Palomar Technologies to Exhibit at the Optical Fiber Communication Conference 2015

Posted by Katie Finney on Tue, Mar 24, 2015

Carlsbad, CA – March 24, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) at booth #420 on March 24-26 in Los Angeles, CA.

LA_convention_center2

With over 13,000 attendees and over 65 countries represented, OFC is the largest global conference and exposition for optical communications and networking professionals. Some of the hot topics for this year’s conference include:

  • Digital signal processing for optical fiber communication systems
  • Amplification, fiber, and multiplexing techniques for capacity
  • Cloud and data center networking
  • Digital signal processing for optical fiber communication systems

Optoelectronic Packaging

OFC will also be having comprehensive peer reviewed presentations in key topic areas including Optoelectronic Devices. Three equally important concerns for optoelectronic devices are package design, controlled assembly processes and meeting critical assembly alignment and position tolerances. Palomar Technologies manufactures and services highly advanced microelectronic packaging systems, excelling in advanced processes, high purity, exceptional heat transfer and precision.

Palomar Technologies Solution

Palomar Technologies' Assembly Services are a perfect-fit solution for optoelectronic packaging without investing in capital equipment. This minimizes the customer’s project risk and accelerates time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring a sustainable competitive advantage.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information: 

 

3800 Data Sheet 6500 Data Sheet 8000i Data Sheet
3800 Die Bonder Data Sheet 6500 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

 

 

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Contact

Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

Tags: 3800 die bonder, 8000i Wire Bonder, 6500 die bonder

Palomar Technologies’ CTO to Present at SEMICON China 2015

Posted by Katie Finney on Mon, Mar 16, 2015

Carlsbad, CA – March 16, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at SEMICON China 2015. SEMICON China is celebrating its 27th year anniversary and will be held at the Shanghai New International Exhibition Center on March 17-20.

9000_pic17_hi_res

Dan Evans, Palomar Technologies’ Chief Technical Officer, will be presenting his technical paper titled “Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies” at this year’s SEMICON China conference.

Mr. Evan’s technical paper discusses both VCSEL and EEL technologies from a packaging architectural view with case studies showing high accuracy pick and place of the laser die, photo detector, and lens attachments. He also presents example cases to show the challenges and solutions to high accuracy die attach active optical cables. The paper is applicable to process engineers and managers who currently, or plan to, assemble Active Optical Cable transceivers or other similar packages using high accuracy pick and place systems. 

In addition to Dan Evan’s presentation of his technical paper, Palomar Technologies is also looking forward to showcasing their 9000 Wedge Bonder as well as performing live demonstrations of their 3800 Die Bonder and 8000i Wire Bonder at this year’s SEMICON China.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90° deep access on a single large work area. There are 7 key differentiators to the 9000 Wedge Bonder, which help customers achieve modern wedge bond requirements.  
7 key differentiators

The ultra-flexible 3800 Die Bonder is designed for fully automatic, precision microelectronic assembly. The 3800 is versatile, powerful and can provide specialized functions in addition to its primary functions.

Palomar Technologies’ 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. 

The Palomar Asia office may be contacted online: www.palomartechnologies.com/contact-palomar-technologies-asia/. 

Download these resouces for more information:

9000 Data Sheet 3800 Data Sheet 8000i Data Sheet
9000 Wedge Bonder data sheet 3800 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

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Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com| +1 760-931-3681

Tags: 3800 die bonder, 8000i Wire Bonder, SEMICON China, 9000 Wedge Bonder

Palomar Technologies to Exhibit at 2015 Strategies in Light Exhibition and Conference

Posted by Katie Finney on Tue, Feb 24, 2015

Carlsbad, CA – February 24, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced that they will return to exhibit at the 2015 LED-focused show, Strategies in Light, this week February 24-26 held in Las Vegas.

