Palomar Technologies Inc. Files Patent Infringement Lawsuit Against MRSI to Protect Ultra-High Accuracy Placement and Die Attach Capability

Posted by Katie Finney on Tue, Jul 14, 2015

Carlsbad, CA – July 14th 2015 – Palomar Technologies, Inc. filed a patent infringement lawsuit on July 6th, 2015 against MRSI Systems LLC in the United States District Court for the Southern District of California.

The suit alleges that certain MRSI products infringe on Palomar’s United States Patent No. 6,776,327, entitled “High-Accuracy Placement Method Utilizing Double Pick and Place." This process enables highly accurate placement of microelectronic components.

Palomar’s high precision die attach systems are designed for fully automatic, precision microelectronics assembly.  Applications and processes range from optoelectronic devices, RF modules, HB/HP LED, automotive sensors, and Microphotonics. “With die and package geometries getting ever smaller, precision placement is becoming an increasingly important factor in more applications than ever before” said Daniel Evans, Palomar’s Chief Technology Officer.

"Palomar will vigorously enforce its patent rights to protect our substantial investment in innovative, high accuracy placement technology and capabilities” said Bruce Hueners, Palomar’s President and Chief Executive Officer.

About Palomar Technologies

Palomar Technologies, Inc., a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire and wedge bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment.  For more information, visit www.palomartechnologies.com.

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | (760) 931-3680 

Tags: patent infringement, lawsuit

Palomar Technologies Exhibits at SEMICON West 2015 Showcasing Bonder Demos

Posted by Katie Finney on Tue, Jul 07, 2015

Carlsbad, CA – July 7, 2015Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that they will perform product demos at booth #5968 at SEMICON West 2015 on July 14-16 at the Moscone Center in San Francisco. The 3800 Die Bonder, 9000 Wedge Bonder, and SCI Plasma Cleaner will be showcased through live demonstrations, as well as other leading edge packaging solutions.  

3800_hi_res-1

The 3800 Die Bonder utilizes a large work area, various presentation tools, steady state and pulsed heat system for eutectic bonding, high-accuracy motion system, multiple dispense technologies, die ejectors and Cognex® Vision System. This bonder comes with a process camera for live viewing of pick-and-place processes. The sophisticated 8-position tool turret enables rapid tool changes on the fly. Also, it has a 35.5" x 20" work area with linear motors, pulse heat and steady state stages for eutectic die attach and 2 and 3 channels of adhesive dispensing.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering control and flexibility. The 9000 features a large 190002”x6” work area and the ability to easily change from a 45-60° wire feed range to 90° deep access. The quality control enabled by the 9000 is unparalleled, with real-time bond monitoring and process control software as well as a robust, low maintenance bond head. With the 9000 there is no need for an expensive bond head change, as the wire clamps are easily replaceable and adjustable.

SEMICON West  

Attracting over 650 international exhibitors, SEMICON West connects you to innovation, opportunity, technology, and information. This year’s SEMICON West highlights consist of distinguished keynote speakers, a variety of different programs, and energetic show floor events such as special displays and the Innovation Village. SEMICON West is the place to converge with industry leaders, explore strategic issues, discover new technologies, discuss new solutions, and connect with customers and suppliers.

 About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, wire and wedge bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information: 

9000 Wedge Bonder
3800 Die Bonder Data Sheet

9000 Wedge Bonder data sheet

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Contact
Claudia Salerno
Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | 760.931.3681

Tags: SEMICON West 2015

Palomar Technologies’ President and CEO, Bruce Hueners, is an EY Entrepreneur of The Year® 2015 Award Finalist

Posted by Katie Finney on Wed, May 27, 2015

Carlsbad, May 26, 2015 – EY today announced that President and Chief Executive Officer, Bruce Hueners of Palomar Technologies is a finalist for the EY Entrepreneur Of The Year 2015 Award in San Diego. The awards program recognizes entrepreneurs who demonstrate excellence and extraordinary success in such areas as innovation, financial performance and personal commitment to their businesses and communities.  Bruce Hueners was selected as a finalist by a panel of independent judges.  Award winners will be announced at a special gala event on June 18, 2015 at The Fairmont Grand Del Mar. 

"I am truly honored by this recognition and want to particularly express gratitude to my fellow employees at Palomar for their diligence, perseverence and teamwork, which made this all possible," says Bruce Hueners.

