Palomar Technologies gibt die Teilnahme an der Productronica 2011 bekannt und stellt Large Work Area Wire- u. Die Bonder vor

Posted by Rich Hueners on Tue, Nov 08, 2011

Carlsbad, CA –  8 November 2011 – Palomar Technologies gibt heute ihre Teilnahme an der Productronica in München vom 15.-18.November 2011 bekannt.

Sie finden den weltweit führenden Hersteller für vollautomatische und hochpräzise Fertigungsanlagen (Wire- und Diebonder) in Halle B2, Stand 315.

Die Anlagen von Palomar kommen für die verschiedensten Anwendungen in der Hybrid- und Halbleiterindustrie zum Einsatz.

“Palomar Technologies hat eine jahrzehntelange Erfahrung und anerkannte Fachkompetenz in den Bereichen Entwicklung, Konstruktion, Automatisierung und Meßtechnik auch für schwierigste Applikationen in der Wire- und Bestückungstechnologie“, sagte Josef Schmidl, Geschäftsführer der Palomar Technologies GmbH. “Unsere Modelle 8000 Wire Bonder sowie  3800 Die Bonder repräsentieren heute den neuesten Stand in der Wire-/ Diebond Technik. Zu den einzigartigen Maschinenkonzepten mit seinen hervorragenden Meß- u. Regelsystem, ermöglichen benutzerfreundliche Softwarelösungen eine einfache Bedienung und sind auch in Bezug auf Durchsatz und Flexibilität konkurrenzlos.”

Das Modell 8000 Wire Bonder, bietet enorme Einsatzflexibilität wie z.B. Deep Access bis zu 19.05mm Bondtiefe, Verwendung von In-Line Magazinsystemen, Erzeugung absolut flacher Stud Bumps (kein Tail), Stand-off-Stitch wires (Plazierung eines Bumps vor dem Draht) und vieles mehr. Bei einer Bondgeschwindigkeit von bis zu 0.125s/ Draht (0.077s/ Bump) und einer Gesamtgenauigkeit von ±2.5µ, 3Sigma, erzielt der 8000 Ballbonder höchste Erträge und wird daher für die Verarbeitung hochkomplexer Hybride, MCM’s usw. eingestzt.

Das Model 3800 Die Bonder ist ein vollautomatisches, extrem flexibles Pick and Place System mit einer Plaziergenauigkeit von ±7µ und einer Wiederholgenauigkeit von 3.5µ, bei 3sigma.

Der Diebonder wurde kürzlich mit dem 2011 New Product Introduction Award für seine Leistungsfähigkeit und Einsatzflexibilität ausgezeichnet, da mit ihm auch Prozesse wie eutektisches AuSi/ AuSn Löten durchgeführt werden können.

Zurzeit läuft eine Umtausch-/ Rücknahme Aktion des bewährten Vorgängermodells 3500-III gegen den Kauf eines neuen Modells 3800 (Palomar Technologies’ Bonder Buy-Back Program).

Palomar Technologies

Palomar Technologies, ein früheres Tochterunternehmen von Hughes Aircraft, ist der weltweit führende Hersteller von vollautomatischen, hochpräzisen Large Area Die- u. Wirebonder sowie Anbieter von Dienstleistungen (Produkt-/ Prozessentwicklung, Fertigung) in diesen Bereichen.

Kunden setzen die Systeme und Dienstleistungen von Palomar Technologies ein um den heutigen komplexen Anforderungen in der Mikroelektronikfertigung gerecht zu werden.

Weitere Informationen finden Sie bitte auf der Website www.palomartechnologies.com.

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Kontakt Palomar Technologies GmbH (Europe)
Josef Schmidl
Managing Director, Palomar Technologies GmbH
jschmidl@palomartechnologies.de | 49-9131-48009-30                                      

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Carlsbad, CA – November 8, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit in Hall B2, Booth 315 at Productronica 2011, held in Munich, Germany on November 15-18.

“Palomar Technologies has a long-standing presence as an industry expert in design, engineering, automation and metrology for even the most complex component placement and wire bonding applications,” said Josef Schmidl, managing director of Palomar Technologies GmbH. “Our 8000 Wire Bonder and 3800 Die Bonder  represent the latest advances in wire- and die bonding technology, incorporating leading-edge mechanical design, control architecture and user-friendly GUI to provide the highest net throughput and flexibility of any comparable tool on the market today.”

The 8000 Wire Bonder offers tremendous versatility with capabilities including deep access wire bonding of 11.10 to 19.05mm, automated in-line and magazine handlers, tailless bump mode and improved reliability with stand-off stitch wires. With cycle times up to 0.125 sec/wire and 0.077 sec/bump, and a placement accuracy of +/- 2.5 micron, 3 sigma, the overall precision of the 8000 Wire Bonder results in high-yield processing of fine-pitch high wire count applications and is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

The 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction Award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Current owners of 3500-III Die Bonders have the opportunity to trade in their system for substantial credit towards the 3800 Die Bonder through Palomar Technologies’ Bonder Buy-Back Program.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, trade shows, bonder buying options, 8000 wire bonder, productronica, Bonder Buy Back Program, AuSn

Palomar Technologies Discusses Pulsed Heat Eutectic Solder and Chain Wire Bonding for HB LEDs at IMAPS 2011

Posted by Rich Hueners on Tue, Oct 04, 2011

Carlsbad, CA – October 4, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at IMAPS 2011 in Long Beach, California on October 11-13, in booth #231.

Palomar Technologies is presenting two HB LED technical papers in the Advanced Technologies Track at IMAPS 2011. Palomar Assembly ServicesTM general manager, Donald Beck, has co-authored “High-Yield Process Improvements for High-Reliability HB-LED Automated Assembly” and “Evaluation of AuSn Eutectic Die Attach Materials Designed for High-Brightness LED Packaging.” Beck will be on-site at IMAPS to discuss recent advancements in the LED industry.

