Latest news in micoelectronics, optoelectronics, LED assembly and complex hybrid packaging from Palomar Technologies.

PTI Press Releases

Palomar Technologies Performs Live Demonstrations at SEMICON China 2016

Posted by Katie Finney on Tue, Mar 08, 2016

Carlsbad, CA—March 8, 2015—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced they will be present at SEMICON China March 15-17, 2016 at the Shanghai New International Exhibition Center. SEMICON China “connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China”.

Palomar Technologies is looking forward to showcasing and providing live demonstrations of their 9000 Wedge Bonder and their new 3880 Die Bonder. To view the live demonstrations and learn more about Palomar, stop by the Be First Technology Co., Ltd. booth located at booth #4667. You can also learn more about Palomar Technologies by stopping by the Beijing Asia Science & Technology Co., Ltd booth located at booth #2443.

Palomar Technologies' new 3880 Die Bonder features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boat, and carriers. Custom stages are also available.3880_Bond_Head.png

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. The 9000 Wedge Bonder offers ultimate control and flexibility to change from a 45-60° wire feed range to 90° deep access with only a clamp change on the robust, theta-rotation bond head. No need for multiple expensive bond heads!Modern Wedge Bonding eBook

 The Palomar Asia office may be contacted online: www.palomartechnologies.com/contact-palomar-technologies-asia/

Download these resouces for more information:

3880 Data Sheet Epoxy Die Attach eBook 9000 Data Sheet
3880 die bonder epoxy die attach,daubing, epoxy dispensing, high-precision component attach 9000 Wedge Bonder data sheet

 

Topics: SEMICON China, 9000 Wedge Bonder, 3880 Die Bonder

Palomar Technologies to Exhibit at the 2015 International Microwave Symposium

Posted by Katie Finney on Tue, May 19, 2015

Carlsbad, CA – May 19, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they will be one of over 550 exhibitors at the International Microwave Symposium (IMS) at booth #2517 on May 19-21 in Phoenix, Arizona. IMS is “the premier annual international meeting for technologists involved in all aspects of microwave theory and practice”. IMS stated, “It is the synergy of the Exhibition in conjunction with the Technical Symposia that makes Microwave Week the premiere international gathering for everyone involved in technologies associated with RF, microwave, millimeter wave, and THz frequencies”.

Automated wire bonders were introduced in the early 1980s. At that time, the majority of interconnects were made using aluminum wire. As the need for high reliability increased, gold wire became more common. As package densities increased, wire interconnect bond pitches decreased. The initial solution to fine pitch was wedge bonding because the wedge tool design allows wires to be bonded in close proximity (side-to-side).9000_pic17_hi_res

The RF and microwave markets are characterized by lower volume and higher mix when compared to semiconductor packaging. This requires different levels of manual and automatic assembly process steps depending on product and manufacturing maturity. Suppliers can help customers through the various stages of manufacturing automation by providing manual, semi-automatic, and fully automatic islands and lines of equipment and process.

Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never-ending pursuit of cost savings, there remain a significant number of applications requiring a wildly different set of capabilities for die and wire bonding.

wedge_emulation

Wedge vs. Ball Bonding

Download "RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies" to take a deeper look at varying die attach and wire bonding requirements for emerging applications in the RF and microwave markets. The paper discusses three case studies:

  1.     RF-SOE Product (High Accuracy Die Bond + Semi/Automatic Wire Bond)
  2.     Optoelectronic Printer Product (Ultra Accuracy Die Bond)
  3.     High Brightness LED Matrix Product (High Accuracy Die + Semi/Auto Chain Wire)

About Palomar Technologies:

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information:

RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies 9000 Data Sheet
RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies 9000 Wedge Bonder data sheet

 

 ----
Katie Finney
Marketing Specialist
Palomar Technologies, Inc.