HB/HP LED Assembly

One of the fastest growing technologies in the world is High-Bright/High-Power LEDs. Industrial and commercial lighting contribute largely in the HB LED market growth. Other end uses are found in aircraft lighting and powerful heaters in water purification systems. These LEDs are very efficient by a factor of ~60%. They are durable, long-lasting and, over time, cost reducing. The LED enables its user to essentially get more for less. HB LEDs can drive very high currents into the hundreds of mA; some HB LEDs can emit lumens in the thousands.

HBHP_LED_Assembly

HB LED tolerances are easily obtained with Palomar Technologies' machines to meet the package requirements of LEDs. Optimal thermal conductivity is achieved through the eutectic bonding process using the Palomar Technologies designed Pulsed Heat System stage.

Precise LED die attach applications can be manufactured using silver-filled conductive epoxy dispensing and daubing methods on a 3800 Die Bonder. Palomar Technologies has been working with advanced LED designs for over seven years, and was one of the first companies to process matrix LEDs – in modules containing anywhere from six to over 1,000 die.

LED

Strategies in Light

Strategies in Light is a business conference and exhibition that focuses on solid-state lighting (SSL), which includes both light-emitting diodes (LEDs) and organic light emitting diode (OLEDs) technologies. It is the longest-running and the largest conference in the HB LED industry, and the premier annual forum for presenting current commercial developments in high-brightness LED applications and providing unparalleled networking opportunities for component and equipment suppliers, manufacturers, and end-users of HB LED devices.

Bradley Benton, our Western Regional Sales Manager, will be on-site to lead discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding. Palomar Technologies will be located at booth number 1332. Contact Palomar Technologies or visit our booth to schedule an on-site meeting at the conference.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download the 3800 Die Bonder Data Sheet:

3800 Die Bonder Data Sheet

 

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Contact

Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

Tags: 3800 die bonder, HB LED, Strategies in Light, LEDs

Palomar Technologies Exhibits at SEMICON West 2014 Showcasing Wire Bond Demos

Posted by Katie Finney on Tue, Jul 01, 2014

Carlsbad, CA – July 1, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced product demos at booth #5952 at SEMICON West 2014 on July 8-10 at the Moscone Center in San Francisco. The 8000i Wire Bonder with Intelligent Interactive Graphical Interface® (i2Gi®) will be showcased through live demonstrations, as well as other leading edge packaging solutions.

The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

One of the main areas where Palomar has been focusing is optoelectronic assemblies—many of which have been VCSEL & PD based optical Tx and Rx systems using individual components or arrayed components, typically 1x4 arrays. Palomar divides these assemblies into two classes by accuracy requirements. “The 6500 Die Bonder satisfies markets requiring less than 5um placement. The 3800 Die Bonder satisfies markets requiring greater than 5um placement accuracy. We have also been placing the molded lenses for these assemblies, either single or arrayed,” states Applications Manager and Sr. Scientist, Daniel Evans.

An application example of multi-channel communication that Palomar is currently working on is the Active Optical Cable (AOC):

Luxtera 
Photo credit: Luxtera

 Finisar
Photo credit: Finisar

 Zarlink
Photo credit: Zarlink

 

New Features at SEMICON West                                                                         

Over 20,000 visitors are currently registered for the show, and new features have been included this year—ensuring that this will be an extremely well attended and exciting show. Amongst the added programs to SEMICON West this year are The Semiconductor Technology Symposium and the Sustainable Manufacturing Forum. These are meant to provide attendees the opportunity to dig deeper into technical subject matters in a quieter, more intimate environment.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, wire bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly, and micron-level component attachment. Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world. For more information, visit www.palomartechnologies.com.

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Contact
Claudia Salerno
Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | 760.931.3681

Tags: 3800 die bonder, Announcements, 8000i Wire Bonder, 6500 die bonder, SEMICON West 2014

Automated Wire Bonding Production System Demonstrations at SEMICON China 2014

Posted by Katie Finney on Mon, Mar 17, 2014

Carlsbad, CA – March 17, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today the live demonstration of the 8000i Wire Bonder at SEMICON China 2014. SEMICON China is celebrating its 26th year, held this year at the Shanghai New International Expo Center on March 18-20.

