Press Release

Carlsbad, CA – August 31, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at SEMICON Taiwan 2011 in Taipei from September 7-9 in booth
Posted by Palomar Technologies MarCom Team on Wed, Aug 31, 2011 @ 08:00 PM
CARLSBAD, CA - March 14, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will showcase live demonstrations of the 3500-III Die Bonder at SEMICON China
Posted by Palomar Technologies MarCom Team on Mon, Mar 14, 2011 @ 12:00 PM
Designed for fully automatic, high accuracy, precision microelectronics assembly, the flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46
Posted by Palomar Technologies MarCom Team on Mon, Mar 12, 2007 @ 01:00 PM
Carlsbad, Calif. –Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announces that it received the Editors’ Choice Best Product Award for its Model 3500-II Automatic Component
Posted by Palomar Technologies MarCom Team on Sat, Jul 01, 2006 @ 06:21 PM