Topics: RF Packaging, 8000i Wire Bonder, microwave applications, International Microwave Symposium (IMS), 9000 Wedge Bonder

Palomar Technologies Introduces the 9000 Wedge Bonder to Germany at SMT Hybrid Packaging 2015

Posted by Katie Finney on Tue, May 05, 2015

Carlsbad, CA – May 5, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, will be introducing the 9000 Wedge Bonder to Germany at the 2015 SMT Hybrid Packaging conference in Nuremberg, Germany on May 5-7. They will be showcasing the 9000 Wedge Bonder as well as their 8000i Wire Bonder at their booth located in hall 7A, booth 7A-521.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering control and flexibility. The 9000 features a large 12”x6” work area and the ability to easily change from a 45-60° wire feed range to 90° deep access. The quality control enabled by the 9000 is unparalleled, with real-time bond monitoring and process control software as well as a robust, low maintenance bond head. With the 9000 there is no need for an expensive bond head change, as the wire clamps are easily replaceable and adjustable.PT5-White

There are seven strategic components to the 9000 Wedge Bonder that help customers achieve modern wedge bond requirements:

  •          Large work area
  •          Inline factory automation
  •          Advanced user control
  •          Bond data miner
  •          High-speed wire bonding
  •          Wire feed clamp versatility
  •          High-precision

Palomar Technologies pioneered the first automated fine wire wedge bonders in the 1980s and today carries the technological legacy into the industry’s most advanced fine wire wedge bonder on the market.

Operational Features for Control and Precision

The Intelligent Interactive Graphical Interface® (i2Gi®) is an advanced GUI software feature implemented on the 9000 Wedge Bonder, and is an exclusive Palomar Technologies technology. i2Gi offers the required management tools for modern wedge bonding, from part design and development, to process validation, and finally to intuitive operations control. i2Gi was designed for 9000 Wedge Bonder operating technicians to work smarter, faster and with more control.

The natural navigation flow and interactive live graphical display of i2Gi lets bonder program developers and operators experience real-time bonding and part quality validation. i2Gi technology supports advanced wedge bond control through command tools which work in concert to provide a dynamic and intuitive user experience. 

Process Advantages

The 9000 Wedge Bonder addresses a wide range of fine wire wedge bond applications including disk drives, large complex hybrids, MCM power connections, ribbon bonding, low profile wire bonds, running stitch interconnects, and fine pitch devices. Some process advantages of the 9000 Wire Bonder include:

SMT
  •          Providing various loop form functions
  •          Highly regulated constant wire length
             as well as loop height
  •          Individual loop shapes
  •          Loop length range from
             70um to 20mm.

The 9000 Wedge Bonder also incorporates Bond Data MinerTM which is an all-inclusive and centralized data management and analysis system. This is a powerful tool to improve yield and utilization.

Delivering What Programmers Desire

Modern wedge bond requirements demand an automated, large bonding area system with scalability to increase production capacity without limiting performance. In order to achieve best efficiency at lowest cost, programmers and operators need relevant and real-time production feedback from their equipment.

With the 9000 Wedge Bonder, lab managers are able to have peace of mind that their bonder is fully supported by a highly trained team of field service and process development consultants.

9000 Data Sheet i2Gi Data Sheet
9000 Wedge Bonder data sheet i2Gi, intelligent interactive graphical interface, modern wire bond control software

 

###


Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681

 

Topics: i2Gi, 9000 Wedge Bonder

Palomar Technologies’ CTO to Present at SEMICON China 2015

Posted by Katie Finney on Tue, Mar 17, 2015

Carlsbad, CA – March 16, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at SEMICON China 2015. SEMICON China is celebrating its 27th year anniversary and will be held at the Shanghai New International Exhibition Center on March 17-20.

9000_pic17_hi_res

Dan Evans, Palomar Technologies’ Chief Technical Officer, will be presenting his technical paper titled “Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies” at this year’s SEMICON China conference.

Mr. Evan’s technical paper discusses both VCSEL and EEL technologies from a packaging architectural view with case studies showing high accuracy pick and place of the laser die, photo detector, and lens attachments. He also presents example cases to show the challenges and solutions to high accuracy die attach active optical cables. The paper is applicable to process engineers and managers who currently, or plan to, assemble Active Optical Cable transceivers or other similar packages using high accuracy pick and place systems. 

