Latest news in micoelectronics, optoelectronics, LED assembly and complex hybrid packaging from Palomar Technologies.

PTI Press Releases

Palomar Technologies President and CEO, Bruce Hueners, Named Finalist in Ernst & Young Entrepreneur Of The Year® 2012 Award for San Diego

Posted by Palomar Technologies MarCom Team on Tue, Jun 19, 2012

Carlsbad, CA – June 19, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that Bruce Hueners, president and CEO, is a finalist for the Ernst & Young Entrepreneur Of The Year® 2012 Award in San Diego.

According to Ernst & Young LLP, the awards program recognizes entrepreneurs who demonstrate excellence and extraordinary success in such areas as innovation, financial performance and personal commitment to their businesses and communities. Mr. Hueners was selected as a finalist by a panel of independent judges in the “Technology and Software” category. From the original 85 semi-finalists, Mr. Hueners was one of 20 finalists recognized at the June 13, 2012, awards ceremony held at the Hyatt Regency in La Jolla, CA.

“It is an honor to have been selected as a finalist for the 2012 San Diego Ernst & Young Entrepreneur Of The Year® award. However, this recognition is truly a reflection of the ingenuity, innovation and achievements of the entire team at Palomar Technologies,” stated Mr. Hueners. “My fellow finalists are a remarkable group of San Diego’s top entrepreneurs, and I am proud to be included among them.”

The Ernst & Young Entrepreneur Of The Year® awards program celebrates its 26th anniversary this year. The program has expanded to recognize business leaders in over 140 cities and over 50 countries throughout the world. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About Ernst & Young’s Entrepreneur Of The Year® Awards Program
Ernst & Young’s Entrepreneur Of The Year® is the world’s most prestigious business award for entrepreneurs. The award makes a difference through the unique way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Ernst & Young Entrepreneur Of The Year® celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 135 cities in 50 countries.

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Topics: Announcements, capturing more value, capital equipment, Awards

New Demonstration Center & Expanded Spare Parts Depot to Further Support Palomar Technologies Die Bonder & Wire Bonder Customers in Asia-Pacific Region

Posted by Palomar Technologies MarCom Team on Tue, May 29, 2012

Carlsbad, CA – May 29, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the successful expansion of the company’s Singapore-based demonstration center and spare parts depot to better support its growing Asia-Pacific customer base.

With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, Palomar Technologies has successfully expanded the Palomar Asia Spare Parts Depot and regional customer services infrastructure. Mr. PH Chan, director of Palomar Technologies Asia, recently confirmed the Palomar Asia Spare Parts Depot will be able to meet requests for overnight spare parts delivery to regional APAC customers.

In addition to the expanded Palomar Asia Spare Parts Depot, Chan has also led the development of a Singapore-based demonstration laboratory in order to support increasing demand for in-person 8000 Wire Bonder and 3800 Die Bonder demonstrations with APAC customers. Providing customer-focused private bonder demonstrations has always been part of Palomar Technologies’ niche identity. This unique one-on-one service is now available regionally to APAC companies.

UltraCleanTechnology Singapore WireBonderDieBonderDemonstrations

“In 2010, Palomar Technologies launched the 3800 Die Bonder, designed for fully automatic, precision microelectronics assembly and die attach processes,” states Chan. “The 3800 continues to be a success with our customers worldwide; however, the greatest need for the 3800 Die Bonder has proven to be within the emerging markets in Asia. The 3800 Die Bonder utilizes a large work area and various presentation tools for epoxy dispense and steady state and pulsed heat eutectic die attach—proving to be the most versatile, high-accuracy die bonder in the market for advanced microelectronics assemblies and complex hybrids.”

The new Palomar Asia demonstration laboratory is outfitted with applications and process development capabilities for both wire bond and die attach. Expert Palomar Technologies Field Service Engineers and Technical Liaisons will continue to lead demonstrations.

Palomar Technologies Asia is accepting appointments for on-site wire bonder or die attach demonstrations. Schedule a demonstration appointment by contacting Palomar Technologies Asia at (+65) 6779-2766 or online at http://www.palomartechnologies.com/contact-palomar-technologies-asia.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Topics: 3800 die bonder, capturing more value, capital equipment, Palomar Asia, demonstrations, training, 8000 wire bonder, Bonder Boot Camp

Hi-Rel Wire Bonder & Universal Bond Tester Demonstrations at SMT Nuremberg 2012

Posted by Palomar Technologies MarCom Team on Tue, May 01, 2012

Carlsbad, CA – May 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at SMT Nuremberg 2012, May 8-10, with live wire bonder demonstrations.

