Wire Bonding & Stud Bumping Technical Track Plus New Product Demos at IMAPS 2013

Posted by Katie Finney on Tue, Sep 24, 2013

Carlsbad, CA – September 24, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced new product demos at IMAPS 2013. The 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM) will be showcased through live demonstrations in booth #511 on October 1-2 at the Rosen Centre Hotel in Orlando, FL.

Wire Bonding & Stud Bumping Technical Track
Dan Evans (Palomar Technologies Senior Scientist) and Lee Levine (Process Solutions Consulting) will co-chair the Wire Bonding and Stud Bumping technical track. This session track covers non-destructive testing challenges and methods of wires and bond pads, Pd-coated Cu wire process window optimization, Cu wedge bonding, Al and Ag based wires as alternatives to copper, plus hybrid wire bond capabilities. Evans and David Rasmussen (Palomar Technologies Assembly Services™ General Manager) will present “Multipurpose Wire Bonding - Bumps, Wires, Combination Interconnects, and Operation Efficiency” at 4:30 PM - 4:55 PM on Tuesday, October 1.

Test Drive New Wire Bonding Software at IMAPS 2013 

IMAPS 2013 attendees are able to test drive i2Gi (cleverly pronounced “iggy”) in booth #511 throughout the duration of the exhibit hall. i2Gi is implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. 

i2Gi demo 

i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.

i2Gi, intelligent interactive graphical interface, modern wire bond control software

8000i wire bonder, ball bumper, i2Gi

The new 8000i Wire Bonder comes equipped with i2Gi technology. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.  

The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

See i2Gi in Action

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Jessica Sylvester
Marketing Communications Manager
Palomar Technologies, Inc.
jsylvester@bonders.com | +1 760-931-3681

Tags: Announcements, wire bonding, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU), 8000 wire bonder

SEMICON Taiwan 2013 Echoes Increases in Regional Advanced Packaging

Posted by Katie Finney on Tue, Sep 03, 2013

Carlsbad, CA – September 3, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced live demonstrations of new products and solutions at SEMICON Taiwan 2013, held in Taipei on September 4-6 at the TWTC Nangang Exhibition Hall.

SEMICON Taiwan 2013 will spotlight the latest developments in processes, equipment, materials, and emerging market opportunities in microelectronics manufacturing from more than 650 exhibiting companies and more than 50 hours of technical and business forums.

The technical programs will be supported by specialized exhibit theme pavilions focused on critical manufacturing technologies and markets, including:

 3D IC, stacked die


Taiwan is situated in the strategic location of the world's IC packaging and testing industry, with some of the world's largest packaging and testing companies, reaching a global packaging and testing foundry market share of over 50%. According to an ITIS second quarter forecast this year, the Taiwan IC packaging and testing industry will significantly grow by 15.5%, and the driving force is due to growing demands from the networking, graphics, wireless, computing device, and mobile handsets markets.
[read more: http://www.semi.org/en/node/46661]

"While the global market is looking towards recovery in 2014, Taiwan is building its strength and growing now," said Terry Tsao, president of SEMI Taiwan. He adds, "New electronic products and technologies, including mobile devices and 3D printing, are creating entirely new opportunities for microelectronics and driving the need to push the limits of Moore's Law to enable the next generation of innovations. The technologies, companies, and people that will get us there are the highlight of SEMICON Taiwan".
[read more: http://www.semi.org/en/node/46201]

8000i wire bonder, i2Gi, wire bonder, ball bumper

Palomar Technologies will demo the new 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM) technologies with Supremetec Materials, Inc. (SMI), booth #41. In addition, Palomar Technologies’product and solution portfolio will be showcased with Taiwan Kong King (TKK), booth #516.

 

i2Gi supports modern automated wire bonding for complex hybrid production. Watch the video:

Palomar Technologies recently announced the opening of its new demonstration and applications development office, located in Singapore

The new Palomar Asia facility builds upon the established base of customer support, evolving into a “one-stop shop” to offer full-capacity support. For example, the new facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.