Palomar Technologies' new 8000i Wire Bonder comes equipped with i2Gi® technology. The8000i wire bonder 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

Intelligent Interactive Graphical Interface (i2Gi) on the new 8000i Wire Bonder
i2Gi (cleverly pronounced “iggy”) is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.

8000i Data Sheet

8000i wire bonder, ball bumper, i2Gi 

i2Gi Data Sheet

i2Gi, intelligent interactive graphical interface, modern wire bond control software 

i2Gi supports modern automated wire bonding for complex hybrid production. Watch the video:

An 8000i Wire Bonder will be available for live demonstrations throughout the duration of SEMICON China in the Asia Science & Technology (AST) booth #3287 with supplemental information about our 3800 Die Bonder available also in the BE FIRST booth #3703. Mr. PH Chan, Palomar Technologies Asia managing director, will be onsite at the show to discuss automated wire bonding, die attach and full factory automation requirements. The Palomar Asia office may also be contacted online: http://www.palomartechnologies.com/contact-palomar-technologies-asia/.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly, and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Janine Hueners
Marketing Communications, Palomar Technologies
jhueners@bonders.com | +1 760-931-3680

Tags: 3800 die bonder, Announcements, Palomar Asia, 8000i Wire Bonder, i2Gi, SEMICON China

New Palomar Asia Facility for Demonstrations, Support & Training

Posted by Rich Hueners on Tue, Aug 06, 2013

Carlsbad, CA – August 6, 2013 –Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the opening of its new demonstration and applications development office, located in Singapore, effective immediately.

Palomar Technologies opening Ribbon Cutting Palomar Technologies Asia Singapore office reveals company logo

Palomar Technologies (SE Asia) Pte Ltd., (“Palomar Asia”) has been headquartered in Singapore since its establishment in August 2000—five years after Palomar Technologies, Inc., evolved as a former subsidiary of the Hughes Aircraft’s Industrial Product Division. Since the initial opening of Palomar Asia, the office has generated substantial business growth year-after-year and quickly became recognized for its superior support of Asia-Pacific customers requiring automated wire bond and die attach equipment.

The new Palomar Asia facility builds upon the established base of customer support, evolving into a “one-stop shop”  to offer full-capacity support. For example, the new facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.

Process Development Services data sheet

 

The automated microelectronics manufacturing requirements for the APAC region spans markets from aerospace/defense, optoelectronic, LED, RF/Wireless and medical for high-accuracy die attach and high-reliability wire bonding. Even amidst recent world-wide economic strain, the APAC region has rapidly grown for Palomar Asia—for both personnel and customer installed base. Palomar Technologies’ most popular large work area die attach platform—the ultra-flexible 3800 Die Bonder— and the “workhorse” Au wire/ball bump, deep access platform—the 8000 Wire Bonder—have continually exceeded customer expectations for quality, accuracy and process expertise support.

At SEMICON West 2013 in San Francisco, CA, Palomar Technologies launched the new 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM). Cleverly pronounced “iggy”, i2Gi is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bondersi2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation. 

Click here to read the launch press release for the 8000i Wire Bonder with i2Gi.

To meet the needs of its expanding installed base, Palomar Asia has tripled its workforce, mostly in the ranks of direct field service engineers. “Having direct field service engineers in every region with Palomar Technologies equipment has been key to our success,” affirms PH Chan, Palomar Asia Managing Director. “By offering expert hardware, process and application support directly to our customers, we are able to quickly resolve the most complex microelectronic assembly challenges at our customer’s sites.”

Since his arrival at Palomar Asia in 2010, Mr. Chan has developed and expanded a local APAC Spare Parts Depot, increased the number of APAC sales representatives and accelerated the regional marketing presence in Asia’s largest industry tradeshows.