Now in its 29th year, the program has expanded to recognize business leaders in more than 145 cities in more than 60 countries throughout the world. 

Regional award winners move forward to compete for the EY Entrepreneur Of The Year National program.  Award winners in several national categories, as well as the EY Entrepreneur Of The Year National Overall Award winner, will be announced at the annual awards gala in Palm Springs, California, on November 14, 2015. The awards are the culminating event of the EY Strategic Growth Forum®, the nation’s most prestigious gathering of high-growth, market-leading companies.

Sponsors
Founded and produced by Ernst & Young LLP, the EY Entrepreneur Of The Year Awards are sponsored nationally by the Ewing Marion Kauffman Foundation and SAP America.

In San Diego, sponsors include: Barney & Barney (a Marsh & McLennan Agency LLC Co.), Union Bank, The Daily Transcript, Merrill Datasite, Scherzer International, Cresa, Chase Bank, and Allison+Partners.

Contact information
To receive more information, contact: Kathy Beckman at (949) 437-0236 or kathy.beckman@ey.com.


About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, wire and wedge bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About EY Entrepreneur Of The Year®
EY Entrepreneur Of The Year is the world’s most prestigious business award for entrepreneurs. The unique award makes a difference through the way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Entrepreneur Of The Year celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 145 cities in more than 60 countries. Follow news on Twitter @EY_EOY #EOYSD.

About EY
EY is a global leader in assurance, tax, transaction and advisory services. The insights and quality services we deliver help build trust and confidence in the capital markets and in economies the world over. We develop outstanding leaders who team to deliver on our promises to all of our stakeholders. In so doing, we play a critical role in building a better working world for our people, for our clients and for our communities.

EY refers to the global organization, and may refer to one or more, of the member firms of Ernst & Young Global Limited, each of which is a separate legal entity. Ernst & Young Global Limited, a UK company limited by guarantee, does not provide services to clients. For more information about our organization, please visit ey.com.

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Media Contact
Claudia Salerno

Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681

Palomar Technologies to Exhibit at the 2015 International Microwave Symposium

Posted by Katie Finney on Tue, May 19, 2015

Carlsbad, CA – May 19, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they will be one of over 550 exhibitors at the International Microwave Symposium (IMS) at booth #2517 on May 19-21 in Phoenix, Arizona. IMS is “the premier annual international meeting for technologists involved in all aspects of microwave theory and practice”. IMS stated, “It is the synergy of the Exhibition in conjunction with the Technical Symposia that makes Microwave Week the premiere international gathering for everyone involved in technologies associated with RF, microwave, millimeter wave, and THz frequencies”.

Automated wire bonders were introduced in the early 1980s. At that time, the majority of interconnects were made using aluminum wire. As the need for high reliability increased, gold wire became more common. As package densities increased, wire interconnect bond pitches decreased. The initial solution to fine pitch was wedge bonding because the wedge tool design allows wires to be bonded in close proximity (side-to-side).9000_pic17_hi_res

The RF and microwave markets are characterized by lower volume and higher mix when compared to semiconductor packaging. This requires different levels of manual and automatic assembly process steps depending on product and manufacturing maturity. Suppliers can help customers through the various stages of manufacturing automation by providing manual, semi-automatic, and fully automatic islands and lines of equipment and process.

Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never-ending pursuit of cost savings, there remain a significant number of applications requiring a wildly different set of capabilities for die and wire bonding.

wedge_emulation

Wedge vs. Ball Bonding

Download "RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies" to take a deeper look at varying die attach and wire bonding requirements for emerging applications in the RF and microwave markets. The paper discusses three case studies:

  1.     RF-SOE Product (High Accuracy Die Bond + Semi/Automatic Wire Bond)
  2.     Optoelectronic Printer Product (Ultra Accuracy Die Bond)
  3.     High Brightness LED Matrix Product (High Accuracy Die + Semi/Auto Chain Wire)

About Palomar Technologies:

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information:

RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies 9000 Data Sheet
RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies 9000 Wedge Bonder data sheet

 

 ----
Katie Finney
Marketing Specialist
Palomar Technologies, Inc.

