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Palomar Technologies To Exhibit at MEPTEC Thermal Symposium and Shares Article on AuSi/AuSn Eutectic Die Attach

Posted by Palomar Technologies MarCom Team on Fri, Mar 18, 2011

Carlsbad, CA – March 18, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at the Microelectronic Packaging and Test Engineering Council (MEPTEC) Thermal Symposium on March 21 in San Jose, CA.

Worldwide account manager for Assembly Services, Steve Buerki, will be on site at the MEPTEC Thermal Symposium at booth #16.

Assembly Services is the precision microelectronic contract packaging division of Palomar Technologies. Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is “AuSi and AuSn Eutectic Die Attach Case Studies,” discussing three case studies providing an overview of material selection and methods for optimized utilization of eutectic solders.

Case 1: AuSi (RFSOE) 16 x 63 x 4mil and 31 x 64 x 4mil

Case 2: AuSn (P-Side Down) 12 x 10 x 12mil with preform using pulsed heat top down

Case 3: AuSn (ASIC) 453 x 274 x 12mil with preform using pulsed heat bottom up

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Topics: eutectic die attach, eutectic soldering process, customized packaging solutions, eutectic process, AuSn, eutectic diagrams, eutectic tutorial, Application Process, MEPTEC, gold tin die attach

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