Rich Hueners

Recent Posts

Palomar Technologies to Exhibit at SEMICON Southeast Asia and SMT Nuremberg

Posted by Rich Hueners on Tue, Apr 19, 2016

Carlsbad, CA—April 19, 2016—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be exhibiting at SEMICON Southeast Asia at the SPICE Arena in Penang, Malaysia on April 26-28 in booth #209. They will also be exhibiting at SMT Hybrid Packaging in Nuremberg, Germany on April 26-28 in booth 7A-205.

Palomar made several noteworthy announcements in 2015, including the launch of its new 3880 ultra-flexible die bonder and its acquisition of SST International.

Talk With Palomar About Die and Wedge Bonding
The 3880 Die Bonder is the next-generation die bonder with an improved bond 3880_bondhead.pnghead design, integrated with a Z-Theta leveling mechanism and high speed bi-directional 8-tool turret. Because of the 3880’s inherent highly repeatable planarity feature, wide force range, and fast tool change, customers in the optoelectronic and RF/wireless device packaging markets have seen the greatest increases in performance and throughput. Also new to the Palomar suite of solutions is the 9000 Fine Wire Wedge Bonder. Devised and designed for modern wedge bonding, the 9000 uses a voice coil driven bond head with interchangeable clamps for 45-60° and 90° feed angles. Customers doing ribbon bonding benefit from being able to use the same clamp with ribbon as they do with round wire. Because the bond head itself turns on a single mechanism, there is no twisting of ribbon or wire during the bonding process. The feed path is shorter, the control better, and the precision of wedge bonding greatly improved.    

SST Vacuum Reflow Systems
Exhibiting with Palomar at SEMICON Southeast Asia will be SST Vacuum Reflow Systems. Palomar acquired SST in March of 2015, and have been actively integrating the SST solutions within Palomar’s suite of advanced packaging and SST-graphite_tooling.jpgassembly products. A critical feature of SST’s unique position is its expertise in designing and machining graphite tooling plus process expertise. With refined process expertise, SST provides a void-free eutectic attach, hermetic package sealing, glass to metal sealing, and wafer level bonding.

Palomar Technologies GmbH will also be exhibiting at SMT Hybrid Packaging next week in Nuremberg, Germany. The 9000 Wedge Bonder will be on display, as well as SST's 5100 Vacuum Pressure Furnace. They would love to speak with you at the show about packaging challenges and possible solutions.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About SST International
SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment. For more information, visit www.sstinternational.com.

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APAC Contact
Mr. PH Chan
General Manager, Asia Pacific
Palomar Technologies (S.E. Asia) Pte Ltd | (+65) 6686-3096

EMEA Contact
Mr. Josef Schmidl
Managing Director, Europe
Palomar Technologies GmbH | 49 (9131) 48009-30

Media Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760.931.3680

Tags: Announcements, trade shows, SEMICON Southeast Asia, SMT Nuremberg

New Palomar Asia Facility for Demonstrations, Support & Training

Posted by Rich Hueners on Tue, Aug 06, 2013

Carlsbad, CA – August 6, 2013 –Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the opening of its new demonstration and applications development office, located in Singapore, effective immediately.

Palomar Technologies opening Ribbon Cutting Palomar Technologies Asia Singapore office reveals company logo

Palomar Technologies (SE Asia) Pte Ltd., (“Palomar Asia”) has been headquartered in Singapore since its establishment in August 2000—five years after Palomar Technologies, Inc., evolved as a former subsidiary of the Hughes Aircraft’s Industrial Product Division. Since the initial opening of Palomar Asia, the office has generated substantial business growth year-after-year and quickly became recognized for its superior support of Asia-Pacific customers requiring automated wire bond and die attach equipment.

The new Palomar Asia facility builds upon the established base of customer support, evolving into a “one-stop shop”  to offer full-capacity support. For example, the new facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.

