Palomar Technologies to Exhibit at the Optical Fiber Communication Conference 2015

Posted by Katie Finney on Tue, Mar 24, 2015

Carlsbad, CA – March 24, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) at booth #420 on March 24-26 in Los Angeles, CA.

LA_convention_center2

With over 13,000 attendees and over 65 countries represented, OFC is the largest global conference and exposition for optical communications and networking professionals. Some of the hot topics for this year’s conference include:

  • Digital signal processing for optical fiber communication systems
  • Amplification, fiber, and multiplexing techniques for capacity
  • Cloud and data center networking
  • Digital signal processing for optical fiber communication systems

Optoelectronic Packaging

OFC will also be having comprehensive peer reviewed presentations in key topic areas including Optoelectronic Devices. Three equally important concerns for optoelectronic devices are package design, controlled assembly processes and meeting critical assembly alignment and position tolerances. Palomar Technologies manufactures and services highly advanced microelectronic packaging systems, excelling in advanced processes, high purity, exceptional heat transfer and precision.

Palomar Technologies Solution

Palomar Technologies' Assembly Services are a perfect-fit solution for optoelectronic packaging without investing in capital equipment. This minimizes the customer’s project risk and accelerates time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring a sustainable competitive advantage.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information: 

 

3800 Data Sheet 6500 Data Sheet 8000i Data Sheet
3800 Die Bonder Data Sheet 6500 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

 

 

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Contact

Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

Tags: 3800 die bonder, 8000i Wire Bonder, 6500 die bonder

Palomar Technologies Exhibits at SEMICON West 2014 Showcasing Wire Bond Demos

Posted by Katie Finney on Tue, Jul 01, 2014

Carlsbad, CA – July 1, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced product demos at booth #5952 at SEMICON West 2014 on July 8-10 at the Moscone Center in San Francisco. The 8000i Wire Bonder with Intelligent Interactive Graphical Interface® (i2Gi®) will be showcased through live demonstrations, as well as other leading edge packaging solutions.

The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

One of the main areas where Palomar has been focusing is optoelectronic assemblies—many of which have been VCSEL & PD based optical Tx and Rx systems using individual components or arrayed components, typically 1x4 arrays. Palomar divides these assemblies into two classes by accuracy requirements. “The 6500 Die Bonder satisfies markets requiring less than 5um placement. The 3800 Die Bonder satisfies markets requiring greater than 5um placement accuracy. We have also been placing the molded lenses for these assemblies, either single or arrayed,” states Applications Manager and Sr. Scientist, Daniel Evans.

An application example of multi-channel communication that Palomar is currently working on is the Active Optical Cable (AOC):

Luxtera 
Photo credit: Luxtera

 Finisar
Photo credit: Finisar

 Zarlink
Photo credit: Zarlink

 

New Features at SEMICON West                                                                         

Over 20,000 visitors are currently registered for the show, and new features have been included this year—ensuring that this will be an extremely well attended and exciting show. Amongst the added programs to SEMICON West this year are The Semiconductor Technology Symposium and the Sustainable Manufacturing Forum. These are meant to provide attendees the opportunity to dig deeper into technical subject matters in a quieter, more intimate environment.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, wire bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly, and micron-level component attachment. Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world. For more information, visit www.palomartechnologies.com.

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Contact
Claudia Salerno
Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | 760.931.3681

Tags: 3800 die bonder, Announcements, 8000i Wire Bonder, 6500 die bonder, SEMICON West 2014

Palomar Technologies Presents Sub-5um Die Attach Placement Accuracy Webcast

Posted by Rich Hueners on Tue, Jun 12, 2012

Carlsbad, CA – June 12, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that the company can support high-precision die attach to less than 5µm placement accuracies.

“As the trend to build smaller electronics pushes the limits of semiconductor packaging abilities, the need for high-accuracy and high-precision component placement often presents a challenge in itself,” stated Donald Beck, Palomar Technologies Assembly ServicesTM General Manager. “We are able to support [application dependent] requirements for ultra-high placement accuracies on our eutectic/epoxy 3800 Die Bonder and 6500 Die Bonder systems.”

The ultra flexible 3800 Die Bonder is designed for fully automatic, precision microelectronics assembly. The tightly regulated,computer-controlled work cell can perform up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. The 3800 Die Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions.

The 6500 Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless and medical applications. This eutectic die bonder is designed for fully automatic precision component assembly—even up to 1.5µm placement accuracy (application dependent)—making component assembly practical and cost effective. Wafer Scale Packaging (WSP) eutectic die attach on the 6500 Die Bonder provides customers with a complete microelectronic solution for P-side down laser diode attachment (die-to-wafer), a pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, a wafer stage with steady state heating, and waffle or gel pack presentation of laser diode applications.

Mr. Beck is presenting a 30-minute live webcast on June 13 at 12:00pm Eastern Time, discussing new developments for ultra high-precision component packaging: “<5micron Placement Accuracy" target="_self">High-Reliability Component Attachment Process for <5micron Placement Accuracy ".

The webcast will cover a process solution for <5µm component attach" target="_self">automating <5µm component attach specific to organizations requiring high-reliability device packaging. In this webinar, Mr. Beck will cover methods that have been proven through real-world experiences related to the high-reliability microelectronics industry. Joining Mr. Beck will be Mr. Zeger Bok (Sr. Application Engineer) and Mr. Daniel Martinez (Assembly Services Lab Manager & Manufacturing Engineer) for live Q&A after the formal presentation.

Register now for the live webcast, presented on June 13 at Noon Eastern Time. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Palomar Technologies 3800 Die Bonder Offers Flexible Solutions to Support LED Development in China

Posted by Rich Hueners on Tue, Mar 13, 2012

Carlsbad, CA – March 13, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit with Asia Science and Technology (AST) at SEMICON China 2012, held in Shanghai on March 20-22.

Palomar Technologies, Hybond and AST will exhibit together in booth #3153 in Hall E3. A Palomar 3800 Die Bonder and manual Hybond equipment will be on-site for demonstrations.

Mr. PH Chan, Palomar Technologies Asia Director, recently wrote a blog summarizing the LED markets in Asia, specifically recounting how LEDs relate to China’s 12th five-year plan.

“By 2015, China intends its manufacturing standards to be globally viable for the volume production market. By that time, China’s LED industry is estimated to reach $75 billion,” stated Mr. Chan. “The 3800 Die Bonder is capable of ultra-high precision and high-reliability eutectic and epoxy die attach processes. This robust system is in production with several major players in the Asia-based LED market today. The 3800 Die Bonder embodies great versatility to accommodate multiple processes on a single 710in2 work envelope as well as tremendous flexibility to remain vigilant for the future of component packaging.”

Mr. Chan will be attending SEMICON China and is available during the conference for any on-site meetings.

In addition to the ultra-flexible 3800 Die Bonder, Palomar Technologies offers several complementing bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the 8000 Wire Bonder is a large area, high-reliability wire bonder and ball bumper with deep access capabilities. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, wire bonder, wire bonds, wire bonding, LED matrix assembly, LED applications, wire bonders, capital equipment, LED packaging, wafer scale packaging, automated component placement systems, automated packaging systems, Hybond, 8000 wire bonder, 6500 die bonder, automation vs. manual, field services support, Bonder Boot Camp, made in china, SEMICON China, wire bond testing