Palomar Technologies to Exhibit at the 2015 International Microwave Symposium

Posted by Katie Finney on Tue, May 19, 2015

Carlsbad, CA – May 19, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they will be one of over 550 exhibitors at the International Microwave Symposium (IMS) at booth #2517 on May 19-21 in Phoenix, Arizona. IMS is “the premier annual international meeting for technologists involved in all aspects of microwave theory and practice”. IMS stated, “It is the synergy of the Exhibition in conjunction with the Technical Symposia that makes Microwave Week the premiere international gathering for everyone involved in technologies associated with RF, microwave, millimeter wave, and THz frequencies”.

Automated wire bonders were introduced in the early 1980s. At that time, the majority of interconnects were made using aluminum wire. As the need for high reliability increased, gold wire became more common. As package densities increased, wire interconnect bond pitches decreased. The initial solution to fine pitch was wedge bonding because the wedge tool design allows wires to be bonded in close proximity (side-to-side).9000_pic17_hi_res

The RF and microwave markets are characterized by lower volume and higher mix when compared to semiconductor packaging. This requires different levels of manual and automatic assembly process steps depending on product and manufacturing maturity. Suppliers can help customers through the various stages of manufacturing automation by providing manual, semi-automatic, and fully automatic islands and lines of equipment and process.

Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never-ending pursuit of cost savings, there remain a significant number of applications requiring a wildly different set of capabilities for die and wire bonding.

wedge_emulation

Wedge vs. Ball Bonding

Download "RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies" to take a deeper look at varying die attach and wire bonding requirements for emerging applications in the RF and microwave markets. The paper discusses three case studies:

  1.     RF-SOE Product (High Accuracy Die Bond + Semi/Automatic Wire Bond)
  2.     Optoelectronic Printer Product (Ultra Accuracy Die Bond)
  3.     High Brightness LED Matrix Product (High Accuracy Die + Semi/Auto Chain Wire)

About Palomar Technologies:

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information:

RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies 9000 Data Sheet
RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies 9000 Wedge Bonder data sheet

 

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Katie Finney
Marketing Specialist
Palomar Technologies, Inc.

Tags: RF Packaging, 8000i Wire Bonder, microwave applications, International Microwave Symposium (IMS), 9000 Wedge Bonder

Palomar Technologies to Exhibit at the Optical Fiber Communication Conference 2015

Posted by Katie Finney on Tue, Mar 24, 2015

Carlsbad, CA – March 24, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) at booth #420 on March 24-26 in Los Angeles, CA.

LA_convention_center2

With over 13,000 attendees and over 65 countries represented, OFC is the largest global conference and exposition for optical communications and networking professionals. Some of the hot topics for this year’s conference include:

  • Digital signal processing for optical fiber communication systems
  • Amplification, fiber, and multiplexing techniques for capacity
  • Cloud and data center networking
  • Digital signal processing for optical fiber communication systems

Optoelectronic Packaging

OFC will also be having comprehensive peer reviewed presentations in key topic areas including Optoelectronic Devices. Three equally important concerns for optoelectronic devices are package design, controlled assembly processes and meeting critical assembly alignment and position tolerances. Palomar Technologies manufactures and services highly advanced microelectronic packaging systems, excelling in advanced processes, high purity, exceptional heat transfer and precision.

Palomar Technologies Solution

Palomar Technologies' Assembly Services are a perfect-fit solution for optoelectronic packaging without investing in capital equipment. This minimizes the customer’s project risk and accelerates time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring a sustainable competitive advantage.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information: 

 

3800 Data Sheet 6500 Data Sheet 8000i Data Sheet
3800 Die Bonder Data Sheet 6500 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

 

 

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Contact

Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

Tags: 3800 die bonder, 8000i Wire Bonder, 6500 die bonder

Palomar Technologies’ CTO to Present at SEMICON China 2015

Posted by Katie Finney on Tue, Mar 17, 2015

Carlsbad, CA – March 16, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at SEMICON China 2015. SEMICON China is celebrating its 27th year anniversary and will be held at the Shanghai New International Exhibition Center on March 17-20.

9000_pic17_hi_res

Dan Evans, Palomar Technologies’ Chief Technical Officer, will be presenting his technical paper titled “Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies” at this year’s SEMICON China conference.

