Katie Finney

Recent Posts

Palomar Technologies to Present and Exhibit at IMAPS 2016

Posted by Katie Finney on Tue, Oct 04, 2016

Carlsbad, CA – October 4, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be presenting a technical paper and exhibiting at the IMAPS 49th International Symposium on Microelectronics in Pasadena, CA being held on October 10-13, 2016 in booth #702.

Palomar Technologies’ Chief Technical Officer, Dan Evans, will present the paper “Wedge Bonding Wire and Ribbon to Support RF and Optoelectronic Packaging” on Thursday, October 13th at 10:30am. This paper will provide a survey of RF and optoelectronic packages, and the common wire and ribbon bond requirements. It will also survey the packaging challenges and solutions available to process engineers. Collaborations between manufacturer and equipment supplier with helpful tips leveraging each other’s strengths to transition from concept to production will also be discussed.

In addition, SST Vacuum Reflow Systems, as part of Palomar Technologies total solutions for eutectic die bonding and advanced packaging systems, will present their technical paper “Achieving Low Voiding with Lead Free Solder Paste for Power Devices”, and will be performing live demos of their 5100 Vacuum Pressure Furnace. SST’s Process Development Engineer, Pierino Zappella, will present this paper on Thursday, October 13th at 1:00pm. The processes discussed in this session will show how low void levels can be achieved while using solder paste on different materials in a vacuum reflow oven.

Don’t forget to also stop by booth 702 during the Palomar Technologies sponsored Dessert Happy Hour and during the exhibition to learn more about Palomar Technologies and SST Vacuum Reflow Systems.

IMAPS_Pasadena_2016.jpg

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

Tags: Announcements, trade shows, IMAPS, IMAPS 2016

Palomar Technologies' 3880 Die Bonder Wins the NPI Award for Bonders

Posted by Katie Finney on Tue, Mar 29, 2016

Circuit Assembly announced on March 15, 2016 that Palomar Technologies’ 3880 Die Bonder won the New Product Introduction (NPI) Award for Bonders. Circuit Assembly’s NPI Awards recognize the leading new products for electronics assembly during the past 12 months.  An independent panel of practicing industry engineers selected the recipients and then presented the awards during a ceremony at the IPC Apex Expo in Las Vegas.

The judges evaluated the submitted entries based on the following criteria:3880.jpg

  • Creativity and innovation
  • Compatibility with existing technology
  • Cost-effectiveness
  • Design
  • Expected reliability
  • Flexibility
  • Expected maintainability/ease of repair
  • Performance
  • User-friendliness
  • Speed/throughput

The new 3880 Die Bonder, the latest addition to the Palomar Technologies suite of die attach solutions, combines fine placement accuracy, fast tool indexing time, excellent tool planarity, and position precision making it the most advanced die bonder platform available today. It features a new fully integrated Z-Theta bidirectional bond head enabling improved reliability and uniformity across a wide range of applications. 

The new high precision bidirectional turret wheel ensures planarity of all pick tools without the need for individual leveling. This allows rapid tool changes without impacting process set up. Its large work envelope is ideal for a versatile automated die bonder capable of handling many different part types, presentation options, and application processes.3880_Bond_Head.pngAmong the innovations on this cutting-edge machine is the ability to hit Palomar's best accuracy and repeatability specs over a wider range of applications and conditions. This bonder is built upon a rich set of pick and place features, options, and capabilities. A complete redesign of the bond head incorporates a voice coil actuator, allowing for improved gram bond forces, improved linearity, and the bidirectional tool indexing which comes standard.

In addition, the 3880 Die Bonder is already compatible with Palomar’s VisionPilot® vision system. It utilizes advanced geometric pattern matching technology to reliably and accurately locate parts. Even under the most challenging conditions, this exclusive Palomar Technologies software can significantly reduce or eliminate fixturing requirements and costs. For locating parts or features, VisionPilot provides the maximum inspection yield and reliability available in a vision system.

Download the following resources for more information:

3880 Data Sheet Buyer's Guide eBook VisionPilot Data Sheet
3880 die bonder Top Considerations When Purchasing A Bonder VisionPilot Data Sheet

 

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Media Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760.931.3680

Tags: Awards, NPI Awards, VisionPilot, 3880

Visit Palomar Technologies at OFC 2016

Posted by Katie Finney on Tue, Mar 22, 2016

Carlsbad, CA – March 22, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced they are exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) at booth #1814 on March 22-24 in Anaheim, CA. Stop by their booth to learn more about solutions from Palomar Technologies and SST International.

