Palomar Technologies to Exhibit at the Optical Fiber Communication Conference 2015

Carlsbad, CA – March 24, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) at booth #420 on March 24-26 in Los Angeles, CA.

LA_convention_center2

With over 13,000 attendees and over 65 countries represented, OFC is the largest global conference and exposition for optical communications and networking professionals. Some of the hot topics for this year’s conference include:

  • Digital signal processing for optical fiber communication systems
  • Amplification, fiber, and multiplexing techniques for capacity
  • Cloud and data center networking
  • Digital signal processing for optical fiber communication systems

Optoelectronic Packaging

OFC will also be having comprehensive peer reviewed presentations in key topic areas including Optoelectronic Devices. Three equally important concerns for optoelectronic devices are package design, controlled assembly processes and meeting critical assembly alignment and position tolerances. Palomar Technologies manufactures and services highly advanced microelectronic packaging systems, excelling in advanced processes, high purity, exceptional heat transfer and precision.

Palomar Technologies Solution

Palomar Technologies' Assembly Services are a perfect-fit solution for optoelectronic packaging without investing in capital equipment. This minimizes the customer’s project risk and accelerates time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring a sustainable competitive advantage.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information: 

 

3800 Data Sheet 6500 Data Sheet 8000i Data Sheet
3800 Die Bonder Data Sheet 6500 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

 

 

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Contact

Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680