Mr. Evan’s technical paper discusses both VCSEL and EEL technologies from a packaging architectural view with case studies showing high accuracy pick and place of the laser die, photo detector, and lens attachments. He also presents example cases to show the challenges and solutions to high accuracy die attach active optical cables. The paper is applicable to process engineers and managers who currently, or plan to, assemble Active Optical Cable transceivers or other similar packages using high accuracy pick and place systems. 

In addition to Dan Evan’s presentation of his technical paper, Palomar Technologies is also looking forward to showcasing their 9000 Wedge Bonder as well as performing live demonstrations of their 3800 Die Bonder and 8000i Wire Bonder at this year’s SEMICON China.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90° deep access on a single large work area. There are 7 key differentiators to the 9000 Wedge Bonder, which help customers achieve modern wedge bond requirements.  
7 key differentiators

The ultra-flexible 3800 Die Bonder is designed for fully automatic, precision microelectronic assembly. The 3800 is versatile, powerful and can provide specialized functions in addition to its primary functions.

Palomar Technologies’ 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. 

The Palomar Asia office may be contacted online: www.palomartechnologies.com/contact-palomar-technologies-asia/. 

Download these resouces for more information:

9000 Data Sheet 3800 Data Sheet 8000i Data Sheet
9000 Wedge Bonder data sheet 3800 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

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Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com| +1 760-931-3681

Tags: 3800 die bonder, 8000i Wire Bonder, SEMICON China, 9000 Wedge Bonder

Palomar Technologies Exhibits “The Future of Packaging” at IMAPS 2014

Posted by Katie Finney on Tue, Oct 07, 2014

Carlsbad, CA – October 7, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced product demos at the IMAPS 47th International Symposium on Microelectronics. The 8000i Wire Bonder with Intelligent Interactive Graphical Interface® (i2Gi®) will be showcased through live demonstrations in booth #221 on October 14-15 at the Town and Country Resort & Convention Center in San Diego, CA.

The 8000i Wire Bonder comes equipped with i2Gi technology. It is a fully automated thermosonic high-8000i-Ergo_Technician-smallspeed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. It is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

Professional Development Courses and Technical Program
In addition to the exhibits, the symposium will feature exciting keynotes, industry panels, and technical speakers on “The Future of Packaging”. This forum is the largest exchange of technical information and industry leaders, encompassing 3 days, 28 sessions and 190 speakers on microelectronics, assembly, interconnect and packaging. Some of the Professional Development Courses that are being offered include: Introduction to Microelectronics Packaging, Wire Bonding, MEMS and nanoMEMS Devices and Applications, and Packaging and Testing of Implanted Medical Devices (just to mention a few). For more information on the PDCs being offered or the symposium itself, go to www.imaps2014.org.

dessert-sponsor3-IMAPS2013

Also, don’t forget to grab a delicious treat during the Dessert “Happy Hour” Tuesday from 3:25-4:30pm that is sponsored by Palomar Technologies!

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Claudia Salerno
Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681

Tags: Announcements, 8000i Wire Bonder, i2Gi, IMAPS

Palomar Technologies Exhibits at SEMICON West 2014 Showcasing Wire Bond Demos

Posted by Katie Finney on Tue, Jul 01, 2014

Carlsbad, CA – July 1, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced product demos at booth #5952 at SEMICON West 2014 on July 8-10 at the Moscone Center in San Francisco. The 8000i Wire Bonder with Intelligent Interactive Graphical Interface® (i2Gi®) will be showcased through live demonstrations, as well as other leading edge packaging solutions.

The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

One of the main areas where Palomar has been focusing is optoelectronic assemblies—many of which have been VCSEL & PD based optical Tx and Rx systems using individual components or arrayed components, typically 1x4 arrays. Palomar divides these assemblies into two classes by accuracy requirements. “The 6500 Die Bonder satisfies markets requiring less than 5um placement. The 3800 Die Bonder satisfies markets requiring greater than 5um placement accuracy. We have also been placing the molded lenses for these assemblies, either single or arrayed,” states Applications Manager and Sr. Scientist, Daniel Evans.