With over 13,000 attendees and over 65 countries represented, OFC is the largest global conference and exposition for optical communications and networking professionals. According to OFC, some of the exhibition’s features this year are:

  • Exhibits from major international companies. Exhibitors include network and test equipment vendors, systems and component manufacturers, fiber cable and specialty fiber manufacturers.
  • Two Exhibit Hall theaters of business programming, featuring presentations by experts from major global brands and key industry organizations.
  • Local Representation from more than 100 California-based companies on the exhibit floor.

Palomar Technologies Solutions
Palomar Technologies’ Assembly Services is a perfect-fit solution for optoelectronic packaging without investing in capital equipment. This minimizes the customer’s project risk and accelerates time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring a sustainable competitive advantage.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

 

Tags: Announcements, Assembly Services, OFC

Palomar Technologies Performs Live Demonstrations at SEMICON China 2016

Posted by Katie Finney on Tue, Mar 08, 2016

Carlsbad, CA—March 8, 2015—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced they will be present at SEMICON China March 15-17, 2016 at the Shanghai New International Exhibition Center. SEMICON China “connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China”.

Palomar Technologies is looking forward to showcasing and providing live demonstrations of their 9000 Wedge Bonder and their new 3880 Die Bonder. To view the live demonstrations and learn more about Palomar, stop by the Be First Technology Co., Ltd. booth located at booth #4667. You can also learn more about Palomar Technologies by stopping by the Beijing Asia Science & Technology Co., Ltd booth located at booth #2443.

Palomar Technologies' new 3880 Die Bonder features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boat, and carriers. Custom stages are also available.3880_Bond_Head.png

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. The 9000 Wedge Bonder offers ultimate control and flexibility to change from a 45-60° wire feed range to 90° deep access with only a clamp change on the robust, theta-rotation bond head. No need for multiple expensive bond heads!Modern Wedge Bonding eBook

 The Palomar Asia office may be contacted online: www.palomartechnologies.com/contact-palomar-technologies-asia/

Download these resouces for more information:

3880 Data Sheet Epoxy Die Attach eBook 9000 Data Sheet
3880 die bonder epoxy die attach,daubing, epoxy dispensing, high-precision component attach 9000 Wedge Bonder data sheet

 

Tags: SEMICON China, 9000 Wedge Bonder, 3880 Die Bonder

Palomar Technologies Performs Live Demonstrations at Productronica 2015

Posted by Katie Finney on Tue, Nov 10, 2015

Carlsbad, CA—November 10, 2015—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be performing live demonstrations of the 8000i Wire Bonder, 9000 Wedge Bonder, and SST International’s Model 5100 Vacuum Pressure Furnace at productronica, held in Munich on November 10-13, 2015. The demonstrations will be taking place at their booth located in Hall B3, Booth 302 at this year’s international trade fair for innovative electronics development and production.

8000i Wire Bonder 9000 Wedge Bonder


Productronica is the perfect platform for live demonstrations of the latest products and solutions, concentrated to a world-wide audience of hybrid manufacturers. It is not only the perfect opportunity for attendees to learn more about and see Palomar Technologies’ products in action, but it is also a perfect opportunity for attendees to learn more about SST International’s products including their Model 5100. Recently, Palomar Technologies acquired SST International as a partner in providing customers with total solutions. We look forward to sharing with attendees how our systems complement one another, as well as demonstrating our existing products live.

About SST International
SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment. For more information, visit www.sstinternational.com.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information:

8000i Data Sheet 9000 Wedge Bonder SST Model 5100
 8000i wire bonder, ball bumper, i2Gi  9000 Wedge Bonder data sheet  Model 5100 acuum pressure furnace, SST Microelectronics

 

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EMEA Contact
Mr. Josef Schmidl
Managing Director
Palomar Technologies GmbH
jschmidl@palomartechnologies.de | +49 (9131) 48009-30

Media Contact
Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760.931.3680

Tags: Announcements, productronica

Palomar Technologies Exhibits at the IMAPS 48th Annual Symposium on Microelectronics

Posted by Katie Finney on Tue, Oct 27, 2015

Carlsbad, CA – October 27, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will be exhibiting at the IMAPS 48th International Symposium on Microelectronics. Visit us at booth #511 on October 27-29 at the Rosen Center Hotel in Orlando, Florida to learn more about our products, including the NEW 3880 Die Bonder.

The 3880 Die Bonder is an ultra-versatile, ultra-flexible die bonder with an all new Z-theta bidirectional bond head with voice coil technology. The 3880 can solve various applications challenges: MEMS, HB/HP LED assembly, RF power amplifiers, and microwave modules. Read more about the 3880 and view more applications examples here.