 Assembly Services data sheet

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: http://www.palomartechnologies.com/contact-palomar-technologies-asia

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Palomar Asia Contact
Mr. PH Chan
Managing Director
phchan@bonders.com
(+65) 6686-3096

Palomar Technologies Media Contact
Mrs. Jessica Sylvester
Marketing Communications Manager
jsylvester@bonders.com
+1 (760) 931-3681

Tags: LED applications, refurbished bonders, Assembly Services, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU), SEMICON Taiwan 2013, MEMS devices, 3D Packaging

New Palomar Asia Facility for Demonstrations, Support & Training

Posted by Rich Hueners on Tue, Aug 06, 2013

Carlsbad, CA – August 6, 2013 –Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the opening of its new demonstration and applications development office, located in Singapore, effective immediately.

Palomar Technologies opening Ribbon Cutting Palomar Technologies Asia Singapore office reveals company logo

Palomar Technologies (SE Asia) Pte Ltd., (“Palomar Asia”) has been headquartered in Singapore since its establishment in August 2000—five years after Palomar Technologies, Inc., evolved as a former subsidiary of the Hughes Aircraft’s Industrial Product Division. Since the initial opening of Palomar Asia, the office has generated substantial business growth year-after-year and quickly became recognized for its superior support of Asia-Pacific customers requiring automated wire bond and die attach equipment.

The new Palomar Asia facility builds upon the established base of customer support, evolving into a “one-stop shop”  to offer full-capacity support. For example, the new facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.

Process Development Services data sheet

 

The automated microelectronics manufacturing requirements for the APAC region spans markets from aerospace/defense, optoelectronic, LED, RF/Wireless and medical for high-accuracy die attach and high-reliability wire bonding. Even amidst recent world-wide economic strain, the APAC region has rapidly grown for Palomar Asia—for both personnel and customer installed base. Palomar Technologies’ most popular large work area die attach platform—the ultra-flexible 3800 Die Bonder— and the “workhorse” Au wire/ball bump, deep access platform—the 8000 Wire Bonder—have continually exceeded customer expectations for quality, accuracy and process expertise support.

At SEMICON West 2013 in San Francisco, CA, Palomar Technologies launched the new 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM). Cleverly pronounced “iggy”, i2Gi is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bondersi2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation. 

Click here to read the launch press release for the 8000i Wire Bonder with i2Gi.

To meet the needs of its expanding installed base, Palomar Asia has tripled its workforce, mostly in the ranks of direct field service engineers. “Having direct field service engineers in every region with Palomar Technologies equipment has been key to our success,” affirms PH Chan, Palomar Asia Managing Director. “By offering expert hardware, process and application support directly to our customers, we are able to quickly resolve the most complex microelectronic assembly challenges at our customer’s sites.”

Since his arrival at Palomar Asia in 2010, Mr. Chan has developed and expanded a local APAC Spare Parts Depot, increased the number of APAC sales representatives and accelerated the regional marketing presence in Asia’s largest industry tradeshows.

August 2013 marks the beginning of a new era for Palomar Asia. The new Palomar Asia facility offers a new clean room and demonstration laboratory, outfitted with wire bonding and die attach capabilities, as well as measurement and test equipment.

The 8000i Wire Bonder was showcased at the Palomar Asia office grand opening event, held on Friday, August 2. The event hosted customers, suppliers and friends of Palomar Asia and included opening ceremonies such as traditional Chinese lion dance and pineapple roll for good luck.

