Palomar Technologies Selected as 2012 Exporter of the Year at San Diego North Economic Development Council Annual Business Luncheon

Posted by Palomar Technologies MarCom Team on Tue, Dec 11, 2012

Carlsbad, CA – December 11, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, was selected as the winner of the 2012 Exporter of the Year award, presented at the San Diego North Economic Development Council (SDNEDC) Annual Business Luncheon.

Palomar Technologies was nominated for the 2012 Exporter of the Year by the WORLD TRADE CENTER San Diego (WTCSD) executive vice president, Mr. Hugh Constant. “There is a concentration of small and medium-sized enterprises in Oceanside, Carlsbad, Vista, San Marcos, Escondido, Poway and Rancho Bernardo, with more than 350 companies actively trading internationally” noted Constant, who also presented the award. “Palomar Technologies stood out in this crowded field because of its exceptional success in developing export markets for its products in more than 30 countries over the past five years.”

SDNEC Awards Luncheon ExporteroftheYear2012

Originally founded in the 1970s as a division of Hughes Aircraft in San Diego County, Palomar Technologies is one of the few remaining US-based manufacturers of high-precision, automated microelectronics packaging equipment. Headquartered in Carlsbad, CA, Palomar Technologies supports needs of thousands of organizations around the world for micro-/optoelectronics process development and production requirements in the telecommunications, medical, defense, aerospace and commercial high-technology industries.

Palomar Technologies’ value is providing a complete product and service solution coupled with knowledge of microelectronics material and assembly processes. The company competes on the global stage, with more than 70% of final product exported. A worldwide team of Field Services engineering experts supports the large installed base of customers, providing decades of process expertise and a deep understanding of production needs through one-on-one support.

With a balanced focus between both “on-shore” manufacturing and exporting, involvement with the SDNEDC and the WTCSD is a natural decision to further the company’s growing international business efforts. Palomar Technologies has been an active participant in WTCSD events and programs since 2004, supporting several events each year.

SDNEC holds the annual luncheon to recognize San Diego North’s business, elected, public sector and media leaders for their contributions to the region. According to SDNEC, “each December, nearly 500 SDNEDC members and guests are invited to enjoy a seasonal lunch, a keynote address by a distinguished community member and a prestigious award presentation to celebrate the accomplishments of businesses and individuals in San Diego’s North County.”

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About WORLD TRADE CENTER San Diego
WORLD TRADE CENTER San Diego (WTCSD) is a non-profit trade association that provides comprehensive international trade services and key global contacts to facilitate and expand trade for regional worldwide clients. Leveraging its global network of World Trade Centers and affiliate partners, WTCSD is the proven forum for international information, communications and connections. WTCSD is licensed by the World Trade Centers Association (WTCA) in New York City and is affiliated with an international network of over 1 million international members and patrons. For more information, please visit us at www.wtcsd.org.

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Tags: Announcements, automated component placement systems, automated packaging systems, Assembly Services, Awards, Exporting, World Trade Center San Diego

High-Accuracy Processes for RF, Optoelectronics & Automotive Microelectronics Assembly

Posted by Palomar Technologies MarCom Team on Thu, Sep 06, 2012

Carlsbad, CA – September 6, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that lead engineers will be presenting three highly technical talks at the IMAPS 2012 conference, held September 11-13 at the San Diego Town & Country Convention Center. Palomar Technologies will exhibit in booth #322.

1. High-Reliability Component Attachment Process for <5μm Placement Accuracy
Speaker: Donald J. Beck

2. Mixed Attachment Technology Studies in RF & Optoelectronic Packages Requiring High-Accuracy Placement

Speaker: Daniel D. Evans, Jr.

3. Gold Ball Wire Bonding with Heated Tool for Automotive Microelectronics
Speaker: David J Rasmussen

The complete IMAPS session agenda is available online at http://www.imaps.org/programs/IMAPS2012.pdf.

