Palomar Technologies Inc. Files Patent Infringement Lawsuit Against MRSI to Protect Ultra-High Accuracy Placement and Die Attach Capability

Posted by Katie Finney on Tue, Jul 14, 2015

Carlsbad, CA – July 14th 2015 – Palomar Technologies, Inc. filed a patent infringement lawsuit on July 6th, 2015 against MRSI Systems LLC in the United States District Court for the Southern District of California.

The suit alleges that certain MRSI products infringe on Palomar’s United States Patent No. 6,776,327, entitled “High-Accuracy Placement Method Utilizing Double Pick and Place." This process enables highly accurate placement of microelectronic components.

Palomar’s high precision die attach systems are designed for fully automatic, precision microelectronics assembly.  Applications and processes range from optoelectronic devices, RF modules, HB/HP LED, automotive sensors, and Microphotonics. “With die and package geometries getting ever smaller, precision placement is becoming an increasingly important factor in more applications than ever before” said Daniel Evans, Palomar’s Chief Technology Officer.

"Palomar will vigorously enforce its patent rights to protect our substantial investment in innovative, high accuracy placement technology and capabilities” said Bruce Hueners, Palomar’s President and Chief Executive Officer.

About Palomar Technologies

Palomar Technologies, Inc., a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire and wedge bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment.  For more information, visit www.palomartechnologies.com.

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | (760) 931-3680 

Tags: patent infringement, lawsuit

Palomar Technologies Exhibits at SEMICON West 2015 Showcasing Bonder Demos

Posted by Katie Finney on Tue, Jul 07, 2015

Carlsbad, CA – July 7, 2015Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that they will perform product demos at booth #5968 at SEMICON West 2015 on July 14-16 at the Moscone Center in San Francisco. The 3800 Die Bonder, 9000 Wedge Bonder, and SCI Plasma Cleaner will be showcased through live demonstrations, as well as other leading edge packaging solutions.  

3800_hi_res-1

The 3800 Die Bonder utilizes a large work area, various presentation tools, steady state and pulsed heat system for eutectic bonding, high-accuracy motion system, multiple dispense technologies, die ejectors and Cognex® Vision System. This bonder comes with a process camera for live viewing of pick-and-place processes. The sophisticated 8-position tool turret enables rapid tool changes on the fly. Also, it has a 35.5" x 20" work area with linear motors, pulse heat and steady state stages for eutectic die attach and 2 and 3 channels of adhesive dispensing.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering control and flexibility. The 9000 features a large 190002”x6” work area and the ability to easily change from a 45-60° wire feed range to 90° deep access. The quality control enabled by the 9000 is unparalleled, with real-time bond monitoring and process control software as well as a robust, low maintenance bond head. With the 9000 there is no need for an expensive bond head change, as the wire clamps are easily replaceable and adjustable.

SEMICON West  

Attracting over 650 international exhibitors, SEMICON West connects you to innovation, opportunity, technology, and information. This year’s SEMICON West highlights consist of distinguished keynote speakers, a variety of different programs, and energetic show floor events such as special displays and the Innovation Village. SEMICON West is the place to converge with industry leaders, explore strategic issues, discover new technologies, discuss new solutions, and connect with customers and suppliers.

 About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, wire and wedge bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information: 

9000 Wedge Bonder
3800 Die Bonder Data Sheet

9000 Wedge Bonder data sheet

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Contact
Claudia Salerno
Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | 760.931.3681

Tags: SEMICON West 2015