August 2013 marks the beginning of a new era for Palomar Asia. The new Palomar Asia facility offers a new clean room and demonstration laboratory, outfitted with wire bonding and die attach capabilities, as well as measurement and test equipment.

The 8000i Wire Bonder was showcased at the Palomar Asia office grand opening event, held on Friday, August 2. The event hosted customers, suppliers and friends of Palomar Asia and included opening ceremonies such as traditional Chinese lion dance and pineapple roll for good luck.

Palomar Technologies Singapore microelectronics manufacturing center new Palomar Technologies Asia Singapore office opens with traditional Chinese prosperity ceremonies

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: http://www.palomartechnologies.com/contact-palomar-technologies-asia

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Palomar Asia Contact
Mr. PH Chan
Managing Director
phchan@bonders.com
(+65) 6686-3096

Palomar Technologies Media Contact
Mrs. Jessica Sylvester
Marketing Communications Manager
jsylvester@bonders.com
+1 (760) 931-3681

Tags: 3800 die bonder, Announcements, assembly and packaging, Palomar Asia, demonstrations, training, Assembly Services, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU)

Live Wire Bonding & Die Attach Demonstrations in Booth #6157 at SEMICON West 2012

Posted by Rich Hueners on Tue, Jul 03, 2012

Carlsbad, CA – July 3, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the company will be exhibiting live demonstrations on the 3800 Die Bonder and 8000 Wire Bonder at SEMICON West 2012, July 10-12 in San Francisco, CA, in booth #6157.

die attach demonstrationThe 3800 Die Bonder demonstration will reveal a fully automated component attach program highlighting the flexibility and high precision of the sub-5μm placement accuracy (application dependent) die attach system. The 3800 Die Bonder has a large 35.5" x 20" large work area to accommodate various presentation tools, a steady state and a pulsed heat system for eutectic bonding, multiple dispense technologies, die ejectors and Cognex Vision System on a single platform. The sturdy mechanical structure, process camera, quiet linear motors, 0.1μm linear XY encoders and direct measure 0.00023 degree rotary encoder are some of the sophisticated features available on this ultra-flexible die attach system.

8000 wire bonder head tool turretThe 8000 Wire Bonder will feature a fully automated wire bond, stitch-bond, chain bond and ball bump demonstration program, showcasing the bonder’s diverse application packaging capabilities. A ball bumper and stud bumper configuration of the 8000 Wire Bonder is a unique feature of this system—the wire bonder is the only available system that can produce co-planarized gold bumps in one step. The 8000 Wire Bonder is capable of deep access wire bonding up to 13.5mm. This fully automatic, thermosonic, high-speed ball-and-stitch gold bumper improves production yields and eliminates sources of variation in microelectronics packaging processes.

Palomar Technologies Assembly ServicesTM ("Assembly Services") is the contract assembly, process development, test and prototyping division of Palomar Technologies, ensuring strict IP protection, in-house highly skilled engineering staff and technicians, and a product suite of high-reliability, ultra high-accuracy advanced packaging systems. Assembly Services’ example capabilities—including flip chip, wafer level packaging, pick-and-place, deep access wire bonding and complex packaging processes—will be headlined throughout the Palomar Technologies exhibit space.

Palomar Technologies is accepting meeting requests throughout the duration of SEMICON West 2012. Requests may be submitted online at www.palomartechnologies.com/contact-us.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, Announcements, wire bonders, how to buy a bonder, Automation, ball bumping, automated component placement systems, automated packaging systems, assembly and packaging, demonstrations, 8000 wire bonder, automation vs. manual, wire bond demo, SEMICON West 2012, micron level placement, high precision die attach

Palomar Technologies Presents Sub-5um Die Attach Placement Accuracy Webcast

Posted by Rich Hueners on Tue, Jun 12, 2012

Carlsbad, CA – June 12, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that the company can support high-precision die attach to less than 5µm placement accuracies.