An application example of multi-channel communication that Palomar is currently working on is the Active Optical Cable (AOC):

Luxtera 
Photo credit: Luxtera

 Finisar
Photo credit: Finisar

 Zarlink
Photo credit: Zarlink

 

New Features at SEMICON West                                                                         

Over 20,000 visitors are currently registered for the show, and new features have been included this year—ensuring that this will be an extremely well attended and exciting show. Amongst the added programs to SEMICON West this year are The Semiconductor Technology Symposium and the Sustainable Manufacturing Forum. These are meant to provide attendees the opportunity to dig deeper into technical subject matters in a quieter, more intimate environment.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, wire bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly, and micron-level component attachment. Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world. For more information, visit www.palomartechnologies.com.

###

Contact
Claudia Salerno
Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | 760.931.3681

Tags: 3800 die bonder, Announcements, 8000i Wire Bonder, 6500 die bonder, SEMICON West 2014

Automated Wire Bonding Production System Demonstrations at SEMICON China 2014

Posted by Katie Finney on Mon, Mar 17, 2014

Carlsbad, CA – March 17, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today the live demonstration of the 8000i Wire Bonder at SEMICON China 2014. SEMICON China is celebrating its 26th year, held this year at the Shanghai New International Expo Center on March 18-20.

Palomar Technologies' new 8000i Wire Bonder comes equipped with i2Gi® technology. The8000i wire bonder 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

Intelligent Interactive Graphical Interface (i2Gi) on the new 8000i Wire Bonder
i2Gi (cleverly pronounced “iggy”) is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.

8000i Data Sheet

8000i wire bonder, ball bumper, i2Gi  

i2Gi Data Sheet

i2Gi, intelligent interactive graphical interface, modern wire bond control software  

i2Gi supports modern automated wire bonding for complex hybrid production. Watch the video:

An 8000i Wire Bonder will be available for live demonstrations throughout the duration of SEMICON China in the Asia Science & Technology (AST) booth #3287 with supplemental information about our 3800 Die Bonder available also in the BE FIRST booth #3703. Mr. PH Chan, Palomar Technologies Asia managing director, will be onsite at the show to discuss automated wire bonding, die attach and full factory automation requirements. The Palomar Asia office may also be contacted online: http://www.palomartechnologies.com/contact-palomar-technologies-asia/.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly, and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Janine Hueners
Marketing Communications, Palomar Technologies
jhueners@bonders.com | +1 760-931-3680

Tags: 3800 die bonder, Announcements, Palomar Asia, 8000i Wire Bonder, i2Gi, SEMICON China

Palomar Technologies Announces Alliance with SCI Automation Plasma Cleaning

Posted by Katie Finney on Tue, Jan 14, 2014

CARLSBAD, CA – January 14, 2014 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced a strategic alliance with SCI Automation Pte. Ltd. (Singapore). SCI Automation joins the ranks of Palomar’s alliance partners GPD Global Dispensing Systems, Hybond Manual Bonders, and Royce Instruments Bond Testers and Die Sorters. Effective immediately, Palomar will be offering the full line of SCI Automation products worldwide.

SCI Automation specializes in the design and manufacturing of integrated plasma (or vacuum) systems. These best-in-class systems are used around the world in vacuum and plasma applications where automation is required in vacuum, pressurized, or controlled atmosphere environments. This plasma automation includes batch load or full automation (material movement and tracking). SCI’s product suite includes plasma cleaners and activation for the following applications and markets:

  • semiconductor applications
  • electronic applications
  • automotive applications
  • optoelectronic applications
  • hybrid applications
  • medical applications

At SEMICON West 2013, Palomar launched its new 8000i Au deep access ball bonder featuring i2Gi technology. This platform was developed to improve upon the 8000i wire bonder, wire bonder, 8000i, 8000 wire bonderreliable 8000 ball bonder, affording faster programming, quick reworks, and an interactive 4-dimension user-friendly glove touch interface. Current 8000 customers are eligible for an i2Gi upgrade

The SCI Automation alliance will bring together complex ball bonding and plasma cleaning capability in a single inline solution. As both platforms are SMEMA compatible, customers can enjoy a turnkey high yield system. “We are excited to be working with Palomar and look forward to providing a wider group of customers our unique plasma cleaning expertise alongside their world-class wire and die bonding systems – this is win-win-win for our customers, SCI and Palomar”, states Dr. Malatesta, SCI Automation’s founder and CEO.