3880 Die Bonder

Technical Programs
In addition to the exhibits, the symposium will feature exciting keynotes, industry panels, and technical speakers on “The Future of Packaging”. This forum is the largest exchange of technical information and industry leaders, encompassing 3 days, 30 sessions, 5 keynote speakers and 160+ speakers on microelectronics, assembly, interconnect, and packaging. Our own Chief Technical Officer, Dan Evanswill be presenting on copper wire refinements and alternatives at a technical session on Wednesday. For more information on the conference and the other technical sessions being offered, go to www.imaps2015.org

Also, don’t forget to grab a delicious treat during the Dessert “Happy Hour”, sponsored by Palomar Technologies, Tuesday from 3:15-4:15pm. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: Announcements, IMAPS, microelectronics

Palomar Technologies Introduces the Latest in Die Bonding Technology: The 3880 Die Bonder

Posted by Katie Finney on Tue, Sep 22, 2015

Carlsbad, CA – September 22, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the launch of its latest product: the 3880 Die Bonder. The 3880 Die Bonder features a new fully integrated Z-Theta bidirectional bond head enabling improved reliability and uniformity across a wide range of applications.  The new machine’s combined fine placement accuracy, fast tool indexing time, excellent tool planarity and position precision make it the most advanced die bonder platform available today.

3880_bondhead_8.19.15

The new high precision bidirectional turret wheel ensures planarity of all pick tools without the need for individual leveling. This allows rapid tool changes without impacting process set up.                                                                  New Z-Theta Bidirectional Bond Head

Its large 36 x 20 inch work envelope is ideal for a versatile automated die bonder capable of handling many different part types, presentation options, and application processes.     

Among the innovations on this cutting-edge machine is the ability to hit Palomar's best accuracy and repeatability specs over a wider range of applications and conditions. The 3880 Die Bonder is built upon a rich set of Palomar’s pick and place features, options, and capabilities. Plus, a complete redesign of the bond head incorporates a voice coil actuator; allowing for 5-1000 gram bond forces, improved linearity, and the bidirectional tool indexing comes standard.

3880_photo_9.16.15In addition, the 3880 Die Bonder is already compatible with Palomar Technologies’ VisionPilot®. It utilizes advanced geometric pattern matching technology to reliably and accurately locate parts and is built upon Cognex® vision technology. Even under the most challenging conditions, this exclusive Palomar Technologies software can significantly reduce or eliminate fixturing requirements and costs. For locating parts or features, VisionPilot® provides the maximum inspection yield and reliability available in a vision system. 

                                    Download 3880 Data Sheet:

3880 die bonder

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.  

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Media Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760.931.3680

Tags: die bonder, 3880, bidirectional bond head, z-theta, best accuracy

Palomar Technologies Inc. Files Patent Infringement Lawsuit Against MRSI to Protect Ultra-High Accuracy Placement and Die Attach Capability

Posted by Katie Finney on Tue, Jul 14, 2015

Carlsbad, CA – July 14th 2015 – Palomar Technologies, Inc. filed a patent infringement lawsuit on July 6th, 2015 against MRSI Systems LLC in the United States District Court for the Southern District of California.

The suit alleges that certain MRSI products infringe on Palomar’s United States Patent No. 6,776,327, entitled “High-Accuracy Placement Method Utilizing Double Pick and Place." This process enables highly accurate placement of microelectronic components.

Palomar’s high precision die attach systems are designed for fully automatic, precision microelectronics assembly.  Applications and processes range from optoelectronic devices, RF modules, HB/HP LED, automotive sensors, and Microphotonics. “With die and package geometries getting ever smaller, precision placement is becoming an increasingly important factor in more applications than ever before” said Daniel Evans, Palomar’s Chief Technology Officer.

"Palomar will vigorously enforce its patent rights to protect our substantial investment in innovative, high accuracy placement technology and capabilities” said Bruce Hueners, Palomar’s President and Chief Executive Officer.

About Palomar Technologies

Palomar Technologies, Inc., a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire and wedge bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment.  For more information, visit www.palomartechnologies.com.

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | (760) 931-3680 

Tags: patent infringement, lawsuit

Palomar Technologies Exhibits at SEMICON West 2015 Showcasing Bonder Demos

Posted by Katie Finney on Tue, Jul 07, 2015

Carlsbad, CA – July 7, 2015Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that they will perform product demos at booth #5968 at SEMICON West 2015 on July 14-16 at the Moscone Center in San Francisco. The 3800 Die Bonder, 9000 Wedge Bonder, and SCI Plasma Cleaner will be showcased through live demonstrations, as well as other leading edge packaging solutions.  