Process Development Services data sheet

 

The automated microelectronics manufacturing requirements for the APAC region spans markets from aerospace/defense, optoelectronic, LED, RF/Wireless and medical for high-accuracy die attach and high-reliability wire bonding. Even amidst recent world-wide economic strain, the APAC region has rapidly grown for Palomar Asia—for both personnel and customer installed base. Palomar Technologies’ most popular large work area die attach platform—the ultra-flexible 3800 Die Bonder— and the “workhorse” Au wire/ball bump, deep access platform—the 8000 Wire Bonder—have continually exceeded customer expectations for quality, accuracy and process expertise support.

At SEMICON West 2013 in San Francisco, CA, Palomar Technologies launched the new 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM). Cleverly pronounced “iggy”, i2Gi is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bondersi2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation. 

Click here to read the launch press release for the 8000i Wire Bonder with i2Gi.

To meet the needs of its expanding installed base, Palomar Asia has tripled its workforce, mostly in the ranks of direct field service engineers. “Having direct field service engineers in every region with Palomar Technologies equipment has been key to our success,” affirms PH Chan, Palomar Asia Managing Director. “By offering expert hardware, process and application support directly to our customers, we are able to quickly resolve the most complex microelectronic assembly challenges at our customer’s sites.”

Since his arrival at Palomar Asia in 2010, Mr. Chan has developed and expanded a local APAC Spare Parts Depot, increased the number of APAC sales representatives and accelerated the regional marketing presence in Asia’s largest industry tradeshows.

August 2013 marks the beginning of a new era for Palomar Asia. The new Palomar Asia facility offers a new clean room and demonstration laboratory, outfitted with wire bonding and die attach capabilities, as well as measurement and test equipment.

The 8000i Wire Bonder was showcased at the Palomar Asia office grand opening event, held on Friday, August 2. The event hosted customers, suppliers and friends of Palomar Asia and included opening ceremonies such as traditional Chinese lion dance and pineapple roll for good luck.

Palomar Technologies Singapore microelectronics manufacturing center new Palomar Technologies Asia Singapore office opens with traditional Chinese prosperity ceremonies

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: http://www.palomartechnologies.com/contact-palomar-technologies-asia

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Palomar Asia Contact
Mr. PH Chan
Managing Director
phchan@bonders.com
(+65) 6686-3096

Palomar Technologies Media Contact
Mrs. Jessica Sylvester
Marketing Communications Manager
jsylvester@bonders.com
+1 (760) 931-3681

Tags: 3800 die bonder, Announcements, assembly and packaging, Palomar Asia, demonstrations, training, Assembly Services, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU)

New Products at SEMICON West 2013 – 8000i Wire Bonder with i2Gi(TM) Technology & VisionPilot(TM) Software For Automated Die Attach

Posted by Rich Hueners on Mon, Jul 08, 2013

Carlsbad, CA – July 8, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the launch of new products at SEMICON West 2013: the 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM) and VisionPilotTM for automated high-precision die attach. The 8000i Wire Bonder, i2Gi and VisionPilot will be showcased through live demonstrations in booth #6251 at SEMICON West 2013, July 9-11, at the Moscone Center in San Francisco, CA.

Intelligent Interactive Graphical Interface (i2Gi) on the new 8000i Wire Bonder
i2Gi (cleverly pronounced “iggy”) is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation. 

i2Gi technology supports advanced wire bond control through three key critical command tools, which work in concert to provide a dynamic and intuitive user experience.

  1. Part Tree Display defines relationships between part programming objects: parts, wires, pads
  2. Part Graphical Display provides geometric representation of the overall XY workspace and package elements
  3. Man-Machine Interface (MMI) + Video Graphical Display enables interaction with live video for teaching and locating parts combined with a graphical overlay representation of the program.

i2Gi 8000i 3components

The new 8000i Wire Bonder comes equipped with i2Gi technology. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

Three Common Configurations of the 8000i Wire Bonder with i2Gi Technology

8000i handlers small
Automated production line with customizable magazine handlers and hotrail conveyors. Ideal for high-mix, complex automated production.

8000i Ergo Technician small
Ergonomic kit that supports both traditional keyboard and track-ball or a large glove- touch compatible touch screen (optional). Ideal for complex programming and intuitive control of part builds.

8000i rightview small
Standard for reduced footprint and automated production scalability. Ideal for complex hybrid device packaging with flexibility to meet changing production needs.

