National Hockey League Uncompressed HD Video Goal Capturing Enabled by Palomar Technologies and VubIQ

Posted by Palomar Technologies MarCom Team on Tue, Apr 10, 2012

Carlsbad, CA – April 10, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its collaboration with VubIQ, Inc., to enable the new HD video capturing system for the National Hockey League (NHL) in-goal cameras.

After completing a rigorous series of prototype testing and field trials with Palomar Technologies Assembly ServicesTM (“Assembly Services”), VubIQ was given an order to equip all 30 NHL venues throughout the U.S. and Canada with GoalCam systems. Each system is comprised of two units: a GoalCam unit (HD camera and 60 GHz transmitter) and a 60 GHz receiver unit. Additionally, each unit is designed to incorporate future Wi-Fi upgrades, allowing for remote wireless adjustment of seven different functions: camera pan, camera tilt, RF antenna pan, RF antenna tilt, HD camera focus, HD camera iris, and HD camera zoom.

“Historically, the NHL had difficulties verifying whether or not a “close call” was an actual goal, and lacked a consistent or reliable vetting method. VubIQ received an order to provide systems to the NHL for highly reliable goal adjudication,” stated Adam Button, CEO of VubIQ. “With cameras far overhead positioned in various angles around the rink, the puck could not be video recorded at a close distance or in high resolution as it crossed (or did not cross) the goal line. Until now, goal judges positioned behind each goal during games typically made the call by switching on a red flashing light; but these judges did not have the luxury of instant replay or precise slow motion (forward or reverse) to assist with close calls. Now, however, with our GoalCams positioned inside the goal itself, and transmitting the uncompressed HD video wirelessly to the judging booth, it is as though the goal judges are literally right on top of the action—only with the additional benefit of slow-motion, back-and-forth replay in full HD.”

Since a cabled solution to this problem would not be feasible, an extremely high bandwidth wireless system was required. Marketing the GoalCam technology though its OEM distributor, VidOvation, Vubiq provides the NHL with an elegant wireless solution utilizing the unlicensed 60 GHz spectrum that addresses two key issues—achieving the highest possible video quality and eliminating transmission interference.

Assembly Services supported VubIQ through the development and optimization of precision die attach processes and the parameters for all wire interconnecting and encapsulation processes to assemble the components for the GoalCam transmitters (TX) and receivers (RX).  Assembly Services also managed the substrate attach process and final documentation of all final module packaging processes where the completed sub-assembly is mounted onto aligning hardware.


About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About VubIQ

VubIQ, headquartered in Aliso Viejo, California, is a millimeter wave technology company specializing in the development of components and final products utilizing 60 GHz silicon transmitters and receivers. While there is a strong worldwide effort to develop the silicon by major fabrication houses, no other company has achieved the capability of effectively packaging that silicon into efficient, low cost, and highly manufacturable products. VubIQ has five issued patents and six others in process. The technology underlying all of VubIQ’s current and future product offerings utilizes millimeter wave radio frequencies to transmit and receive signals and data at extremely high data rates, in a very small form factor, and at low cost.

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Tags: 3800 die bonder, Announcements, applications, automated component placement systems, automated packaging systems, assembly and packaging, 8000 wire bonder, Application Process, HD Camera, VubIQ

Palomar Technologies To Exhibit at MEPTEC Thermal Symposium and Shares Article on AuSi/AuSn Eutectic Die Attach

Posted by Palomar Technologies MarCom Team on Fri, Mar 18, 2011

Carlsbad, CA – March 18, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at the Microelectronic Packaging and Test Engineering Council (MEPTEC) Thermal Symposium on March 21 in San Jose, CA.

Worldwide account manager for Assembly Services, Steve Buerki, will be on site at the MEPTEC Thermal Symposium at booth #16.

Assembly Services is the precision microelectronic contract packaging division of Palomar Technologies. Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is “AuSi and AuSn Eutectic Die Attach Case Studies,” discussing three case studies providing an overview of material selection and methods for optimized utilization of eutectic solders.

Case 1: AuSi (RFSOE) 16 x 63 x 4mil and 31 x 64 x 4mil

Case 2: AuSn (P-Side Down) 12 x 10 x 12mil with preform using pulsed heat top down

Case 3: AuSn (ASIC) 453 x 274 x 12mil with preform using pulsed heat bottom up

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: eutectic die attach, eutectic soldering process, customized packaging solutions, eutectic process, AuSn, eutectic diagrams, eutectic tutorial, Application Process, MEPTEC, gold tin die attach