Press Release

Carlsbad, CA – July 3, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the company will be exhibiting live demonstrations on the 3800 Die Bonder and 8000
Posted by Palomar Technologies MarCom Team on Tue, Jul 03, 2012 @ 01:03 PM
Carlsbad, CA – May 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at SMT Nuremberg 2012, May 8-10, with live wire bonder demonstrations.
Posted by Palomar Technologies MarCom Team on Tue, May 01, 2012 @ 05:01 PM
Carlsbad, CA – April 25, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will perform live demonstrations of the 3800 Die Bonder and 8000 Wire Bonder
Posted by Palomar Technologies MarCom Team on Mon, Apr 25, 2011 @ 01:31 PM
CARLSBAD, CA - March 4, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its involvement in the IMAPS Device Packaging conference on March 8-9 in Scottsdale,
Posted by Palomar Technologies MarCom Team on Fri, Mar 04, 2011 @ 02:00 PM