Tags: RF Packaging, 8000i Wire Bonder, microwave applications, International Microwave Symposium (IMS), 9000 Wedge Bonder

Palomar Technologies Introduces the 9000 Wedge Bonder to Germany at SMT Hybrid Packaging 2015

Posted by Katie Finney on Tue, May 05, 2015

Carlsbad, CA – May 5, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, will be introducing the 9000 Wedge Bonder to Germany at the 2015 SMT Hybrid Packaging conference in Nuremberg, Germany on May 5-7. They will be showcasing the 9000 Wedge Bonder as well as their 8000i Wire Bonder at their booth located in hall 7A, booth 7A-521.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering control and flexibility. The 9000 features a large 12”x6” work area and the ability to easily change from a 45-60° wire feed range to 90° deep access. The quality control enabled by the 9000 is unparalleled, with real-time bond monitoring and process control software as well as a robust, low maintenance bond head. With the 9000 there is no need for an expensive bond head change, as the wire clamps are easily replaceable and adjustable.PT5-White

There are seven strategic components to the 9000 Wedge Bonder that help customers achieve modern wedge bond requirements:

  •          Large work area
  •          Inline factory automation
  •          Advanced user control
  •          Bond data miner
  •          High-speed wire bonding
  •          Wire feed clamp versatility
  •          High-precision

Palomar Technologies pioneered the first automated fine wire wedge bonders in the 1980s and today carries the technological legacy into the industry’s most advanced fine wire wedge bonder on the market.

Operational Features for Control and Precision

The Intelligent Interactive Graphical Interface® (i2Gi®) is an advanced GUI software feature implemented on the 9000 Wedge Bonder, and is an exclusive Palomar Technologies technology. i2Gi offers the required management tools for modern wedge bonding, from part design and development, to process validation, and finally to intuitive operations control. i2Gi was designed for 9000 Wedge Bonder operating technicians to work smarter, faster and with more control.

The natural navigation flow and interactive live graphical display of i2Gi lets bonder program developers and operators experience real-time bonding and part quality validation. i2Gi technology supports advanced wedge bond control through command tools which work in concert to provide a dynamic and intuitive user experience. 

Process Advantages

The 9000 Wedge Bonder addresses a wide range of fine wire wedge bond applications including disk drives, large complex hybrids, MCM power connections, ribbon bonding, low profile wire bonds, running stitch interconnects, and fine pitch devices. Some process advantages of the 9000 Wire Bonder include:

SMT
  •          Providing various loop form functions
  •          Highly regulated constant wire length
             as well as loop height
  •          Individual loop shapes
  •          Loop length range from
             70um to 20mm.

The 9000 Wedge Bonder also incorporates Bond Data MinerTM which is an all-inclusive and centralized data management and analysis system. This is a powerful tool to improve yield and utilization.

Delivering What Programmers Desire

Modern wedge bond requirements demand an automated, large bonding area system with scalability to increase production capacity without limiting performance. In order to achieve best efficiency at lowest cost, programmers and operators need relevant and real-time production feedback from their equipment.

With the 9000 Wedge Bonder, lab managers are able to have peace of mind that their bonder is fully supported by a highly trained team of field service and process development consultants.

9000 Data Sheet i2Gi Data Sheet
9000 Wedge Bonder data sheet i2Gi, intelligent interactive graphical interface, modern wire bond control software

 

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Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681

 

Tags: i2Gi, 9000 Wedge Bonder

Palomar Technologies to Exhibit at the Optical Fiber Communication Conference 2015

Posted by Katie Finney on Tue, Mar 24, 2015

Carlsbad, CA – March 24, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) at booth #420 on March 24-26 in Los Angeles, CA.

LA_convention_center2

With over 13,000 attendees and over 65 countries represented, OFC is the largest global conference and exposition for optical communications and networking professionals. Some of the hot topics for this year’s conference include:

  • Digital signal processing for optical fiber communication systems
  • Amplification, fiber, and multiplexing techniques for capacity
  • Cloud and data center networking
  • Digital signal processing for optical fiber communication systems

Optoelectronic Packaging

OFC will also be having comprehensive peer reviewed presentations in key topic areas including Optoelectronic Devices. Three equally important concerns for optoelectronic devices are package design, controlled assembly processes and meeting critical assembly alignment and position tolerances. Palomar Technologies manufactures and services highly advanced microelectronic packaging systems, excelling in advanced processes, high purity, exceptional heat transfer and precision.