Palomar Technologies will exhibit in Hall 6 Booth #433 and will showcase an 8000 Wire Bonder and a Royce 650 Universal Bond Tester.

The 8000 Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

Palomar Technologies offers several complementing die bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the ultra flexible 3800 Die Bonder, which supports up to three channels of adhesive dispense, component placement, epoxy and eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

Mr. Josef Schmidl, director of Palomar Technologies Europe located in Erlangen, Germany, will be attending SMT Nuremberg and is available during the conference for any on-site meetings.

Mr. Dale Perry, Regional Manager of the Eastern North/South Americas, will also attend SMT Nuremberg. Mr. Perry is available during the duration of the conference to discuss Palomar Technologies Assembly ServicesTM capabilities and solutions.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Topics: wire bonder, wire bonding, bonders, wire bonders, capital equipment, ball bumping, semiconductor vs. hybrid, Eastern Europe, ball-bumping process, 8000 wire bonder, wire bond testing, Palomar Europe, Royce Instruments, wire bond demo, Contract Assembly in Europe, palomar 8000, SMT

Palomar Technologies 3800 Die Bonder Offers Flexible Solutions to Support LED Development in China

Posted by Palomar Technologies MarCom Team on Mon, Mar 12, 2012

Carlsbad, CA – March 13, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit with Asia Science and Technology (AST) at SEMICON China 2012, held in Shanghai on March 20-22.

Palomar Technologies, Hybond and AST will exhibit together in booth #3153 in Hall E3. A Palomar 3800 Die Bonder and manual Hybond equipment will be on-site for demonstrations.

Mr. PH Chan, Palomar Technologies Asia Director, recently wrote a blog summarizing the LED markets in Asia, specifically recounting how LEDs relate to China’s 12th five-year plan.

“By 2015, China intends its manufacturing standards to be globally viable for the volume production market. By that time, China’s LED industry is estimated to reach $75 billion,” stated Mr. Chan. “The 3800 Die Bonder is capable of ultra-high precision and high-reliability eutectic and epoxy die attach processes. This robust system is in production with several major players in the Asia-based LED market today. The 3800 Die Bonder embodies great versatility to accommodate multiple processes on a single 710in2 work envelope as well as tremendous flexibility to remain vigilant for the future of component packaging.”

Mr. Chan will be attending SEMICON China and is available during the conference for any on-site meetings.

In addition to the ultra-flexible 3800 Die Bonder, Palomar Technologies offers several complementing bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the 8000 Wire Bonder is a large area, high-reliability wire bonder and ball bumper with deep access capabilities. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Topics: 3800 die bonder, wire bonder, wire bonds, wire bonding, LED matrix assembly, LED applications, wire bonders, capital equipment, LED packaging, wafer scale packaging, automated component placement systems, automated packaging systems, Hybond, 8000 wire bonder, 6500 die bonder, automation vs. manual, field services support, Bonder Boot Camp, made in china, SEMICON China, wire bond testing

Palomar Technologies Achieves Fifth Consecutive Year-Over-Year Revenue Growth and Profitability

Posted by Palomar Technologies MarCom Team on Wed, Jan 04, 2012

Carlsbad, CA – January 4, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it has sustained revenue growth and profitability for a fifth consecutive year.

“The hard work and dedication of Palomar’s worldwide team and the loyal support of our customers has resulted in our fifth consecutive year of positive growth in revenue and profitability,” stated Bruce W. Hueners, president and CEO of Palomar Technologies. “We have continued to meet our customers’ complex packaging needs by providing high-precision wire bonding and die attach solutions and significantly increasing our bandwidth to address new opportunities. Our performance in 2011 has provided a solid foundation for continued expansion of the company to better serve our customers.”

In addition to fully automated wire bonders and die attach systems, Palomar Technologies offers prototyping, test and contract assembly packaging solutions through Palomar Technologies Assembly ServicesTM. Palomar Technologies Customer Services provides services such as bonder training and on-site support from Field Service Engineers and Process Development Consultants to ensure customers are achieving maximum performance on their systems.