VisionPilot with Radar ReferencingTMGeometric Pattern Matching Vision Software for Automated Die Attach
VisionPilot utilizes advanced geometric pattern matching technology to reliably and accurately locate parts. Even under the most challenging conditions, this exclusive Palomar Technologies software can significantly reduce or eliminate fixturing requirements and cost.

VisionPilot technology combined with Radar Referencing solves the most demanding die finding scenarios. Radar Referencing—built upon Cognex PatMaxTM—uses a set of boundary curves that are not tied to a pixel grid and then looks for similar shapes in the image without relying on specific gray levels. The result is a revolutionary improvement in the ability to accurately find objects despite changes in angle, size, and shading.

VisionPilot PatMax based vision system for die attach

Unlike with traditional auto correlation, which does not utilize image angle, 1-Point Radar Referencing finds image XY location and angle orientation at the same time allowing higher machine throughput by using only one reference to find a die.

VisionPilot is easy to incorporate into new or existing programs. The existing programs can remain the same and an additional Radar Referencing location can be added to an existing type. Programming Radar Referencing is very similar to programming auto correlation. The images are taught the same way as auto correlation with some slight changes in the parameter settings.

Benefits of VisionPilot

  • Finds images at any orientation–complete 360° (+/-180°)–compared to +/-7° for auto correlation
  • Less light sensitive
  • Less sensitive to part variations
  • Minimizing the number of required references may increase throughput

For a more in-depth overview, download the technical resources:

8000i wire bonder, ball bumper, i2Gi

8000i Wire Bonder Data Sheet

VisionPilot Data Sheet

VisionPilot Data Sheet

i2Gi, intelligent interactive graphical interface, modern wire bond control software

i2Gi Data Sheet

i2Gi, modern wire bond control software, intelligent interactive graphical interface

i2Gi eBook

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: Announcements, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU), VisionPilot, Cognex, SEMICON West 2013

Palomar Technologies Selected as 2012 Exporter of the Year at San Diego North Economic Development Council Annual Business Luncheon

Posted by Rich Hueners on Tue, Dec 11, 2012

Carlsbad, CA – December 11, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, was selected as the winner of the 2012 Exporter of the Year award, presented at the San Diego North Economic Development Council (SDNEDC) Annual Business Luncheon.

Palomar Technologies was nominated for the 2012 Exporter of the Year by the WORLD TRADE CENTER San Diego (WTCSD) executive vice president, Mr. Hugh Constant. “There is a concentration of small and medium-sized enterprises in Oceanside, Carlsbad, Vista, San Marcos, Escondido, Poway and Rancho Bernardo, with more than 350 companies actively trading internationally” noted Constant, who also presented the award. “Palomar Technologies stood out in this crowded field because of its exceptional success in developing export markets for its products in more than 30 countries over the past five years.”

SDNEC Awards Luncheon ExporteroftheYear2012

Originally founded in the 1970s as a division of Hughes Aircraft in San Diego County, Palomar Technologies is one of the few remaining US-based manufacturers of high-precision, automated microelectronics packaging equipment. Headquartered in Carlsbad, CA, Palomar Technologies supports needs of thousands of organizations around the world for micro-/optoelectronics process development and production requirements in the telecommunications, medical, defense, aerospace and commercial high-technology industries.

Palomar Technologies’ value is providing a complete product and service solution coupled with knowledge of microelectronics material and assembly processes. The company competes on the global stage, with more than 70% of final product exported. A worldwide team of Field Services engineering experts supports the large installed base of customers, providing decades of process expertise and a deep understanding of production needs through one-on-one support.

With a balanced focus between both “on-shore” manufacturing and exporting, involvement with the SDNEDC and the WTCSD is a natural decision to further the company’s growing international business efforts. Palomar Technologies has been an active participant in WTCSD events and programs since 2004, supporting several events each year.

SDNEC holds the annual luncheon to recognize San Diego North’s business, elected, public sector and media leaders for their contributions to the region. According to SDNEC, “each December, nearly 500 SDNEDC members and guests are invited to enjoy a seasonal lunch, a keynote address by a distinguished community member and a prestigious award presentation to celebrate the accomplishments of businesses and individuals in San Diego’s North County.”