Palomar Technologies Solution

Palomar Technologies' Assembly Services are a perfect-fit solution for optoelectronic packaging without investing in capital equipment. This minimizes the customer’s project risk and accelerates time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring a sustainable competitive advantage.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information: 

 

3800 Data Sheet 6500 Data Sheet 8000i Data Sheet
3800 Die Bonder Data Sheet 6500 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

 

 

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Contact

Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

Tags: 3800 die bonder, 8000i Wire Bonder, 6500 die bonder

Palomar Technologies’ CTO to Present at SEMICON China 2015

Posted by Katie Finney on Tue, Mar 17, 2015

Carlsbad, CA – March 16, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at SEMICON China 2015. SEMICON China is celebrating its 27th year anniversary and will be held at the Shanghai New International Exhibition Center on March 17-20.

9000_pic17_hi_res

Dan Evans, Palomar Technologies’ Chief Technical Officer, will be presenting his technical paper titled “Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies” at this year’s SEMICON China conference.

Mr. Evan’s technical paper discusses both VCSEL and EEL technologies from a packaging architectural view with case studies showing high accuracy pick and place of the laser die, photo detector, and lens attachments. He also presents example cases to show the challenges and solutions to high accuracy die attach active optical cables. The paper is applicable to process engineers and managers who currently, or plan to, assemble Active Optical Cable transceivers or other similar packages using high accuracy pick and place systems. 

In addition to Dan Evan’s presentation of his technical paper, Palomar Technologies is also looking forward to showcasing their 9000 Wedge Bonder as well as performing live demonstrations of their 3800 Die Bonder and 8000i Wire Bonder at this year’s SEMICON China.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90° deep access on a single large work area. There are 7 key differentiators to the 9000 Wedge Bonder, which help customers achieve modern wedge bond requirements.  
7 key differentiators

The ultra-flexible 3800 Die Bonder is designed for fully automatic, precision microelectronic assembly. The 3800 is versatile, powerful and can provide specialized functions in addition to its primary functions.

Palomar Technologies’ 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. 

The Palomar Asia office may be contacted online: www.palomartechnologies.com/contact-palomar-technologies-asia/. 

Download these resouces for more information:

9000 Data Sheet 3800 Data Sheet 8000i Data Sheet
9000 Wedge Bonder data sheet 3800 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

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Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com| +1 760-931-3681

Tags: 3800 die bonder, 8000i Wire Bonder, SEMICON China, 9000 Wedge Bonder

Palomar Technologies Acquires SST International

Posted by Katie Finney on Tue, Mar 03, 2015

Carlsbad, CA – March 3, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems has acquired SST International, a turnkey supplier of vacuum and pressure furnaces for soldering, brazing, glass-sealing and wafer bonding of microelectronic packages and components.  SST International will complement Palomar’s existing line of wire and die bonders to provide customers the premier “one-stop shop” for precision assembly and hermetic packaging of electronic components.

“SST International will leverage Palomar’s established market presence and global network to provide customers with unmatched equipment capability and process know-how”, said David Muhs, President of SST International.  “This is an exciting time for SST and our customer base as we find tremendous opportunities for growth with the expansion of the company's portfolio. We are committed to providing high levels of product quality and support. The combination of our reputation and that of Palomar’s holds a promising future for SST and our customers.”

HQ8_cropped

“We are honored to welcome SST International into the Palomar family,” said Bruce W. Hueners, CEO of Palomar Technologies.  He states, “SST’s reputation for providing superior process knowledge and equipment functionality for soldering, brazing and package sealing will round out Palomar’s proven line of precision wire and die bonders.  With SST we combine years of understanding in the unique materials and exacting processes of microelectronic assembly, especially eutectic bonding, and are passionate about being indispensable to our customer’s success.”

About SST International

SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment.  For more information, visit www.sstinternational.com.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire and wedge bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.


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Media Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

Tags: Announcements, Acquisition, SST International

Palomar Technologies to Exhibit at 2015 Strategies in Light Exhibition and Conference

Posted by Katie Finney on Wed, Feb 25, 2015

Carlsbad, CA – February 24, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced that they will return to exhibit at the 2015 LED-focused show, Strategies in Light, this week February 24-26 held in Las Vegas.

HB/HP LED Assembly

One of the fastest growing technologies in the world is High-Bright/High-Power LEDs. Industrial and commercial lighting contribute largely in the HB LED market growth. Other end uses are found in aircraft lighting and powerful heaters in water purification systems. These LEDs are very efficient by a factor of ~60%. They are durable, long-lasting and, over time, cost reducing. The LED enables its user to essentially get more for less. HB LEDs can drive very high currents into the hundreds of mA; some HB LEDs can emit lumens in the thousands.