“As the trend to build smaller electronics pushes the limits of semiconductor packaging abilities, the need for high-accuracy and high-precision component placement often presents a challenge in itself,” stated Donald Beck, Palomar Technologies Assembly ServicesTM General Manager. “We are able to support [application dependent] requirements for ultra-high placement accuracies on our eutectic/epoxy 3800 Die Bonder and 6500 Die Bonder systems.”

The ultra flexible 3800 Die Bonder is designed for fully automatic, precision microelectronics assembly. The tightly regulated,computer-controlled work cell can perform up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. The 3800 Die Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions.

The 6500 Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless and medical applications. This eutectic die bonder is designed for fully automatic precision component assembly—even up to 1.5µm placement accuracy (application dependent)—making component assembly practical and cost effective. Wafer Scale Packaging (WSP) eutectic die attach on the 6500 Die Bonder provides customers with a complete microelectronic solution for P-side down laser diode attachment (die-to-wafer), a pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, a wafer stage with steady state heating, and waffle or gel pack presentation of laser diode applications.

Mr. Beck is presenting a 30-minute live webcast on June 13 at 12:00pm Eastern Time, discussing new developments for ultra high-precision component packaging: “<5micron Placement Accuracy" target="_self">High-Reliability Component Attachment Process for <5micron Placement Accuracy ".

The webcast will cover a process solution for <5µm component attach" target="_self">automating <5µm component attach specific to organizations requiring high-reliability device packaging. In this webinar, Mr. Beck will cover methods that have been proven through real-world experiences related to the high-reliability microelectronics industry. Joining Mr. Beck will be Mr. Zeger Bok (Sr. Application Engineer) and Mr. Daniel Martinez (Assembly Services Lab Manager & Manufacturing Engineer) for live Q&A after the formal presentation.

Register now for the live webcast, presented on June 13 at Noon Eastern Time. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, Announcements, device design, die bonders, eutectic die attach, eutectic soldering process, die bonding, gold tin eutectic die attach, 6500 die bonder, eutectic process, die bonder, IMAPS, eutectic, eutectic tutorial, gold tin die attach, placement accuracy of microelectronic components

New Demonstration Center & Expanded Spare Parts Depot to Further Support Palomar Technologies Die Bonder & Wire Bonder Customers in Asia-Pacific Region

Posted by Rich Hueners on Tue, May 29, 2012

Carlsbad, CA – May 29, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the successful expansion of the company’s Singapore-based demonstration center and spare parts depot to better support its growing Asia-Pacific customer base.

With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, Palomar Technologies has successfully expanded the Palomar Asia Spare Parts Depot and regional customer services infrastructure. Mr. PH Chan, director of Palomar Technologies Asia, recently confirmed the Palomar Asia Spare Parts Depot will be able to meet requests for overnight spare parts delivery to regional APAC customers.

In addition to the expanded Palomar Asia Spare Parts Depot, Chan has also led the development of a Singapore-based demonstration laboratory in order to support increasing demand for in-person 8000 Wire Bonder and 3800 Die Bonder demonstrations with APAC customers. Providing customer-focused private bonder demonstrations has always been part of Palomar Technologies’ niche identity. This unique one-on-one service is now available regionally to APAC companies.

UltraCleanTechnology Singapore WireBonderDieBonderDemonstrations

“In 2010, Palomar Technologies launched the 3800 Die Bonder, designed for fully automatic, precision microelectronics assembly and die attach processes,” states Chan. “The 3800 continues to be a success with our customers worldwide; however, the greatest need for the 3800 Die Bonder has proven to be within the emerging markets in Asia. The 3800 Die Bonder utilizes a large work area and various presentation tools for epoxy dispense and steady state and pulsed heat eutectic die attach—proving to be the most versatile, high-accuracy die bonder in the market for advanced microelectronics assemblies and complex hybrids.”