3800_hi_res-1

The 3800 Die Bonder utilizes a large work area, various presentation tools, steady state and pulsed heat system for eutectic bonding, high-accuracy motion system, multiple dispense technologies, die ejectors and Cognex® Vision System. This bonder comes with a process camera for live viewing of pick-and-place processes. The sophisticated 8-position tool turret enables rapid tool changes on the fly. Also, it has a 35.5" x 20" work area with linear motors, pulse heat and steady state stages for eutectic die attach and 2 and 3 channels of adhesive dispensing.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering control and flexibility. The 9000 features a large 190002”x6” work area and the ability to easily change from a 45-60° wire feed range to 90° deep access. The quality control enabled by the 9000 is unparalleled, with real-time bond monitoring and process control software as well as a robust, low maintenance bond head. With the 9000 there is no need for an expensive bond head change, as the wire clamps are easily replaceable and adjustable.

SEMICON West  

Attracting over 650 international exhibitors, SEMICON West connects you to innovation, opportunity, technology, and information. This year’s SEMICON West highlights consist of distinguished keynote speakers, a variety of different programs, and energetic show floor events such as special displays and the Innovation Village. SEMICON West is the place to converge with industry leaders, explore strategic issues, discover new technologies, discuss new solutions, and connect with customers and suppliers.

 About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, wire and wedge bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information: 

9000 Wedge Bonder
3800 Die Bonder Data Sheet

9000 Wedge Bonder data sheet

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Contact
Claudia Salerno
Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | 760.931.3681

Tags: SEMICON West 2015

Palomar Technologies’ President and CEO, Bruce Hueners, is an EY Entrepreneur of The Year® 2015 Award Finalist

Posted by Katie Finney on Tue, May 26, 2015

Carlsbad, May 26, 2015 – EY today announced that President and Chief Executive Officer, Bruce Hueners of Palomar Technologies is a finalist for the EY Entrepreneur Of The Year 2015 Award in San Diego. The awards program recognizes entrepreneurs who demonstrate excellence and extraordinary success in such areas as innovation, financial performance and personal commitment to their businesses and communities.  Bruce Hueners was selected as a finalist by a panel of independent judges.  Award winners will be announced at a special gala event on June 18, 2015 at The Fairmont Grand Del Mar. 

"I am truly honored by this recognition and want to particularly express gratitude to my fellow employees at Palomar for their diligence, perseverence and teamwork, which made this all possible," says Bruce Hueners.

Now in its 29th year, the program has expanded to recognize business leaders in more than 145 cities in more than 60 countries throughout the world. 

Regional award winners move forward to compete for the EY Entrepreneur Of The Year National program.  Award winners in several national categories, as well as the EY Entrepreneur Of The Year National Overall Award winner, will be announced at the annual awards gala in Palm Springs, California, on November 14, 2015. The awards are the culminating event of the EY Strategic Growth Forum®, the nation’s most prestigious gathering of high-growth, market-leading companies.

Sponsors
Founded and produced by Ernst & Young LLP, the EY Entrepreneur Of The Year Awards are sponsored nationally by the Ewing Marion Kauffman Foundation and SAP America.

In San Diego, sponsors include: Barney & Barney (a Marsh & McLennan Agency LLC Co.), Union Bank, The Daily Transcript, Merrill Datasite, Scherzer International, Cresa, Chase Bank, and Allison+Partners.

Contact information
To receive more information, contact: Kathy Beckman at (949) 437-0236 or kathy.beckman@ey.com.


About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, wire and wedge bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About EY Entrepreneur Of The Year®
EY Entrepreneur Of The Year is the world’s most prestigious business award for entrepreneurs. The unique award makes a difference through the way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Entrepreneur Of The Year celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 145 cities in more than 60 countries. Follow news on Twitter @EY_EOY #EOYSD.

About EY
EY is a global leader in assurance, tax, transaction and advisory services. The insights and quality services we deliver help build trust and confidence in the capital markets and in economies the world over. We develop outstanding leaders who team to deliver on our promises to all of our stakeholders. In so doing, we play a critical role in building a better working world for our people, for our clients and for our communities.

EY refers to the global organization, and may refer to one or more, of the member firms of Ernst & Young Global Limited, each of which is a separate legal entity. Ernst & Young Global Limited, a UK company limited by guarantee, does not provide services to clients. For more information about our organization, please visit ey.com.

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Media Contact
Claudia Salerno

Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681