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About WORLD TRADE CENTER San Diego
WORLD TRADE CENTER San Diego (WTCSD) is a non-profit trade association that provides comprehensive international trade services and key global contacts to facilitate and expand trade for regional worldwide clients. Leveraging its global network of World Trade Centers and affiliate partners, WTCSD is the proven forum for international information, communications and connections. WTCSD is licensed by the World Trade Centers Association (WTCA) in New York City and is affiliated with an international network of over 1 million international members and patrons. For more information, please visit us at www.wtcsd.org.

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Tags: Announcements, automated component placement systems, automated packaging systems, Assembly Services, Awards, Exporting, World Trade Center San Diego

High-Accuracy Processes for RF, Optoelectronics & Automotive Microelectronics Assembly

Posted by Rich Hueners on Thu, Sep 06, 2012

Carlsbad, CA – September 6, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that lead engineers will be presenting three highly technical talks at the IMAPS 2012 conference, held September 11-13 at the San Diego Town & Country Convention Center. Palomar Technologies will exhibit in booth #322.

1. High-Reliability Component Attachment Process for <5μm Placement Accuracy
Speaker: Donald J. Beck

2. Mixed Attachment Technology Studies in RF & Optoelectronic Packages Requiring High-Accuracy Placement

Speaker: Daniel D. Evans, Jr.

3. Gold Ball Wire Bonding with Heated Tool for Automotive Microelectronics
Speaker: David J Rasmussen

The complete IMAPS session agenda is available online at http://www.imaps.org/programs/IMAPS2012.pdf.

Palomar Technologies has also collaborated with IMAPS to host an on-demand webcast on "High-Reliability Component Attachment Process for <5um Placement Accuracy". Palomar Technologies Assembly Services general manager originally presented the webcast live in mid-June. The complimentary webcast recording is available at http://www.imaps.org/webcasts/2012may_palomar.htm

Palomar Technologies is accepting meeting requests throughout the duration of IMAPS 2012. Requests may be submitted online at http://www.palomartechnologies.com/contact-us.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: RF Packaging, gold ball bumping, optoelectronic packaging, gold ball bonder, eutectic soldering process, automated component placement systems, automated packaging systems, assembly and packaging, IMAPS, eutectic diagrams, eutectic tutorial, optoelectronic, RF devices

Live Wire Bonding & Die Attach Demonstrations in Booth #6157 at SEMICON West 2012

Posted by Rich Hueners on Tue, Jul 03, 2012

Carlsbad, CA – July 3, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the company will be exhibiting live demonstrations on the 3800 Die Bonder and 8000 Wire Bonder at SEMICON West 2012, July 10-12 in San Francisco, CA, in booth #6157.

die attach demonstrationThe 3800 Die Bonder demonstration will reveal a fully automated component attach program highlighting the flexibility and high precision of the sub-5μm placement accuracy (application dependent) die attach system. The 3800 Die Bonder has a large 35.5" x 20" large work area to accommodate various presentation tools, a steady state and a pulsed heat system for eutectic bonding, multiple dispense technologies, die ejectors and Cognex Vision System on a single platform. The sturdy mechanical structure, process camera, quiet linear motors, 0.1μm linear XY encoders and direct measure 0.00023 degree rotary encoder are some of the sophisticated features available on this ultra-flexible die attach system.

8000 wire bonder head tool turretThe 8000 Wire Bonder will feature a fully automated wire bond, stitch-bond, chain bond and ball bump demonstration program, showcasing the bonder’s diverse application packaging capabilities. A ball bumper and stud bumper configuration of the 8000 Wire Bonder is a unique feature of this system—the wire bonder is the only available system that can produce co-planarized gold bumps in one step. The 8000 Wire Bonder is capable of deep access wire bonding up to 13.5mm. This fully automatic, thermosonic, high-speed ball-and-stitch gold bumper improves production yields and eliminates sources of variation in microelectronics packaging processes.