Palomar Technologies has also collaborated with IMAPS to host an on-demand webcast on "High-Reliability Component Attachment Process for <5um Placement Accuracy". Palomar Technologies Assembly Services general manager originally presented the webcast live in mid-June. The complimentary webcast recording is available at http://www.imaps.org/webcasts/2012may_palomar.htm

Palomar Technologies is accepting meeting requests throughout the duration of IMAPS 2012. Requests may be submitted online at http://www.palomartechnologies.com/contact-us.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: RF Packaging, gold ball bumping, optoelectronic packaging, gold ball bonder, eutectic soldering process, automated component placement systems, automated packaging systems, assembly and packaging, IMAPS, eutectic diagrams, eutectic tutorial, optoelectronic, RF devices

Live Wire Bonding & Die Attach Demonstrations in Booth #6157 at SEMICON West 2012

Posted by Palomar Technologies MarCom Team on Tue, Jul 03, 2012

Carlsbad, CA – July 3, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the company will be exhibiting live demonstrations on the 3800 Die Bonder and 8000 Wire Bonder at SEMICON West 2012, July 10-12 in San Francisco, CA, in booth #6157.

die attach demonstrationThe 3800 Die Bonder demonstration will reveal a fully automated component attach program highlighting the flexibility and high precision of the sub-5μm placement accuracy (application dependent) die attach system. The 3800 Die Bonder has a large 35.5" x 20" large work area to accommodate various presentation tools, a steady state and a pulsed heat system for eutectic bonding, multiple dispense technologies, die ejectors and Cognex Vision System on a single platform. The sturdy mechanical structure, process camera, quiet linear motors, 0.1μm linear XY encoders and direct measure 0.00023 degree rotary encoder are some of the sophisticated features available on this ultra-flexible die attach system.

8000 wire bonder head tool turretThe 8000 Wire Bonder will feature a fully automated wire bond, stitch-bond, chain bond and ball bump demonstration program, showcasing the bonder’s diverse application packaging capabilities. A ball bumper and stud bumper configuration of the 8000 Wire Bonder is a unique feature of this system—the wire bonder is the only available system that can produce co-planarized gold bumps in one step. The 8000 Wire Bonder is capable of deep access wire bonding up to 13.5mm. This fully automatic, thermosonic, high-speed ball-and-stitch gold bumper improves production yields and eliminates sources of variation in microelectronics packaging processes.

Palomar Technologies Assembly ServicesTM ("Assembly Services") is the contract assembly, process development, test and prototyping division of Palomar Technologies, ensuring strict IP protection, in-house highly skilled engineering staff and technicians, and a product suite of high-reliability, ultra high-accuracy advanced packaging systems. Assembly Services’ example capabilities—including flip chip, wafer level packaging, pick-and-place, deep access wire bonding and complex packaging processes—will be headlined throughout the Palomar Technologies exhibit space.

Palomar Technologies is accepting meeting requests throughout the duration of SEMICON West 2012. Requests may be submitted online at www.palomartechnologies.com/contact-us.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, Announcements, wire bonders, how to buy a bonder, Automation, ball bumping, automated component placement systems, automated packaging systems, assembly and packaging, demonstrations, 8000 wire bonder, automation vs. manual, wire bond demo, SEMICON West 2012, micron level placement, high precision die attach

National Hockey League Uncompressed HD Video Goal Capturing Enabled by Palomar Technologies and VubIQ

Posted by Palomar Technologies MarCom Team on Tue, Apr 10, 2012

Carlsbad, CA – April 10, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its collaboration with VubIQ, Inc., to enable the new HD video capturing system for the National Hockey League (NHL) in-goal cameras.

After completing a rigorous series of prototype testing and field trials with Palomar Technologies Assembly ServicesTM (“Assembly Services”), VubIQ was given an order to equip all 30 NHL venues throughout the U.S. and Canada with GoalCam systems. Each system is comprised of two units: a GoalCam unit (HD camera and 60 GHz transmitter) and a 60 GHz receiver unit. Additionally, each unit is designed to incorporate future Wi-Fi upgrades, allowing for remote wireless adjustment of seven different functions: camera pan, camera tilt, RF antenna pan, RF antenna tilt, HD camera focus, HD camera iris, and HD camera zoom.