Palomar Technologies was recognized for seven awards in 2011, including the New Product Introduction Award for the 3800 Die Bonder—the ultra flexible, high accuracy die attach machine launched in 2010—and the 2011 IMAPS Corporate Recognition Award.

Palomar Technologies continues its strong alliance channels with Hybond (manual bonder systems), GPD Global (precision fluid dispensing systems) and Royce Instruments (pull/shear testing equipment) to further support the complex microelectronic packaging needs among its large worldwide installed base.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore, employing a highly specialized staff of service technicians located around the world. For more information on current open positions, please email resumes@bonders.com.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Topics: 3800 die bonder, capital equipment, contract assembly in microelectronics, Awards, Hybond, Royce Instruments, GPD Global

Palomar Technologies Named TechAmerica High Tech Awards 2011 Finalist

Posted by Palomar Technologies MarCom Team on Thu, Oct 20, 2011

Awards Event to Showcase San Diego’s Finest Technology Companies

Carlsbad, CA – October 20, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it has been selected as a finalist in the Semiconductors category for the upcoming 18th Annual TechAmerica High Tech Awards. As the leading voice representing the U.S. technology industry, TechAmerica takes pride in recognizing outstanding regional companies every year at its annual awards ceremony. Finalists will be acknowledged for their achievements during a luncheon reception on October 28th at the Hilton La Jolla Torrey Pines in La Jolla, CA.

“Palomar Technologies specializes in automated high-precision die attach and wire bonding systems for microelectronic production. Our team of experts is constantly pushing the envelope to help our customers create that ‘next big thing’,” stated Bruce Hueners, president and CEO of Palomar Technologies. “Our fellow 2011 TechAmerica finalists are a remarkable group of San Diego’s semiconductor organizations, and Palomar is proud to be recognized among them.”

Palomar Technologies was selected as a finalist in the Semiconductor category for its high-accuracy wire and die attach services via fully automated component packaging systems and precision contract assembly, process development, test and prototyping divisions.

This year, several San Diego-based companies were nominated for their technological or business innovation; exceptional products or service; product marketplace validation; perseverance in the face of adversity; and community involvement for consideration in nine categories.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About TechAmerica
TechAmerica is the driving force behind productivity growth and jobs creation in the United States and the foundation of the global innovation economy. Representing approximately 1,500 member companies of all sizes from the public and commercial sectors of the economy, it is the industry’s largest advocacy organization and is dedicated to helping members’ top and bottom lines. It is also the technology industry's only grassroots-to-global advocacy network, with offices in state capitals around the United States, Washington, D.C., Europe (Brussels) and Asia (Beijing). TechAmerica was formed by the merger of AeA (formerly the American Electronics Association), the Cyber Security Industry Alliance (CSIA), the Information Technology Association of America (ITAA) and the Government Electronics & Information Technology Association (GEIA). Learn more at www.aeanet.org or www.itaa.org.

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Topics: Announcements, capital equipment, semiconductor industry, automated packaging systems, TechAmerica, Awards

Palomar Technologies Highlights Improved High Volume HB LED Assembly at Strategies in Light Conference

Posted by Palomar Technologies MarCom Team on Thu, Feb 10, 2011

Carlsbad, CA – February 10, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its involvement in the Strategies in Light conference, held February 22-24 in Santa Clara, CA.

Assembly Services is the contract assembly division of Palomar Technologies. Assembly Services enables organizations around the globe to achieve balance between speed and reliability in precision assembly of high-volume HB LED packaging without investing in capital equipment,” stated Assembly Services general manager, Donald Beck. “We are looking forward to showcasing our HB LED assembly services as an exhibitor at the upcoming Strategies in Light conference later this month.”

Worldwide account manager for Assembly Services, Steve Buerki, will be on site at the Strategies in Light conference at booth #238. To ensure an in-person meeting with Mr. Buerki, download a free admission pass to the Strategies in Light exhibitors’ show floor.

Assembly Services provides prototyping, test, measurement and production for high accuracy and complex wire and die attach applications. To meet increasing customer demand, additional clean room space was recently added in the California-based laboratory, increasing production capacity by 50%. Assembly Services expertise includes development and production for applications such as HB LEDs, RF power modules, military hybrids and laser diode packages.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Topics: LED applications, capital equipment, LED packaging, Contract Assembly, contract assembly in microelectronics, HB LED, Strategies in Light, low cost high volume production

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