Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs

Posted by Rich Hueners on Wed, Feb 01, 2012

Carlsbad, CA – February 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced a precision eutectic process development for direct attach light emitting diodes (LEDs).

“Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs,” explains Donald Beck, General Manager of Palomar Technologies Assembly ServicesTM. “Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. Palomar Technologies’ Pulsed Heat System is a major contributor to this development, allowing our precision die attach systems to control LED exposure much more effectively than most other processes. The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management.”

Palomar Technologies is exhibiting at the LED-focused show, Strategies in Light 2012, in booth #709 on February 7-9 in Santa Clara, CA. Julie Adams, Director of WW Assembly Services Sales will be on site to assist in discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding.

Also on February 7-9, Palomar Technologies is exhibiting as a premier sponsor at IMAPS RF 2012 in booth #RF01, held in San Diego, CA. Bradley Benton, Western Americas Sales Manager, will be presenting an overview of Palomar Technologies’ solutions and advanced RF automated packaging processes on February 8 at 1:00pm, local conference time.

Contact Palomar Technologies to arrange an on-site meeting at either Strategies in Light 2012 or IMAPS RF 2012.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: device design, LED applications, eutectic die attach, eutectic soldering process, Contract Assembly, Complex Packaging, contract assembly in microelectronics, assembly and packaging, eutectic process, IMAPS, HB LED, complex LED modules, eutectic, Strategies in Light

Palomar Technologies Meets and Exceeds ITAR Compliance Regulations

Posted by Rich Hueners on Tue, Aug 16, 2011

Carlsbad, CA – August 16, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that the company has recently been officially registered with the U.S. Department of State pursuant to the International Traffic in Arms Regulations (ITAR).

“Palomar Technologies is fully ITAR compliant. We are able to manufacture and manage sensitive ITAR projects for our customers. Our technologies, training and processes are constantly reviewed and updated to ensure they meet and exceed ITAR and Government regulations,” states Bruce Hueners, president and CEO of Palomar Technologies. “Our ITAR registration and ISO certification are symbols of how Palomar is committed to quality, conformance and customer satisfaction in the most demanding applications.”

Any person or company who engages in the U.S. in the business of either manufacturing or exporting defense articles or furnishing defense services is required to register. Palomar Technologies and Palomar Assembly Services™ (“Assembly Services”) are committed to meet the unique needs of customers requiring ITAR-compliant processes, manufacturing and material provisions.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: Announcements, Factory Automation, Contract Assembly, contract assembly in microelectronics, ITAR

Palomar Technologies Performs Live Demonstrations of 3800 Die Bonder and 8000 Wire Bonder at SMT Hybrid Packaging 2011 and Hosts Free On-Demand HB LED Webcast

Posted by Rich Hueners on Mon, Apr 25, 2011

Carlsbad, CA – April 25, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will perform live demonstrations of the 3800 Die Bonder and 8000 Wire Bonder systems at SMT Hybrid Packaging 2011 in Nuremberg, Germany, on May 3-5.

Palomar Technologies will be showcasing the application capabilities of the high-accuracy 8000 Wire Bonder and the ultra-flexible 3800 Die Bonder— a recent winner of the 2011 New Product Introduction Awards announced on April 12, 2011. Palomar Technologies will be exhibiting in the Optoelectronic Booth, #6-115D (hall #6).

Julie Adams, director of worldwide sales for Assembly Services (a division of Palomar Technologies), will be on-site at the conference to engage in discussions regarding precision microelectronic contract assembly solutions.

"Assembly Services offers a practical and reliable solution for companies in need of contract assembly, process development and application prototyping,” states Julie Adams. “We offer unique solutions such as 2-micron component placement accuracy supported by best-in-class die attach and wire bond equipment along with in-house application engineering experts to tackle your most challenging microelectronic packaging needs—a company that can prepare your organization and products for volume manufacturing, all while abiding by strict customer confidentiality and maintaining IP.”

Assembly Services has developed an efficient process flow in HB LED application production. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast “Automated Precision Assembly for High-Volume HB LED.” Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, ball bonder, LED applications, die bonders, LED packaging, Contract Assembly, ball bumping, contract assembly in microelectronics, 8000 wire bonder, HB LED, complex LED modules, wire bond demo, SMT, ball bump, NPI Awards

Palomar Technologies Highlights Improved High Volume HB LED Assembly at Strategies in Light Conference

Posted by Rich Hueners on Thu, Feb 10, 2011

Carlsbad, CA – February 10, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its involvement in the Strategies in Light conference, held February 22-24 in Santa Clara, CA.

Assembly Services is the contract assembly division of Palomar Technologies. Assembly Services enables organizations around the globe to achieve balance between speed and reliability in precision assembly of high-volume HB LED packaging without investing in capital equipment,” stated Assembly Services general manager, Donald Beck. “We are looking forward to showcasing our HB LED assembly services as an exhibitor at the upcoming Strategies in Light conference later this month.”

Worldwide account manager for Assembly Services, Steve Buerki, will be on site at the Strategies in Light conference at booth #238. To ensure an in-person meeting with Mr. Buerki, download a free admission pass to the Strategies in Light exhibitors’ show floor.

Assembly Services provides prototyping, test, measurement and production for high accuracy and complex wire and die attach applications. To meet increasing customer demand, additional clean room space was recently added in the California-based laboratory, increasing production capacity by 50%. Assembly Services expertise includes development and production for applications such as HB LEDs, RF power modules, military hybrids and laser diode packages.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: LED applications, capital equipment, LED packaging, Contract Assembly, contract assembly in microelectronics, HB LED, Strategies in Light, low cost high volume production

Palomar Technologies Again Achieves Year-Over-Year Revenue Growth and Profitability

Posted by Rich Hueners on Thu, Jan 13, 2011

Carlsbad, CA – January 13, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it sustained growth for the fourth consecutive year. “I am pleased to announce the closure of another successful fiscal year at Palomar Technologies. The hard work and dedication of Palomar’s worldwide team has resulted in our fourth consecutive year of positive growth in revenue and profitability,” stated Bruce W. Hueners, president and CEO of Palomar Technologies. “Our performance has provided a solid foundation for continued expansion of the company to better serve our customers.”

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world. For more information on current open positions, please email resumes@bonders.com.

Last year, Palomar Technologies launched its newest high accuracy die attach machine, the 3800 Die Bonder. Built on the proven platform of the 3500 Die Bonder, the 3800 enables customers to achieve up to 2600 UPH with 3.5 micron-3 sigma repeatability. This capability is achieved across a large 35.5”x20” (710 sq in) work area where multiple eutectic, epoxy, die ejection, wafer handling and inline assembly options can be integrated. A new ergonomic user interface, linear motors and the most advanced production software ensures high reliability and control in micro/optoelectronic packaging.

Assembly Services is the precision contract assembly services division of Palomar Technologies, providing prototyping, test, measurement and production for high accuracy and complex wire and die attach applications. To meet customer demand, an additional clean room space was recently added, increasing production capacity by 50%. Assembly Services expertise includes development and production for applications such as HB LEDs, RF Power Modules, Military Hybrids and Laser Diode Packages.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, die bonders, eutectic die attach, eutectic soldering process, die bonding, Contract Assembly, contract assembly in microelectronics, Epoxy Die Attach, eutectic process, die bonder, eutectic, large area bonder, inline assembly