Palomar Technologies Assembly ServicesTM ("Assembly Services") is the contract assembly, process development, test and prototyping division of Palomar Technologies, ensuring strict IP protection, in-house highly skilled engineering staff and technicians, and a product suite of high-reliability, ultra high-accuracy advanced packaging systems. Assembly Services’ example capabilities—including flip chip, wafer level packaging, pick-and-place, deep access wire bonding and complex packaging processes—will be headlined throughout the Palomar Technologies exhibit space.

Palomar Technologies is accepting meeting requests throughout the duration of SEMICON West 2012. Requests may be submitted online at www.palomartechnologies.com/contact-us.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, Announcements, wire bonders, how to buy a bonder, Automation, ball bumping, automated component placement systems, automated packaging systems, assembly and packaging, demonstrations, 8000 wire bonder, automation vs. manual, wire bond demo, SEMICON West 2012, micron level placement, high precision die attach

Palomar Technologies President and CEO, Bruce Hueners, Named Finalist in Ernst & Young Entrepreneur Of The Year® 2012 Award for San Diego

Posted by Rich Hueners on Tue, Jun 19, 2012

Carlsbad, CA – June 19, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that Bruce Hueners, president and CEO, is a finalist for the Ernst & Young Entrepreneur Of The Year® 2012 Award in San Diego.

According to Ernst & Young LLP, the awards program recognizes entrepreneurs who demonstrate excellence and extraordinary success in such areas as innovation, financial performance and personal commitment to their businesses and communities. Mr. Hueners was selected as a finalist by a panel of independent judges in the “Technology and Software” category. From the original 85 semi-finalists, Mr. Hueners was one of 20 finalists recognized at the June 13, 2012, awards ceremony held at the Hyatt Regency in La Jolla, CA.

“It is an honor to have been selected as a finalist for the 2012 San Diego Ernst & Young Entrepreneur Of The Year® award. However, this recognition is truly a reflection of the ingenuity, innovation and achievements of the entire team at Palomar Technologies,” stated Mr. Hueners. “My fellow finalists are a remarkable group of San Diego’s top entrepreneurs, and I am proud to be included among them.”

The Ernst & Young Entrepreneur Of The Year® awards program celebrates its 26th anniversary this year. The program has expanded to recognize business leaders in over 140 cities and over 50 countries throughout the world. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About Ernst & Young’s Entrepreneur Of The Year® Awards Program
Ernst & Young’s Entrepreneur Of The Year® is the world’s most prestigious business award for entrepreneurs. The award makes a difference through the unique way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Ernst & Young Entrepreneur Of The Year® celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 135 cities in 50 countries.

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Tags: Announcements, capturing more value, capital equipment, Awards

Palomar Technologies Presents Sub-5um Die Attach Placement Accuracy Webcast

Posted by Rich Hueners on Tue, Jun 12, 2012

Carlsbad, CA – June 12, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that the company can support high-precision die attach to less than 5µm placement accuracies.

“As the trend to build smaller electronics pushes the limits of semiconductor packaging abilities, the need for high-accuracy and high-precision component placement often presents a challenge in itself,” stated Donald Beck, Palomar Technologies Assembly ServicesTM General Manager. “We are able to support [application dependent] requirements for ultra-high placement accuracies on our eutectic/epoxy 3800 Die Bonder and 6500 Die Bonder systems.”

The ultra flexible 3800 Die Bonder is designed for fully automatic, precision microelectronics assembly. The tightly regulated,computer-controlled work cell can perform up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. The 3800 Die Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions.

The 6500 Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless and medical applications. This eutectic die bonder is designed for fully automatic precision component assembly—even up to 1.5µm placement accuracy (application dependent)—making component assembly practical and cost effective. Wafer Scale Packaging (WSP) eutectic die attach on the 6500 Die Bonder provides customers with a complete microelectronic solution for P-side down laser diode attachment (die-to-wafer), a pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, a wafer stage with steady state heating, and waffle or gel pack presentation of laser diode applications.

Mr. Beck is presenting a 30-minute live webcast on June 13 at 12:00pm Eastern Time, discussing new developments for ultra high-precision component packaging: “<5micron Placement Accuracy" target="_self">High-Reliability Component Attachment Process for <5micron Placement Accuracy ".