Palomar Technologies Singapore microelectronics manufacturing center new Palomar Technologies Asia Singapore office opens with traditional Chinese prosperity ceremonies

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: http://www.palomartechnologies.com/contact-palomar-technologies-asia

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Palomar Asia Contact
Mr. PH Chan
Managing Director
phchan@bonders.com
(+65) 6686-3096

Palomar Technologies Media Contact
Mrs. Jessica Sylvester
Marketing Communications Manager
jsylvester@bonders.com
+1 (760) 931-3681

Tags: 3800 die bonder, Announcements, assembly and packaging, Palomar Asia, demonstrations, training, Assembly Services, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU)

New Products at SEMICON West 2013 – 8000i Wire Bonder with i2Gi(TM) Technology & VisionPilot(TM) Software For Automated Die Attach

Posted by Rich Hueners on Mon, Jul 08, 2013

Carlsbad, CA – July 8, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the launch of new products at SEMICON West 2013: the 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM) and VisionPilotTM for automated high-precision die attach. The 8000i Wire Bonder, i2Gi and VisionPilot will be showcased through live demonstrations in booth #6251 at SEMICON West 2013, July 9-11, at the Moscone Center in San Francisco, CA.

Intelligent Interactive Graphical Interface (i2Gi) on the new 8000i Wire Bonder
i2Gi (cleverly pronounced “iggy”) is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation. 

i2Gi technology supports advanced wire bond control through three key critical command tools, which work in concert to provide a dynamic and intuitive user experience.

  1. Part Tree Display defines relationships between part programming objects: parts, wires, pads
  2. Part Graphical Display provides geometric representation of the overall XY workspace and package elements
  3. Man-Machine Interface (MMI) + Video Graphical Display enables interaction with live video for teaching and locating parts combined with a graphical overlay representation of the program.

i2Gi 8000i 3components

The new 8000i Wire Bonder comes equipped with i2Gi technology. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

Three Common Configurations of the 8000i Wire Bonder with i2Gi Technology

8000i handlers small
Automated production line with customizable magazine handlers and hotrail conveyors. Ideal for high-mix, complex automated production.

8000i Ergo Technician small
Ergonomic kit that supports both traditional keyboard and track-ball or a large glove- touch compatible touch screen (optional). Ideal for complex programming and intuitive control of part builds.

8000i rightview small
Standard for reduced footprint and automated production scalability. Ideal for complex hybrid device packaging with flexibility to meet changing production needs.

VisionPilot with Radar ReferencingTMGeometric Pattern Matching Vision Software for Automated Die Attach
VisionPilot utilizes advanced geometric pattern matching technology to reliably and accurately locate parts. Even under the most challenging conditions, this exclusive Palomar Technologies software can significantly reduce or eliminate fixturing requirements and cost.

VisionPilot technology combined with Radar Referencing solves the most demanding die finding scenarios. Radar Referencing—built upon Cognex PatMaxTM—uses a set of boundary curves that are not tied to a pixel grid and then looks for similar shapes in the image without relying on specific gray levels. The result is a revolutionary improvement in the ability to accurately find objects despite changes in angle, size, and shading.

VisionPilot PatMax based vision system for die attach

Unlike with traditional auto correlation, which does not utilize image angle, 1-Point Radar Referencing finds image XY location and angle orientation at the same time allowing higher machine throughput by using only one reference to find a die.

VisionPilot is easy to incorporate into new or existing programs. The existing programs can remain the same and an additional Radar Referencing location can be added to an existing type. Programming Radar Referencing is very similar to programming auto correlation. The images are taught the same way as auto correlation with some slight changes in the parameter settings.

Benefits of VisionPilot

  • Finds images at any orientation–complete 360° (+/-180°)–compared to +/-7° for auto correlation
  • Less light sensitive
  • Less sensitive to part variations
  • Minimizing the number of required references may increase throughput

For a more in-depth overview, download the technical resources:

8000i wire bonder, ball bumper, i2Gi

8000i Wire Bonder Data Sheet

VisionPilot Data Sheet

VisionPilot Data Sheet

i2Gi, intelligent interactive graphical interface, modern wire bond control software

i2Gi Data Sheet

i2Gi, modern wire bond control software, intelligent interactive graphical interface

i2Gi eBook

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: Announcements, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU), VisionPilot, Cognex, SEMICON West 2013