In addition to Dan Evan’s presentation of his technical paper, Palomar Technologies is also looking forward to showcasing their 9000 Wedge Bonder as well as performing live demonstrations of their 3800 Die Bonder and 8000i Wire Bonder at this year’s SEMICON China.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90° deep access on a single large work area. There are 7 key differentiators to the 9000 Wedge Bonder, which help customers achieve modern wedge bond requirements.  
7 key differentiators

The ultra-flexible 3800 Die Bonder is designed for fully automatic, precision microelectronic assembly. The 3800 is versatile, powerful and can provide specialized functions in addition to its primary functions.

Palomar Technologies’ 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. 

The Palomar Asia office may be contacted online: www.palomartechnologies.com/contact-palomar-technologies-asia/. 

Download these resouces for more information:

9000 Data Sheet 3800 Data Sheet 8000i Data Sheet
9000 Wedge Bonder data sheet 3800 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

###


Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com| +1 760-931-3681

Topics: 3800 die bonder, 8000i Wire Bonder, SEMICON China, 9000 Wedge Bonder

Palomar Technologies Announces the Latest in Wedge Bonding Technology: The 9000 Wedge Bonder

Posted by Katie Finney on Wed, Jan 07, 2015

Carlsbad, CA – January 7, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the launch of the 9000 Wedge Bonder. The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering control and flexibility. The 9000 features a large 12”x6” work area and the ability to easily change from a 45-60° wire feed range to 90° deep access. The quality control enabled by the 9000 is unparalleled, with real-time bond monitoring and process control software as well as a robust, low maintenance bond head. With the 9000 there is no need for an expensive bond head change, as the wire clamps are easily replaceable and adjustable.

There are seven strategic components to the 9000 Wedge Bonder that help customers achieve modern wedge bond requirements: large work area, inline factory automation, advanced user control, bond data miner, high-speed wire bonding, wire feed clamp versatility, and high-precision. Palomar Technologies pioneered the first automated fine wire wedge bonders in the 1980s and today carries the technological legacy into the industry’s most advanced fine wire wedge bonder on the market.

Operational Features for Control and Precision

The Intelligent Interactive Graphical Interface® (i2Gi®) is an advanced GUI software feature implement9000_Wedge_Bondered on the 9000 Wedge Bonder, and is an exclusive Palomar Technologies technology. i2Gi offers the required management tools for modern wedge bonding, from part design and development, to process validation, and finally to intuitive operations control. i2Gi was designed for 9000 Wedge Bonder operating technicians to work smarter, faster and with more control.

The natural navigation flow and interactive live graphical display of i2Gi lets bonder program developers and operators experience real-time bonding and part quality validation. i2Gi technology supports advanced wedge bond control through command tools which work in concert to provide a dynamic and intuitive user experience. 

Process Advantages

The 9000 Wedge Bonder addresses a wide range of fine wire wedge bond applications including disk drives, large complex hybrids, MCM power connections, ribbon bonding, low profile wire bonds, running stitch interconnects, and fine pitch devices. Some process advantages of the 9000 Wire Bonder include providing various loop form functions, highly regulated constant wire length as well as loop height, individual loop shapes, and a loop length range from 70um to 20mm.

The 9000 Wedge Bonder also incorporates Bond Data MinerTM which is an all-inclusive and centralized data management and analysis system. This is a powerful tool to improve yield and utilization.

Delivering What Programmers Desire

Modern wedge bond requirements demand an automated, large bonding area system with scalability to increase production capacity without limiting performance. In order to achieve best efficiency at lowest cost, programmers and operators need relevant and real-time production feedback from their equipment.

With the 9000 Wedge Bonder, lab managers are able to have peace of mind that their bonder is fully supported by a highly trained team of field service and process development consultants.

Download the 9000 Wedge Bonder Data Sheet:

9000 Wedge Bonder data sheet

 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

###

Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681

Topics: 9000 Wedge Bonder

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