Press Release

Circuit Assembly announced on March 15, 2016 that Palomar Technologies’ 3880 Die Bonder won the New Product Introduction (NPI) Award for Bonders. Circuit Assembly’s NPI Awards recognize the leading new products for electronics assembly during the
Posted by Katie Finney on Tue, Mar 29, 2016 @ 07:00 AM
Carlsbad, CA – September 22, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the launch of its latest product: the 3880 Die Bonder. The 3880 Die Bonder
Posted by Katie Finney on Tue, Sep 22, 2015 @ 07:00 AM