The new Palomar Asia demonstration laboratory is outfitted with applications and process development capabilities for both wire bond and die attach. Expert Palomar Technologies Field Service Engineers and Technical Liaisons will continue to lead demonstrations.

Palomar Technologies Asia is accepting appointments for on-site wire bonder or die attach demonstrations. Schedule a demonstration appointment by contacting Palomar Technologies Asia at (+65) 6779-2766 or online at http://www.palomartechnologies.com/contact-palomar-technologies-asia.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, capturing more value, capital equipment, Palomar Asia, demonstrations, training, 8000 wire bonder, Bonder Boot Camp

National Hockey League Uncompressed HD Video Goal Capturing Enabled by Palomar Technologies and VubIQ

Posted by Rich Hueners on Tue, Apr 10, 2012

Carlsbad, CA – April 10, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its collaboration with VubIQ, Inc., to enable the new HD video capturing system for the National Hockey League (NHL) in-goal cameras.

After completing a rigorous series of prototype testing and field trials with Palomar Technologies Assembly ServicesTM (“Assembly Services”), VubIQ was given an order to equip all 30 NHL venues throughout the U.S. and Canada with GoalCam systems. Each system is comprised of two units: a GoalCam unit (HD camera and 60 GHz transmitter) and a 60 GHz receiver unit. Additionally, each unit is designed to incorporate future Wi-Fi upgrades, allowing for remote wireless adjustment of seven different functions: camera pan, camera tilt, RF antenna pan, RF antenna tilt, HD camera focus, HD camera iris, and HD camera zoom.

“Historically, the NHL had difficulties verifying whether or not a “close call” was an actual goal, and lacked a consistent or reliable vetting method. VubIQ received an order to provide systems to the NHL for highly reliable goal adjudication,” stated Adam Button, CEO of VubIQ. “With cameras far overhead positioned in various angles around the rink, the puck could not be video recorded at a close distance or in high resolution as it crossed (or did not cross) the goal line. Until now, goal judges positioned behind each goal during games typically made the call by switching on a red flashing light; but these judges did not have the luxury of instant replay or precise slow motion (forward or reverse) to assist with close calls. Now, however, with our GoalCams positioned inside the goal itself, and transmitting the uncompressed HD video wirelessly to the judging booth, it is as though the goal judges are literally right on top of the action—only with the additional benefit of slow-motion, back-and-forth replay in full HD.”

Since a cabled solution to this problem would not be feasible, an extremely high bandwidth wireless system was required. Marketing the GoalCam technology though its OEM distributor, VidOvation, Vubiq provides the NHL with an elegant wireless solution utilizing the unlicensed 60 GHz spectrum that addresses two key issues—achieving the highest possible video quality and eliminating transmission interference.

Assembly Services supported VubIQ through the development and optimization of precision die attach processes and the parameters for all wire interconnecting and encapsulation processes to assemble the components for the GoalCam transmitters (TX) and receivers (RX).  Assembly Services also managed the substrate attach process and final documentation of all final module packaging processes where the completed sub-assembly is mounted onto aligning hardware.


About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About VubIQ

VubIQ, headquartered in Aliso Viejo, California, is a millimeter wave technology company specializing in the development of components and final products utilizing 60 GHz silicon transmitters and receivers. While there is a strong worldwide effort to develop the silicon by major fabrication houses, no other company has achieved the capability of effectively packaging that silicon into efficient, low cost, and highly manufacturable products. VubIQ has five issued patents and six others in process. The technology underlying all of VubIQ’s current and future product offerings utilizes millimeter wave radio frequencies to transmit and receive signals and data at extremely high data rates, in a very small form factor, and at low cost.

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Tags: 3800 die bonder, Announcements, applications, automated component placement systems, automated packaging systems, assembly and packaging, 8000 wire bonder, Application Process, HD Camera, VubIQ