“Historically, the NHL had difficulties verifying whether or not a “close call” was an actual goal, and lacked a consistent or reliable vetting method. VubIQ received an order to provide systems to the NHL for highly reliable goal adjudication,” stated Adam Button, CEO of VubIQ. “With cameras far overhead positioned in various angles around the rink, the puck could not be video recorded at a close distance or in high resolution as it crossed (or did not cross) the goal line. Until now, goal judges positioned behind each goal during games typically made the call by switching on a red flashing light; but these judges did not have the luxury of instant replay or precise slow motion (forward or reverse) to assist with close calls. Now, however, with our GoalCams positioned inside the goal itself, and transmitting the uncompressed HD video wirelessly to the judging booth, it is as though the goal judges are literally right on top of the action—only with the additional benefit of slow-motion, back-and-forth replay in full HD.”

Since a cabled solution to this problem would not be feasible, an extremely high bandwidth wireless system was required. Marketing the GoalCam technology though its OEM distributor, VidOvation, Vubiq provides the NHL with an elegant wireless solution utilizing the unlicensed 60 GHz spectrum that addresses two key issues—achieving the highest possible video quality and eliminating transmission interference.

Assembly Services supported VubIQ through the development and optimization of precision die attach processes and the parameters for all wire interconnecting and encapsulation processes to assemble the components for the GoalCam transmitters (TX) and receivers (RX).  Assembly Services also managed the substrate attach process and final documentation of all final module packaging processes where the completed sub-assembly is mounted onto aligning hardware.


About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About VubIQ

VubIQ, headquartered in Aliso Viejo, California, is a millimeter wave technology company specializing in the development of components and final products utilizing 60 GHz silicon transmitters and receivers. While there is a strong worldwide effort to develop the silicon by major fabrication houses, no other company has achieved the capability of effectively packaging that silicon into efficient, low cost, and highly manufacturable products. VubIQ has five issued patents and six others in process. The technology underlying all of VubIQ’s current and future product offerings utilizes millimeter wave radio frequencies to transmit and receive signals and data at extremely high data rates, in a very small form factor, and at low cost.

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Tags: 3800 die bonder, Announcements, applications, automated component placement systems, automated packaging systems, assembly and packaging, 8000 wire bonder, Application Process, HD Camera, VubIQ

Palomar Technologies 3800 Die Bonder Offers Flexible Solutions to Support LED Development in China

Posted by Palomar Technologies MarCom Team on Mon, Mar 12, 2012

Carlsbad, CA – March 13, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit with Asia Science and Technology (AST) at SEMICON China 2012, held in Shanghai on March 20-22.

Palomar Technologies, Hybond and AST will exhibit together in booth #3153 in Hall E3. A Palomar 3800 Die Bonder and manual Hybond equipment will be on-site for demonstrations.

Mr. PH Chan, Palomar Technologies Asia Director, recently wrote a blog summarizing the LED markets in Asia, specifically recounting how LEDs relate to China’s 12th five-year plan.

“By 2015, China intends its manufacturing standards to be globally viable for the volume production market. By that time, China’s LED industry is estimated to reach $75 billion,” stated Mr. Chan. “The 3800 Die Bonder is capable of ultra-high precision and high-reliability eutectic and epoxy die attach processes. This robust system is in production with several major players in the Asia-based LED market today. The 3800 Die Bonder embodies great versatility to accommodate multiple processes on a single 710in2 work envelope as well as tremendous flexibility to remain vigilant for the future of component packaging.”

Mr. Chan will be attending SEMICON China and is available during the conference for any on-site meetings.

In addition to the ultra-flexible 3800 Die Bonder, Palomar Technologies offers several complementing bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the 8000 Wire Bonder is a large area, high-reliability wire bonder and ball bumper with deep access capabilities. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, wire bonder, wire bonds, wire bonding, LED matrix assembly, LED applications, wire bonders, capital equipment, LED packaging, wafer scale packaging, automated component placement systems, automated packaging systems, Hybond, 8000 wire bonder, 6500 die bonder, automation vs. manual, field services support, Bonder Boot Camp, made in china, SEMICON China, wire bond testing

Palomar Technologies Named TechAmerica High Tech Awards 2011 Finalist

Posted by Palomar Technologies MarCom Team on Thu, Oct 20, 2011

Awards Event to Showcase San Diego’s Finest Technology Companies

Carlsbad, CA – October 20, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it has been selected as a finalist in the Semiconductors category for the upcoming 18th Annual TechAmerica High Tech Awards. As the leading voice representing the U.S. technology industry, TechAmerica takes pride in recognizing outstanding regional companies every year at its annual awards ceremony. Finalists will be acknowledged for their achievements during a luncheon reception on October 28th at the Hilton La Jolla Torrey Pines in La Jolla, CA.

