Visit Palomar Technologies at OFC 2016

Posted by Katie Finney on Tue, Mar 22, 2016

Carlsbad, CA – March 22, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced they are exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) at booth #1814 on March 22-24 in Anaheim, CA. Stop by their booth to learn more about solutions from Palomar Technologies and SST International.

With over 13,000 attendees and over 65 countries represented, OFC is the largest global conference and exposition for optical communications and networking professionals. According to OFC, some of the exhibition’s features this year are:

  • Exhibits from major international companies. Exhibitors include network and test equipment vendors, systems and component manufacturers, fiber cable and specialty fiber manufacturers.
  • Two Exhibit Hall theaters of business programming, featuring presentations by experts from major global brands and key industry organizations.
  • Local Representation from more than 100 California-based companies on the exhibit floor.

Palomar Technologies Solutions
Palomar Technologies’ Assembly Services is a perfect-fit solution for optoelectronic packaging without investing in capital equipment. This minimizes the customer’s project risk and accelerates time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring a sustainable competitive advantage.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

 

Tags: Announcements, Assembly Services, OFC

SEMICON Taiwan 2013 Echoes Increases in Regional Advanced Packaging

Posted by Katie Finney on Tue, Sep 03, 2013

Carlsbad, CA – September 3, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced live demonstrations of new products and solutions at SEMICON Taiwan 2013, held in Taipei on September 4-6 at the TWTC Nangang Exhibition Hall.

SEMICON Taiwan 2013 will spotlight the latest developments in processes, equipment, materials, and emerging market opportunities in microelectronics manufacturing from more than 650 exhibiting companies and more than 50 hours of technical and business forums.

The technical programs will be supported by specialized exhibit theme pavilions focused on critical manufacturing technologies and markets, including:

 3D IC, stacked die


Taiwan is situated in the strategic location of the world's IC packaging and testing industry, with some of the world's largest packaging and testing companies, reaching a global packaging and testing foundry market share of over 50%. According to an ITIS second quarter forecast this year, the Taiwan IC packaging and testing industry will significantly grow by 15.5%, and the driving force is due to growing demands from the networking, graphics, wireless, computing device, and mobile handsets markets.
[read more: http://www.semi.org/en/node/46661]

"While the global market is looking towards recovery in 2014, Taiwan is building its strength and growing now," said Terry Tsao, president of SEMI Taiwan. He adds, "New electronic products and technologies, including mobile devices and 3D printing, are creating entirely new opportunities for microelectronics and driving the need to push the limits of Moore's Law to enable the next generation of innovations. The technologies, companies, and people that will get us there are the highlight of SEMICON Taiwan".
[read more: http://www.semi.org/en/node/46201]

8000i wire bonder, i2Gi, wire bonder, ball bumper

Palomar Technologies will demo the new 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM) technologies with Supremetec Materials, Inc. (SMI), booth #41. In addition, Palomar Technologies’product and solution portfolio will be showcased with Taiwan Kong King (TKK), booth #516.

 

i2Gi supports modern automated wire bonding for complex hybrid production. Watch the video:

Palomar Technologies recently announced the opening of its new demonstration and applications development office, located in Singapore

The new Palomar Asia facility builds upon the established base of customer support, evolving into a “one-stop shop” to offer full-capacity support. For example, the new facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.

  Assembly Services data sheet

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: http://www.palomartechnologies.com/contact-palomar-technologies-asia

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Palomar Asia Contact
Mr. PH Chan
Managing Director
phchan@bonders.com
(+65) 6686-3096

Palomar Technologies Media Contact
Mrs. Jessica Sylvester
Marketing Communications Manager
jsylvester@bonders.com
+1 (760) 931-3681

Tags: LED applications, refurbished bonders, Assembly Services, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU), SEMICON Taiwan 2013, MEMS devices, 3D Packaging

New Palomar Asia Facility for Demonstrations, Support & Training

Posted by Rich Hueners on Tue, Aug 06, 2013

Carlsbad, CA – August 6, 2013 –Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the opening of its new demonstration and applications development office, located in Singapore, effective immediately.

Palomar Technologies opening Ribbon Cutting Palomar Technologies Asia Singapore office reveals company logo

Palomar Technologies (SE Asia) Pte Ltd., (“Palomar Asia”) has been headquartered in Singapore since its establishment in August 2000—five years after Palomar Technologies, Inc., evolved as a former subsidiary of the Hughes Aircraft’s Industrial Product Division. Since the initial opening of Palomar Asia, the office has generated substantial business growth year-after-year and quickly became recognized for its superior support of Asia-Pacific customers requiring automated wire bond and die attach equipment.

The new Palomar Asia facility builds upon the established base of customer support, evolving into a “one-stop shop”  to offer full-capacity support. For example, the new facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.

Process Development Services data sheet

 

The automated microelectronics manufacturing requirements for the APAC region spans markets from aerospace/defense, optoelectronic, LED, RF/Wireless and medical for high-accuracy die attach and high-reliability wire bonding. Even amidst recent world-wide economic strain, the APAC region has rapidly grown for Palomar Asia—for both personnel and customer installed base. Palomar Technologies’ most popular large work area die attach platform—the ultra-flexible 3800 Die Bonder— and the “workhorse” Au wire/ball bump, deep access platform—the 8000 Wire Bonder—have continually exceeded customer expectations for quality, accuracy and process expertise support.

