Palomar Technologies Exhibits at SEMICON Taiwan 2011 and Offers a Laser Interferometer Technology for Wire Bonder Ultrasonic Calibration System

Posted by Rich Hueners on Thu, Sep 01, 2011

Carlsbad, CA – August 31, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at SEMICON Taiwan 2011 in Taipei from September 7-9 in booth #1006.

The Palomar Technologies Asia-Pacific team has joined forces with Supremetec Materials, Inc. to offer the latest in high-accuracy die bonders and wire bonder systems at this year’s tradeshow. Mr. PH Chan, Palomar Technologies’ Asia-Pacific Director, will be on-site to discuss the latest advancements in systems and process development from Palomar Technologies.

“In order to ensure a seamless transfer of equipment, the Palomar Technologies Asian field services team works closely with customers to cover proper planning, coordination and scheduling. Our customers experience a ‘plug and play’ when the die bonders arrive at their Asian facilities,” states Chan. “Most of our Asian customers who previously deployed 3500 Die Bonders have now entered the second phase of their expansion in production capacity by purchasing new equipment. We have seen an increase in customers’ decision to switch over to the ultra-flexible 3800 Die Bonder to meet new and more challenging packages, such as those requiring 5-7um placement accuracy at 3-sigma.”

Palomar Technologies combines more than 30 years of process know-how with a high-precision line of machines to ensure their bonders maintain production at peak performance. The 2100C Laser Interferometer provides a non-contact method to check the performance of a wire bonder’s ultrasonic system through laser interferometer technology. Without calibration, a wire bonder will suffer process inconsistencies. The 2100C makes this calibration an efficient and user-friendly action.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Carlsbad, CA,2011/9/1, Palomar是世界頂尖微機電與光電封裝系統的服務提供者,今日宣布將參加2011台灣半導體展,從9/7到9/9,攤位號碼1006。

Palomar亞洲區營運總部與台灣Supremetec Materials, Inc今年一起在台灣介紹最新高精密度黏晶機與打線機。Palomar亞洲總监-PH Chan將會於現場就Palomar機器討論最新進展與產品開發流程。

PH說 “為了確保儀器運轉順利,Palomar亞洲營運總部與客戶之間緊密的配合與合作。當黏晶機設備抵達亞洲時,我們的客戶體驗到了所謂的隨插即用的簡單方便性。大多數於亞洲擁有機型3500 黏晶機的客戶,目前都進入了下個擴展階段要購買新儀器。我們發現增加了很多客戶要決定換購多功能的超高弾性機型3800的黏晶機,以便符合產品的多元性封裝挑戰,像是具備在3-sigma下達到5~7 um的放置精確度。”

Palomar Technologies 以30年的工艺經驗配合了各種高精密度設備,使公司所提供的黏晶機與打線機運作的更加完美。2100C Laser Interferometer雷射機透過雷射技術提供非接觸性技術來檢測打線機的超音波系統性能,該方法藉計算干擾邊線方式精確量測過實際超音波軌跡。 未經過校正的打線機會面臨一連串的不協調問題。2100C會讓這校正更有效率與操作上容易使用。

關於Palomar Technologies

Palomar Technologies 前身是休斯航太,是世界上頂尖提供自動化高精密度,大工作區域黏晶機與打線機的服務廠商。顧客使用Palomar的機器,服務與方法來達成對光電產品的封裝,多種類的組裝與微機電種類的貼合。相關更多資訊請參閱www.palomartechnologies.com

Tags: 3800 die bonder, wire bonding, trade shows, wire bonders, 3500 Die Bonder, 2100C, semicon taiwan, wire bond calibration

Palomar Technologies to Provide Live Demonstrations of the 3500-III Die Bonder at SEMICON China 2011

Posted by Rich Hueners on Mon, Mar 14, 2011

CARLSBAD, CA - March 14, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will showcase live demonstrations of the 3500-III Die Bonder at SEMICON China 2011 in Shanghai.

Palomar Technologies will exhibit a 3500-III Die Bonder at booth #3615 at the SEMICON China 2011 conference on March 15-17. In conjunction with the high-precision die bonder machine, Palomar Technologies will offer demonstrations of a Royce Instruments DE35-ST Mechanized pick-and-place system and a Hybond, Inc., UDB-141 Semi-automatic Eutectic Die Bonder. Palomar Technologies Asia Director, Mr. PH Chan, will be on-site at SEMICON China 2011 to engage in discussions of Palomar Technologies high-accuracy die attach and wire bonder systems and solutions.

Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is Odd-Form Factor Package Wire Bond Case Studies, a technical paper exploring the wire bonding requirements of several device cases considered odd form factor package formats when compared to mainstream semiconductor packaging. Solutions to wire bond packages in the RF, automotive, and optical markets are also discussed.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: die bonders, eutectic die attach, die bonding, Epoxy Die Attach, 3500 Die Bonder, SEMICON China, eutectic process, die bonder, eutectic, large area bonder, inline assembly, odd form factor

Palomar Technologies Presents Latest Version of Award-Winning Automatic 3500-III Die Bonder

Posted by Rich Hueners on Mon, Mar 12, 2007

Designed for fully automatic, high accuracy, precision microelectronics assembly, the flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area. Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules, and hybrid microcircuits.

The 3500-III is capable of performing automated eutectic die attach utilizing backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets. Palomar’s patented eutectic process is key for high yield and reliability because eutectic die attach is one of the most difficult processes to control. Palomar’s pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.

Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-III’s sub-micron axis resolution yields typical placement repeatability of better than ±12 micron (0.5 mil), 3 sigma with fluids, ±5 micron (0.2 mil), 3 sigma with pulse heat eutectic applications.

With the 3500-III, placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms. Relative-to-die placement algorithms place the die so that the second, third, and each die or substrate thereafter is placed relative to the final location of the last placed component rather than the package. This provides greater accuracy from component to component. It also controls the subsequent wire length and position, ensuring that the wires are parallel and the lengths are the same, factors important for high frequency electrical performance.

The machine base is a honeycomb core optical table that provides vibration damping and thermal settling response superior to granite. Its work area is the largest available. The cantilever design permits unobstructed, open access on three sides for set-up. Soft touchdown or non-contact laser height sensing mechanisms assist in precise pickup and placement of fragile devices such as gallium arsenide. An 8-position turret head can rapidly change tools on the fly without a space and time-consuming tool dock assembly.    Because it is constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.

The 3500-III employs an infrared light curtain around the entire open perimeter of the assembly cell. This safety curtain sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation. When the system is in operation and the safety curtain is violated, the system immediately (within ~ 3 milliseconds) shorts the inputs to the digital servo driven motors, bringing all motion to a near instant stop.

The system uses a Windows XPTM operating system, employing Cognex Corporation’s latest Series 8000 gray-scale pattern recognition systems. The graphical, user-friendly interface assists in bonding set-up, operation, diagnostics, and calibration.The new, high-visibility, flat screen displays on the 3500-III greatly improve the unit’s ergonomics. It is SMEMA compatible and can be configured with loaders to provide small island operations or complete in-line system
solutions. From wafer to eutectic die attach, handling options are fully programmable.

“The Model 3500-III is a workhorse machine, yet it is the most flexible, precise, accurate die bonder available,” said Palomar Technologies president, Bruce Hueners. “It has been referred to as the ‘Swiss Army Knife of bonders’.”

Customers seeking to extend the service life and increase productivity of their Model 3500-II Automatic Component Placement Systems can now order a 3500-III upgrade directly from Palomar and achieve the same high level of reliability and productivity as a new Model 3500-III. The 3500-III upgrade includes a faster 32-bit computing system, Windows XP operating system, faster and more versatile Cognex 8000 Pattern Recognition system, energy-efficient space- saving flat panel displays, and a suite of powerful software tools featuring Bond Data Miner (BDM) which includes improved process development tools, automated SPC data documentation and component traceability. Customer trials indicate an increase in productivity measured in raw throughput of up to 18%, depending on materials and application.

About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the photonics, wireless, microwave, automotive, aerospace, medical, and life sciences industries.


Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, and active optical align and attach. Palomar’s Process Development and Prototyping Services assists companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. For more information, visit www.palomartechnologies.com or contact 760-931-3600.

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Let Us Help You
We would be happy to evaluate your process application need and propose a solution. Please call us at (760) 931-3600.

Tags: die bonders, eutectic die attach, die bonding, automated component placement systems, automated packaging systems, Epoxy Die Attach, 3500 Die Bonder, eutectic process, die bonder

Honored for 3500-II Die Bonder Automatic Component Placement Cell

Posted by Rich Hueners on Sun, Jul 02, 2006

Carlsbad, Calif. –Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announces that it received the Editors’ Choice Best Product Award for its Model 3500-II Automatic Component Placement Cell. Presented annually by Semiconductor International magazine, the award honors products that are making a difference in semiconductor manufacturing.

Palomar Technologies received the award in a ceremony held July 12, 2006 during the SEMICON West trade show in San Francisco, California. This is the second consecutive year, and the third time, that Palomar has won this award.

The Model 3500-II is designed for fully automatic, high accuracy, precision microelectronics assembly. The flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area. Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-II sub-micron axis resolution yields typical placement accuracies of better than ±12 micron (0.5 mil), 3 sigma. Applications include flip chip, stacked die, chip-on-board, fine pitch surface mount, multi-chip modules, microwave modules, and hybrid microcircuits.
Palomar's team, including some of its most experienced engineers, consistently improves this multi-functional, multi-dimensional, flexible tool to push the limits on speed and accuracy. The Model 3500-II represents the latest development in Palomar’s long history of manufacturing automatic placement systems. Beginning with the Model 2500, the technology has grown and evolved into what is now the dynamic and highly customizable Model 3500-II that Palomar continues to improve. A new generation system, the Model 3500-III is ready for introduction.

"Advances in semiconductor technology are only possible because of the kinds of products being honored in this year's Editors' Choice Best Product Awards program," said Pete Singer, Editor-in- Chief of Semiconductor International. "Chipmakers rely on these products to create electronics that are smarter, smaller, faster, less expensive, and more reliable. We congratulate the people and the companies that have had the insight and fortitude to bring these products to the market."
Semiconductor International, published by Reed Business Information and a part of Reed Elsevier's global array of information products, is the leading technical publication reaching and covering the global semiconductor manufacturing industry. It has the largest circulation to semiconductor manufacturers of any industry publication.

About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the semiconductor, photonics, wireless, microwave, automotive, aerospace, medical, and life sciences industries.

Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, ball bumping, and active optical align and attach. Palomar’s Process Development and Prototyping Services assist companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. For more information, visit www.PalomarTechnologies.com or contact 760-931-3600.

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Let Us Help You
We would be happy to evaluate your process application need and propose a solution. Please call us at (760) 931-3600.

Tags: bonders, die bonders, eutectic die attach, die bonding, automated component placement systems, automated packaging systems, Epoxy Die Attach, 3500 Die Bonder