SCI plasmaSCI automationSCI automation Titan

Palomar Technologies (SE Asia) Pte Ltd recently launched a full service demo and applications lab in at its Asia headquarters in Singapore. Palomar’s 8000i and SCI’s QML-EX plasma cleaner work side by side to package and assemble high yield, high performing complex packages. “The alliance with SCI Automation is a perfect complimentary addition to Palomar’s alliance companies group. Providing our customers with a world-class full turnkey automated package and assembly solution has long been our mission”, states Bruce Hueners, Palomar Technologies CEO.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About SCI Automation
SCI Automation (SCI), with its trademark SCIPlasma, has been in the plasma cleaning business for 14 years with experience mainly in the area of advanced semiconductor packaging and assembly. SCI follows an ethical approach in dealing with customers, allowing them to enjoy correctly priced equipment and spare parts while providing them with state-of-the-art plasma cleaning equipment, service and application support through a dedicated team—a team curious to listen to customer requests and determined to supply state-of-the-art plasma cleaning solutions using a creative design approach that is unique to SCI. For more information, visit http://www.sciplasma.com/Home.aspx.

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Contact
Claudia Salerno
Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681

Tags: Announcements, 8000i Wire Bonder, SCI Automation, plasma cleaning

New Wire Bonder Demos at productronica 2013 – 8000i Wire Bonder with i2GiTM Technology

Posted by Katie Finney on Tue, Nov 05, 2013

Carlsbad, CA – November 5, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced live demonstrations of a new wire bonder at productronica 2013: the 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM). The 8000i Wire Bonder with i2Gi will be showcased in Hall B2 Booth 205 at the 20th international trade fair for innovative electronics production, held in Munich on November 12 - 15, 2013.

In an interview with the productronica 2013 team, Josef Schmidl, Palomar Technologies GmbH Managing Director, recognized that, “Palomar Technologies has exhibited at productronica for more than 30 years. It has become one of the most important exhibitions in Europe with regards to Palomar's evolving product portfolio.”

“productronica is the perfect platform for live demonstrations of the latest products and solutions, concentrated to a world-wide audience of hybrid manufacturers. productronica will be a milestone for Palomar Technologies—this is the first opportunity for attendees to see and to test drive new products,” Mr. Schmidl affirmed.

Intelligent Interactive Graphical Interface (i2Gi) on the new 8000i Wire Bonder
i2Gi (cleverly pronounced “iggy”) is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.

i2Gi technology supports advanced wire bond control through three key critical command tools, which work in concert to provide a dynamic and intuitive user experience.

  1. Part Tree Display defines relationships between part programming objects: parts, wires, pads

  2. Part Graphical Display provides geometric representation of the overall XY workspace and package elements

  3. Man-Machine Interface (MMI) + Video Graphical Display enables interaction with live video for teaching and locating parts combined with a graphical overlay representation of the program.

i2Gi, 8000i wire bonder, wire bond control software

The new 8000i Wire Bonder comes equipped with i2Gi technology. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

Read More About i2Gi
Integration von i2Gi™ in 8000 Ball Bonder (Integrating i2Gi™ onto an 8000 Wire Bonder)

Watch the i2Gi Video Demo

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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EMEA Contact
Mr. Josef Schmidl
Managing Director
Palomar Technologies GmbH
jschmidl@palomartechnologies.de | +49 (9131) 48009-30

Corporate Contact
Mrs. Jessica Sylvester
Manager, Marketing Communications
Palomar Technologies, Inc.
jsylvester@bonders.com | +1 760-931-3681

Tags: Announcements, 8000i Wire Bonder, i2Gi, Palomar Europe, productronica

Wire Bonding & Stud Bumping Technical Track Plus New Product Demos at IMAPS 2013

Posted by Katie Finney on Tue, Sep 24, 2013

Carlsbad, CA – September 24, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced new product demos at IMAPS 2013. The 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM) will be showcased through live demonstrations in booth #511 on October 1-2 at the Rosen Centre Hotel in Orlando, FL.