“Palomar Technologies specializes in automated high-precision die attach and wire bonding systems for microelectronic production. Our team of experts is constantly pushing the envelope to help our customers create that ‘next big thing’,” stated Bruce Hueners, president and CEO of Palomar Technologies. “Our fellow 2011 TechAmerica finalists are a remarkable group of San Diego’s semiconductor organizations, and Palomar is proud to be recognized among them.”

Palomar Technologies was selected as a finalist in the Semiconductor category for its high-accuracy wire and die attach services via fully automated component packaging systems and precision contract assembly, process development, test and prototyping divisions.

This year, several San Diego-based companies were nominated for their technological or business innovation; exceptional products or service; product marketplace validation; perseverance in the face of adversity; and community involvement for consideration in nine categories.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About TechAmerica
TechAmerica is the driving force behind productivity growth and jobs creation in the United States and the foundation of the global innovation economy. Representing approximately 1,500 member companies of all sizes from the public and commercial sectors of the economy, it is the industry’s largest advocacy organization and is dedicated to helping members’ top and bottom lines. It is also the technology industry's only grassroots-to-global advocacy network, with offices in state capitals around the United States, Washington, D.C., Europe (Brussels) and Asia (Beijing). TechAmerica was formed by the merger of AeA (formerly the American Electronics Association), the Cyber Security Industry Alliance (CSIA), the Information Technology Association of America (ITAA) and the Government Electronics & Information Technology Association (GEIA). Learn more at www.aeanet.org or www.itaa.org.

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Tags: Announcements, capital equipment, semiconductor industry, automated packaging systems, TechAmerica, Awards

Palomar Technologies Presents Latest Version of Award-Winning Automatic 3500-III Die Bonder

Posted by Palomar Technologies MarCom Team on Mon, Mar 12, 2007

Designed for fully automatic, high accuracy, precision microelectronics assembly, the flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area. Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules, and hybrid microcircuits.

The 3500-III is capable of performing automated eutectic die attach utilizing backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets. Palomar’s patented eutectic process is key for high yield and reliability because eutectic die attach is one of the most difficult processes to control. Palomar’s pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.

Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-III’s sub-micron axis resolution yields typical placement repeatability of better than ±12 micron (0.5 mil), 3 sigma with fluids, ±5 micron (0.2 mil), 3 sigma with pulse heat eutectic applications.

With the 3500-III, placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms. Relative-to-die placement algorithms place the die so that the second, third, and each die or substrate thereafter is placed relative to the final location of the last placed component rather than the package. This provides greater accuracy from component to component. It also controls the subsequent wire length and position, ensuring that the wires are parallel and the lengths are the same, factors important for high frequency electrical performance.

The machine base is a honeycomb core optical table that provides vibration damping and thermal settling response superior to granite. Its work area is the largest available. The cantilever design permits unobstructed, open access on three sides for set-up. Soft touchdown or non-contact laser height sensing mechanisms assist in precise pickup and placement of fragile devices such as gallium arsenide. An 8-position turret head can rapidly change tools on the fly without a space and time-consuming tool dock assembly.    Because it is constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.

The 3500-III employs an infrared light curtain around the entire open perimeter of the assembly cell. This safety curtain sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation. When the system is in operation and the safety curtain is violated, the system immediately (within ~ 3 milliseconds) shorts the inputs to the digital servo driven motors, bringing all motion to a near instant stop.

The system uses a Windows XPTM operating system, employing Cognex Corporation’s latest Series 8000 gray-scale pattern recognition systems. The graphical, user-friendly interface assists in bonding set-up, operation, diagnostics, and calibration.The new, high-visibility, flat screen displays on the 3500-III greatly improve the unit’s ergonomics. It is SMEMA compatible and can be configured with loaders to provide small island operations or complete in-line system
solutions. From wafer to eutectic die attach, handling options are fully programmable.