HBHP_LED_Assembly

HB LED tolerances are easily obtained with Palomar Technologies' machines to meet the package requirements of LEDs. Optimal thermal conductivity is achieved through the eutectic bonding process using the Palomar Technologies designed Pulsed Heat System stage.

Precise LED die attach applications can be manufactured using silver-filled conductive epoxy dispensing and daubing methods on a 3800 Die Bonder. Palomar Technologies has been working with advanced LED designs for over seven years, and was one of the first companies to process matrix LEDs – in modules containing anywhere from six to over 1,000 die.

LED

Strategies in Light

Strategies in Light is a business conference and exhibition that focuses on solid-state lighting (SSL), which includes both light-emitting diodes (LEDs) and organic light emitting diode (OLEDs) technologies. It is the longest-running and the largest conference in the HB LED industry, and the premier annual forum for presenting current commercial developments in high-brightness LED applications and providing unparalleled networking opportunities for component and equipment suppliers, manufacturers, and end-users of HB LED devices.

Bradley Benton, our Western Regional Sales Manager, will be on-site to lead discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding. Palomar Technologies will be located at booth number 1332. Contact Palomar Technologies or visit our booth to schedule an on-site meeting at the conference.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download the 3800 Die Bonder Data Sheet:

3800 Die Bonder Data Sheet

 

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Contact

Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

Tags: 3800 die bonder, HB LED, Strategies in Light, LEDs

Palomar Technologies Announces the Latest in Wedge Bonding Technology: The 9000 Wedge Bonder

Posted by Katie Finney on Thu, Jan 08, 2015

Carlsbad, CA – January 7, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the launch of the 9000 Wedge Bonder. The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering control and flexibility. The 9000 features a large 12”x6” work area and the ability to easily change from a 45-60° wire feed range to 90° deep access. The quality control enabled by the 9000 is unparalleled, with real-time bond monitoring and process control software as well as a robust, low maintenance bond head. With the 9000 there is no need for an expensive bond head change, as the wire clamps are easily replaceable and adjustable.

There are seven strategic components to the 9000 Wedge Bonder that help customers achieve modern wedge bond requirements: large work area, inline factory automation, advanced user control, bond data miner, high-speed wire bonding, wire feed clamp versatility, and high-precision. Palomar Technologies pioneered the first automated fine wire wedge bonders in the 1980s and today carries the technological legacy into the industry’s most advanced fine wire wedge bonder on the market.

Operational Features for Control and Precision

The Intelligent Interactive Graphical Interface® (i2Gi®) is an advanced GUI software feature implement9000_Wedge_Bondered on the 9000 Wedge Bonder, and is an exclusive Palomar Technologies technology. i2Gi offers the required management tools for modern wedge bonding, from part design and development, to process validation, and finally to intuitive operations control. i2Gi was designed for 9000 Wedge Bonder operating technicians to work smarter, faster and with more control.

The natural navigation flow and interactive live graphical display of i2Gi lets bonder program developers and operators experience real-time bonding and part quality validation. i2Gi technology supports advanced wedge bond control through command tools which work in concert to provide a dynamic and intuitive user experience. 

Process Advantages

The 9000 Wedge Bonder addresses a wide range of fine wire wedge bond applications including disk drives, large complex hybrids, MCM power connections, ribbon bonding, low profile wire bonds, running stitch interconnects, and fine pitch devices. Some process advantages of the 9000 Wire Bonder include providing various loop form functions, highly regulated constant wire length as well as loop height, individual loop shapes, and a loop length range from 70um to 20mm.

The 9000 Wedge Bonder also incorporates Bond Data MinerTM which is an all-inclusive and centralized data management and analysis system. This is a powerful tool to improve yield and utilization.

Delivering What Programmers Desire

Modern wedge bond requirements demand an automated, large bonding area system with scalability to increase production capacity without limiting performance. In order to achieve best efficiency at lowest cost, programmers and operators need relevant and real-time production feedback from their equipment.

With the 9000 Wedge Bonder, lab managers are able to have peace of mind that their bonder is fully supported by a highly trained team of field service and process development consultants.

Download the 9000 Wedge Bonder Data Sheet:

9000 Wedge Bonder data sheet

 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

###

Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681

Tags: 9000 Wedge Bonder