axis resolution yields typical placement repeatability of better than ±12 micron (0.5 mil), 3 sigma with fluids, ±5 micron (0.2 mil), 3 sigma with pulse heat eutectic applications.

With the 3500-III, placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms. Relative-to-die placement algorithms place the die so that the second, third, and each die or substrate thereafter is placed relative to the final location of the last placed component rather than the package. This provides greater accuracy from component to component. It also controls the subsequent wire length and position, ensuring that the wires are parallel and the lengths are the same, factors important for high frequency electrical performance.

The machine base is a honeycomb core optical table that provides vibration damping and thermal settling response superior to granite. Its work area is the largest available. The cantilever design permits unobstructed, open access on three sides for set-up. Soft touchdown or non-contact laser height sensing mechanisms assist in precise pickup and placement of fragile devices such as gallium arsenide. An 8-position turret head can rapidly change tools on the fly without a space and time-consuming tool dock assembly.    Because it is constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.

The 3500-III employs an infrared light curtain around the entire open perimeter of the assembly cell. This safety curtain sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation. When the system is in operation and the safety curtain is violated, the system immediately (within ~ 3 milliseconds) shorts the inputs to the digital servo driven motors, bringing all motion to a near instant stop.

The system uses a Windows XPTM operating system, employing Cognex Corporation’s latest Series 8000 gray-scale pattern recognition systems. The graphical, user-friendly interface assists in bonding set-up, operation, diagnostics, and calibration.The new, high-visibility, flat screen displays on the 3500-III greatly improve the unit’s ergonomics. It is SMEMA compatible and can be configured with loaders to provide small island operations or complete in-line system
solutions. From wafer to eutectic die attach, handling options are fully programmable.

“The Model 3500-III is a workhorse machine, yet it is the most flexible, precise, accurate die bonder available,” said Palomar Technologies president, Bruce Hueners. “It has been referred to as the ‘Swiss Army Knife of bonders’.”

Customers seeking to extend the service life and increase productivity of their Model 3500-II Automatic Component Placement Systems can now order a 3500-III upgrade directly from Palomar and achieve the same high level of reliability and productivity as a new Model 3500-III. The 3500-III upgrade includes a faster 32-bit computing system, Windows XP operating system, faster and more versatile Cognex 8000 Pattern Recognition system, energy-efficient space- saving flat panel displays, and a suite of powerful software tools featuring Bond Data Miner (BDM) which includes improved process development tools, automated SPC data documentation and component traceability. Customer trials indicate an increase in productivity measured in raw throughput of up to 18%, depending on materials and application.

About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the photonics, wireless, microwave, automotive, aerospace, medical, and life sciences industries.


Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, and active optical align and attach. Palomar’s Process Development and Prototyping Services assists companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. For more information, visit www.palomartechnologies.com or contact 760-931-3600.

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Let Us Help You
We would be happy to evaluate your process application need and propose a solution. Please call us at (760) 931-3600.

Tags: die bonders, eutectic die attach, die bonding, automated component placement systems, automated packaging systems, Epoxy Die Attach, 3500 Die Bonder, eutectic process, die bonder

Honored for 3500-II Die Bonder Automatic Component Placement Cell

Posted by Rich Hueners on Sun, Jul 02, 2006

Carlsbad, Calif. –Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announces that it received the Editors’ Choice Best Product Award for its Model 3500-II Automatic Component Placement Cell. Presented annually by Semiconductor International magazine, the award honors products that are making a difference in semiconductor manufacturing.

Palomar Technologies received the award in a ceremony held July 12, 2006 during the SEMICON West trade show in San Francisco, California. This is the second consecutive year, and the third time, that Palomar has won this award.

The Model 3500-II is designed for fully automatic, high accuracy, precision microelectronics assembly. The flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area. Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-II sub-micron axis resolution yields typical placement accuracies of better than ±12 micron (0.5 mil), 3 sigma. Applications include flip chip, stacked die, chip-on-board, fine pitch surface mount, multi-chip modules, microwave modules, and hybrid microcircuits.
Palomar's team, including some of its most experienced engineers, consistently improves this multi-functional, multi-dimensional, flexible tool to push the limits on speed and accuracy. The Model 3500-II represents the latest development in Palomar’s long history of manufacturing automatic placement systems. Beginning with the Model 2500, the technology has grown and evolved into what is now the dynamic and highly customizable Model 3500-II that Palomar continues to improve. A new generation system, the Model 3500-III is ready for introduction.

"Advances in semiconductor technology are only possible because of the kinds of products being honored in this year's Editors' Choice Best Product Awards program," said Pete Singer, Editor-in- Chief of Semiconductor International. "Chipmakers rely on these products to create electronics that are smarter, smaller, faster, less expensive, and more reliable. We congratulate the people and the companies that have had the insight and fortitude to bring these products to the market."
Semiconductor International, published by Reed Business Information and a part of Reed Elsevier's global array of information products, is the leading technical publication reaching and covering the global semiconductor manufacturing industry. It has the largest circulation to semiconductor manufacturers of any industry publication.

About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the semiconductor, photonics, wireless, microwave, automotive, aerospace, medical, and life sciences industries.

Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, ball bumping, and active optical align and attach. Palomar’s Process Development and Prototyping Services assist companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. For more information, visit www.PalomarTechnologies.com or contact 760-931-3600.

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Let Us Help You
We would be happy to evaluate your process application need and propose a solution. Please call us at (760) 931-3600.

Tags: bonders, die bonders, eutectic die attach, die bonding, automated component placement systems, automated packaging systems, Epoxy Die Attach, 3500 Die Bonder