“The Model 3500-III is a workhorse machine, yet it is the most flexible, precise, accurate die bonder available,” said Palomar Technologies president, Bruce Hueners. “It has been referred to as the ‘Swiss Army Knife of bonders’.”

Customers seeking to extend the service life and increase productivity of their Model 3500-II Automatic Component Placement Systems can now order a 3500-III upgrade directly from Palomar and achieve the same high level of reliability and productivity as a new Model 3500-III. The 3500-III upgrade includes a faster 32-bit computing system, Windows XP operating system, faster and more versatile Cognex 8000 Pattern Recognition system, energy-efficient space- saving flat panel displays, and a suite of powerful software tools featuring Bond Data Miner (BDM) which includes improved process development tools, automated SPC data documentation and component traceability. Customer trials indicate an increase in productivity measured in raw throughput of up to 18%, depending on materials and application.

About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the photonics, wireless, microwave, automotive, aerospace, medical, and life sciences industries.


Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, and active optical align and attach. Palomar’s Process Development and Prototyping Services assists companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. For more information, visit www.palomartechnologies.com or contact 760-931-3600.

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Let Us Help You
We would be happy to evaluate your process application need and propose a solution. Please call us at (760) 931-3600.

Tags: die bonders, eutectic die attach, die bonding, automated component placement systems, automated packaging systems, Epoxy Die Attach, 3500 Die Bonder, eutectic process, die bonder

Honored for 3500-II Die Bonder Automatic Component Placement Cell

Posted by Palomar Technologies MarCom Team on Sat, Jul 01, 2006

Carlsbad, Calif. –Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announces that it received the Editors’ Choice Best Product Award for its Model 3500-II Automatic Component Placement Cell. Presented annually by Semiconductor International magazine, the award honors products that are making a difference in semiconductor manufacturing.

Palomar Technologies received the award in a ceremony held July 12, 2006 during the SEMICON West trade show in San Francisco, California. This is the second consecutive year, and the third time, that Palomar has won this award.

The Model 3500-II is designed for fully automatic, high accuracy, precision microelectronics assembly. The flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area. Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-II sub-micron axis resolution yields typical placement accuracies of better than ±12 micron (0.5 mil), 3 sigma. Applications include flip chip, stacked die, chip-on-board, fine pitch surface mount, multi-chip modules, microwave modules, and hybrid microcircuits.
Palomar's team, including some of its most experienced engineers, consistently improves this multi-functional, multi-dimensional, flexible tool to push the limits on speed and accuracy. The Model 3500-II represents the latest development in Palomar’s long history of manufacturing automatic placement systems. Beginning with the Model 2500, the technology has grown and evolved into what is now the dynamic and highly customizable Model 3500-II that Palomar continues to improve. A new generation system, the Model 3500-III is ready for introduction.

"Advances in semiconductor technology are only possible because of the kinds of products being honored in this year's Editors' Choice Best Product Awards program," said Pete Singer, Editor-in- Chief of Semiconductor International. "Chipmakers rely on these products to create electronics that are smarter, smaller, faster, less expensive, and more reliable. We congratulate the people and the companies that have had the insight and fortitude to bring these products to the market."
Semiconductor International, published by Reed Business Information and a part of Reed Elsevier's global array of information products, is the leading technical publication reaching and covering the global semiconductor manufacturing industry. It has the largest circulation to semiconductor manufacturers of any industry publication.

About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the semiconductor, photonics, wireless, microwave, automotive, aerospace, medical, and life sciences industries.

Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, ball bumping, and active optical align and attach. Palomar’s Process Development and Prototyping Services assist companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. For more information, visit www.PalomarTechnologies.com or contact 760-931-3600.

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Let Us Help You
We would be happy to evaluate your process application need and propose a solution. Please call us at (760) 931-3600.

Tags: bonders, die bonders, eutectic die attach, die bonding, automated component placement systems, automated packaging systems, Epoxy Die Attach, 3500 Die Bonder