The webcast will cover a process solution for <5µm component attach" target="_self">automating <5µm component attach specific to organizations requiring high-reliability device packaging. In this webinar, Mr. Beck will cover methods that have been proven through real-world experiences related to the high-reliability microelectronics industry. Joining Mr. Beck will be Mr. Zeger Bok (Sr. Application Engineer) and Mr. Daniel Martinez (Assembly Services Lab Manager & Manufacturing Engineer) for live Q&A after the formal presentation.

Register now for the live webcast, presented on June 13 at Noon Eastern Time. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, Announcements, device design, die bonders, eutectic die attach, eutectic soldering process, die bonding, gold tin eutectic die attach, 6500 die bonder, eutectic process, die bonder, IMAPS, eutectic, eutectic tutorial, gold tin die attach, placement accuracy of microelectronic components

New Demonstration Center & Expanded Spare Parts Depot to Further Support Palomar Technologies Die Bonder & Wire Bonder Customers in Asia-Pacific Region

Posted by Rich Hueners on Tue, May 29, 2012

Carlsbad, CA – May 29, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the successful expansion of the company’s Singapore-based demonstration center and spare parts depot to better support its growing Asia-Pacific customer base.

With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, Palomar Technologies has successfully expanded the Palomar Asia Spare Parts Depot and regional customer services infrastructure. Mr. PH Chan, director of Palomar Technologies Asia, recently confirmed the Palomar Asia Spare Parts Depot will be able to meet requests for overnight spare parts delivery to regional APAC customers.

In addition to the expanded Palomar Asia Spare Parts Depot, Chan has also led the development of a Singapore-based demonstration laboratory in order to support increasing demand for in-person 8000 Wire Bonder and 3800 Die Bonder demonstrations with APAC customers. Providing customer-focused private bonder demonstrations has always been part of Palomar Technologies’ niche identity. This unique one-on-one service is now available regionally to APAC companies.

UltraCleanTechnology Singapore WireBonderDieBonderDemonstrations

“In 2010, Palomar Technologies launched the 3800 Die Bonder, designed for fully automatic, precision microelectronics assembly and die attach processes,” states Chan. “The 3800 continues to be a success with our customers worldwide; however, the greatest need for the 3800 Die Bonder has proven to be within the emerging markets in Asia. The 3800 Die Bonder utilizes a large work area and various presentation tools for epoxy dispense and steady state and pulsed heat eutectic die attach—proving to be the most versatile, high-accuracy die bonder in the market for advanced microelectronics assemblies and complex hybrids.”

The new Palomar Asia demonstration laboratory is outfitted with applications and process development capabilities for both wire bond and die attach. Expert Palomar Technologies Field Service Engineers and Technical Liaisons will continue to lead demonstrations.

Palomar Technologies Asia is accepting appointments for on-site wire bonder or die attach demonstrations. Schedule a demonstration appointment by contacting Palomar Technologies Asia at (+65) 6779-2766 or online at http://www.palomartechnologies.com/contact-palomar-technologies-asia.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, capturing more value, capital equipment, Palomar Asia, demonstrations, training, 8000 wire bonder, Bonder Boot Camp

Hi-Rel Wire Bonder & Universal Bond Tester Demonstrations at SMT Nuremberg 2012

Posted by Rich Hueners on Tue, May 01, 2012

Carlsbad, CA – May 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at SMT Nuremberg 2012, May 8-10, with live wire bonder demonstrations.

Palomar Technologies will exhibit in Hall 6 Booth #433 and will showcase an 8000 Wire Bonder and a Royce 650 Universal Bond Tester.

The 8000 Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

Palomar Technologies offers several complementing die bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the ultra flexible 3800 Die Bonder, which supports up to three channels of adhesive dispense, component placement, epoxy and eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

Mr. Josef Schmidl, director of Palomar Technologies Europe located in Erlangen, Germany, will be attending SMT Nuremberg and is available during the conference for any on-site meetings.

Mr. Dale Perry, Regional Manager of the Eastern North/South Americas, will also attend SMT Nuremberg. Mr. Perry is available during the duration of the conference to discuss Palomar Technologies Assembly ServicesTM capabilities and solutions.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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