Carlsbad, CA – November 5, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced live demonstrations of a new wire bonder at productronica 2013: the 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM). The 8000i Wire Bonder with i2Gi will be showcased in Hall B2 Booth 205 at the 20th international trade fair for innovative electronics production, held in Munich on November 12 - 15, 2013.
In an interview with the productronica 2013 team, Josef Schmidl, Palomar Technologies GmbH Managing Director, recognized that, “Palomar Technologies has exhibited at productronica for more than 30 years. It has become one of the most important exhibitions in Europe with regards to Palomar's evolving product portfolio.”
“productronica is the perfect platform for live demonstrations of the latest products and solutions, concentrated to a world-wide audience of hybrid manufacturers. productronica will be a milestone for Palomar Technologies—this is the first opportunity for attendees to see and to test drive new products,” Mr. Schmidl affirmed.
Intelligent Interactive Graphical Interface (i2Gi) on the new 8000i Wire Bonder
i2Gi (cleverly pronounced “iggy”) is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.
i2Gi technology supports advanced wire bond control through three key critical command tools, which work in concert to provide a dynamic and intuitive user experience.
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Part Tree Display defines relationships between part programming objects: parts, wires, pads
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Part Graphical Display provides geometric representation of the overall XY workspace and package elements
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Man-Machine Interface (MMI) + Video Graphical Display enables interaction with live video for teaching and locating parts combined with a graphical overlay representation of the program.
The new 8000i Wire Bonder comes equipped with i2Gi technology. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.
Read More About i2Gi
Integration von i2Gi™ in 8000 Ball Bonder (Integrating i2Gi™ onto an 8000 Wire Bonder)
Watch the i2Gi Video Demo
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
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EMEA Contact
Mr. Josef Schmidl
Managing Director
Palomar Technologies GmbH
jschmidl@palomartechnologies.de | +49 (9131) 48009-30
Corporate Contact
Mrs. Jessica Sylvester
Manager, Marketing Communications
Palomar Technologies, Inc.
jsylvester@bonders.com | +1 760-931-3681