“Today’s HB LED applications require maximum thermal transfer to achieve performance results. Precision eutectic soldering provides high-quality, low-risk performance,” stated Beck. “Reaching performance and cost targets requires continuous improvements in LED devices and packaging designs. Close LED proximity is one of several paths that help to extract every possible lumen per watt. This is best achieved using a pulsed heat eutectic die attach and chain wire bonding.”

Palomar Technologies offers a Pulsed Heat System (PHS), designed especially for the ultra-flexible 3800 Die Bonder. The PHS allows for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. Computer-controlled software provides a highly regulated temperature profile and data feedback throughout the process.

Chain bonding has become a reliable and cost-effective alternative to wedge bonding. Using ball bond technology on the high-reliability 8000 Wire Bonder, chain bonding follows a ball-loop-stitch-loop-stitch process, producing “chains” of loop shapes traditionally generated by a wedge bonder. Wedge emulation with a ball bonder using chain bonding can be an excellent alternative to using a wedge bonder to perform interconnects. To learn more, download "The Great Debate: Ball vs. Wedge" technical paper.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, LED matrix assembly, trade shows, 8000 wire bonder, IMAPS, HB LED, AuSn, hi-rel wire bonds

Palomar Technologies Exhibits at SEMICON West 2011 and Offers Trade-In Credit for Used Die Attach Systems

Posted by Rich Hueners on Sat, Jul 09, 2011

Carlsbad, CA – July 7, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at SEMICON West 2011 in San Francisco, CA from July 12-14 in booth #5780.

“Palomar Technologies has been a 35-year SEMICON West exhibitor,” states Bruce Hueners, president and CEO of Palomar Technologies. “Our teams are looking forward to discussing product advancements and microelectronic packaging solutions to a high-caliber and captive audience—it is through this environment that the real-life challenges of microelectronic assembly services are met.”

The 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction Award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Current owners of 3500-III Die Bonders have the opportunity to trade in their system for substantial credit towards the 3800 Die Bonder through Palomar Technologies’ Bonder Buy-Back Program.

The Bonder Buy-Back Program offers engineering support for a seamless transition of production programs to the latest in automated die attach systems. The 3800 Die Bonder expands on the proven technology of ultra-high-accuracy die bonder series, backed by decades of industry expertise and evidenced by performance in demanding production facilities worldwide at better than 90% uptime.

At a Glance: Ultra-Flexible 3800 Die Bonder

  • Winner—2010 Global Technology Award
  • Winner—2011 New Product Introduction Award
  • Latest technology with advancements in mechanics, software and ergonomic technologies
  • Increased precision and accuracy (+/-7um)
  • Process camera for live view of pick tool
  • User-friendly GUI
  • Integrated Pulsed Heat System client for high-precision eutectic die attach into centralized bonder control system
  • 3500-III programs portable to 3800—seamless transition into production
  • Increased speed for improvements in throughput and yield (application dependent)
  • Quiet high-speed linear motors
  • Familiar large work envelope (35.5” x 20”)

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, die bonders, die bonding, automated component placement systems, bonder buying options, die bonder, Bonder Buy Back Program, SEMICON West 2011, AuSn

Palomar Technologies To Exhibit at Electronic Components and Technology Conference and Discusses HB LED Assembly in Free On-Demand Webcast

Posted by Rich Hueners on Tue, May 24, 2011

Carlsbad, CA – May 24, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at the 2011 Electronic Components and Technology Conference (ECTC) in Orlando, FL, May 31 – June 3.

Palomar Technologies is offering complimentary passes to ECTC 2011. Dale Perry, regional sales manager for the Eastern Americas, will be at booth #419 to discuss the latest features and advancements in high-accuracy die attach and high-precision wire bond and ball bump processes. Palomar Technologies’ 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Visit with Mr. Perry to learn more about the 3800 Die Bonder and its microelectronic packaging capabilities.

Assembly Services (a division of Palomar Technologies) has developed an efficient process flow in HB LED application production. Julie Adams, director of worldwide sales for Assembly Services, will be on-site at ECTC 2011 to engage in discussions regarding precision microelectronic contract assembly solutions. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast “Automated Precision Assembly for High-Volume HB LED.” Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, LED applications, eutectic die attach, eutectic soldering process, LED packaging, eutectic process, die bonder, HB LED, eutectic, AuSn, gold tin die attach, NPI Awards, ECTC

Palomar Technologies To Exhibit at MEPTEC Thermal Symposium and Shares Article on AuSi/AuSn Eutectic Die Attach

Posted by Rich Hueners on Fri, Mar 18, 2011

Carlsbad, CA – March 18, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at the Microelectronic Packaging and Test Engineering Council (MEPTEC) Thermal Symposium on March 21 in San Jose, CA.

Worldwide account manager for Assembly Services, Steve Buerki, will be on site at the MEPTEC Thermal Symposium at booth #16.

Assembly Services is the precision microelectronic contract packaging division of Palomar Technologies. Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is “AuSi and AuSn Eutectic Die Attach Case Studies,” discussing three case studies providing an overview of material selection and methods for optimized utilization of eutectic solders.

Case 1: AuSi (RFSOE) 16 x 63 x 4mil and 31 x 64 x 4mil

Case 2: AuSn (P-Side Down) 12 x 10 x 12mil with preform using pulsed heat top down

Case 3: AuSn (ASIC) 453 x 274 x 12mil with preform using pulsed heat bottom up

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: eutectic die attach, eutectic soldering process, customized packaging solutions, eutectic process, AuSn, eutectic diagrams, eutectic tutorial, Application Process, MEPTEC, gold tin die attach