At SEMICON West 2013 in San Francisco, CA, Palomar Technologies launched the new 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM). Cleverly pronounced “iggy”, i2Gi is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bondersi2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation. 

Click here to read the launch press release for the 8000i Wire Bonder with i2Gi.

To meet the needs of its expanding installed base, Palomar Asia has tripled its workforce, mostly in the ranks of direct field service engineers. “Having direct field service engineers in every region with Palomar Technologies equipment has been key to our success,” affirms PH Chan, Palomar Asia Managing Director. “By offering expert hardware, process and application support directly to our customers, we are able to quickly resolve the most complex microelectronic assembly challenges at our customer’s sites.”

Since his arrival at Palomar Asia in 2010, Mr. Chan has developed and expanded a local APAC Spare Parts Depot, increased the number of APAC sales representatives and accelerated the regional marketing presence in Asia’s largest industry tradeshows.

August 2013 marks the beginning of a new era for Palomar Asia. The new Palomar Asia facility offers a new clean room and demonstration laboratory, outfitted with wire bonding and die attach capabilities, as well as measurement and test equipment.

The 8000i Wire Bonder was showcased at the Palomar Asia office grand opening event, held on Friday, August 2. The event hosted customers, suppliers and friends of Palomar Asia and included opening ceremonies such as traditional Chinese lion dance and pineapple roll for good luck.

Palomar Technologies Singapore microelectronics manufacturing center new Palomar Technologies Asia Singapore office opens with traditional Chinese prosperity ceremonies

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: http://www.palomartechnologies.com/contact-palomar-technologies-asia

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Palomar Asia Contact
Mr. PH Chan
Managing Director
phchan@bonders.com
(+65) 6686-3096

Palomar Technologies Media Contact
Mrs. Jessica Sylvester
Marketing Communications Manager
jsylvester@bonders.com
+1 (760) 931-3681

Tags: 3800 die bonder, Announcements, assembly and packaging, Palomar Asia, demonstrations, training, Assembly Services, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU)

Palomar Technologies Selected as 2012 Exporter of the Year at San Diego North Economic Development Council Annual Business Luncheon

Posted by Rich Hueners on Tue, Dec 11, 2012

Carlsbad, CA – December 11, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, was selected as the winner of the 2012 Exporter of the Year award, presented at the San Diego North Economic Development Council (SDNEDC) Annual Business Luncheon.

Palomar Technologies was nominated for the 2012 Exporter of the Year by the WORLD TRADE CENTER San Diego (WTCSD) executive vice president, Mr. Hugh Constant. “There is a concentration of small and medium-sized enterprises in Oceanside, Carlsbad, Vista, San Marcos, Escondido, Poway and Rancho Bernardo, with more than 350 companies actively trading internationally” noted Constant, who also presented the award. “Palomar Technologies stood out in this crowded field because of its exceptional success in developing export markets for its products in more than 30 countries over the past five years.”

SDNEC Awards Luncheon ExporteroftheYear2012

Originally founded in the 1970s as a division of Hughes Aircraft in San Diego County, Palomar Technologies is one of the few remaining US-based manufacturers of high-precision, automated microelectronics packaging equipment. Headquartered in Carlsbad, CA, Palomar Technologies supports needs of thousands of organizations around the world for micro-/optoelectronics process development and production requirements in the telecommunications, medical, defense, aerospace and commercial high-technology industries.

Palomar Technologies’ value is providing a complete product and service solution coupled with knowledge of microelectronics material and assembly processes. The company competes on the global stage, with more than 70% of final product exported. A worldwide team of Field Services engineering experts supports the large installed base of customers, providing decades of process expertise and a deep understanding of production needs through one-on-one support.

With a balanced focus between both “on-shore” manufacturing and exporting, involvement with the SDNEDC and the WTCSD is a natural decision to further the company’s growing international business efforts. Palomar Technologies has been an active participant in WTCSD events and programs since 2004, supporting several events each year.

SDNEC holds the annual luncheon to recognize San Diego North’s business, elected, public sector and media leaders for their contributions to the region. According to SDNEC, “each December, nearly 500 SDNEDC members and guests are invited to enjoy a seasonal lunch, a keynote address by a distinguished community member and a prestigious award presentation to celebrate the accomplishments of businesses and individuals in San Diego’s North County.”

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About WORLD TRADE CENTER San Diego
WORLD TRADE CENTER San Diego (WTCSD) is a non-profit trade association that provides comprehensive international trade services and key global contacts to facilitate and expand trade for regional worldwide clients. Leveraging its global network of World Trade Centers and affiliate partners, WTCSD is the proven forum for international information, communications and connections. WTCSD is licensed by the World Trade Centers Association (WTCA) in New York City and is affiliated with an international network of over 1 million international members and patrons. For more information, please visit us at www.wtcsd.org.

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Tags: Announcements, automated component placement systems, automated packaging systems, Assembly Services, Awards, Exporting, World Trade Center San Diego