Wire Bonding & Stud Bumping Technical Track
Dan Evans (Palomar Technologies Senior Scientist) and Lee Levine (Process Solutions Consulting) will co-chair the Wire Bonding and Stud Bumping technical track. This session track covers non-destructive testing challenges and methods of wires and bond pads, Pd-coated Cu wire process window optimization, Cu wedge bonding, Al and Ag based wires as alternatives to copper, plus hybrid wire bond capabilities. Evans and David Rasmussen (Palomar Technologies Assembly Services™ General Manager) will present “Multipurpose Wire Bonding - Bumps, Wires, Combination Interconnects, and Operation Efficiency” at 4:30 PM - 4:55 PM on Tuesday, October 1.

Test Drive New Wire Bonding Software at IMAPS 2013 

IMAPS 2013 attendees are able to test drive i2Gi (cleverly pronounced “iggy”) in booth #511 throughout the duration of the exhibit hall. i2Gi is implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. 

i2Gi demo 

i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.

i2Gi, intelligent interactive graphical interface, modern wire bond control software

8000i wire bonder, ball bumper, i2Gi

The new 8000i Wire Bonder comes equipped with i2Gi technology. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.  

The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

See i2Gi in Action

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Jessica Sylvester
Marketing Communications Manager
Palomar Technologies, Inc.
jsylvester@bonders.com | +1 760-931-3681

Tags: Announcements, wire bonding, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU), 8000 wire bonder

SEMICON Taiwan 2013 Echoes Increases in Regional Advanced Packaging

Posted by Katie Finney on Tue, Sep 03, 2013

Carlsbad, CA – September 3, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced live demonstrations of new products and solutions at SEMICON Taiwan 2013, held in Taipei on September 4-6 at the TWTC Nangang Exhibition Hall.

SEMICON Taiwan 2013 will spotlight the latest developments in processes, equipment, materials, and emerging market opportunities in microelectronics manufacturing from more than 650 exhibiting companies and more than 50 hours of technical and business forums.

The technical programs will be supported by specialized exhibit theme pavilions focused on critical manufacturing technologies and markets, including:

 3D IC, stacked die


Taiwan is situated in the strategic location of the world's IC packaging and testing industry, with some of the world's largest packaging and testing companies, reaching a global packaging and testing foundry market share of over 50%. According to an ITIS second quarter forecast this year, the Taiwan IC packaging and testing industry will significantly grow by 15.5%, and the driving force is due to growing demands from the networking, graphics, wireless, computing device, and mobile handsets markets.
[read more: http://www.semi.org/en/node/46661]

"While the global market is looking towards recovery in 2014, Taiwan is building its strength and growing now," said Terry Tsao, president of SEMI Taiwan. He adds, "New electronic products and technologies, including mobile devices and 3D printing, are creating entirely new opportunities for microelectronics and driving the need to push the limits of Moore's Law to enable the next generation of innovations. The technologies, companies, and people that will get us there are the highlight of SEMICON Taiwan".
[read more: http://www.semi.org/en/node/46201]

8000i wire bonder, i2Gi, wire bonder, ball bumper

Palomar Technologies will demo the new 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM) technologies with Supremetec Materials, Inc. (SMI), booth #41. In addition, Palomar Technologies’product and solution portfolio will be showcased with Taiwan Kong King (TKK), booth #516.

 

i2Gi supports modern automated wire bonding for complex hybrid production. Watch the video:

Palomar Technologies recently announced the opening of its new demonstration and applications development office, located in Singapore

The new Palomar Asia facility builds upon the established base of customer support, evolving into a “one-stop shop” to offer full-capacity support. For example, the new facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.

  Assembly Services data sheet

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: http://www.palomartechnologies.com/contact-palomar-technologies-asia

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Palomar Asia Contact
Mr. PH Chan
Managing Director
phchan@bonders.com
(+65) 6686-3096

Palomar Technologies Media Contact
Mrs. Jessica Sylvester
Marketing Communications Manager
jsylvester@bonders.com
+1 (760) 931-3681

Tags: LED applications, refurbished bonders, Assembly Services, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU), SEMICON Taiwan 2013, MEMS devices, 3D Packaging