Palomar Technologies Achieves Fifth Consecutive Year-Over-Year Revenue Growth and Profitability

Posted by Palomar Technologies MarCom Team on Wed, Jan 04, 2012

Carlsbad, CA – January 4, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it has sustained revenue growth and profitability for a fifth consecutive year.

“The hard work and dedication of Palomar’s worldwide team and the loyal support of our customers has resulted in our fifth consecutive year of positive growth in revenue and profitability,” stated Bruce W. Hueners, president and CEO of Palomar Technologies. “We have continued to meet our customers’ complex packaging needs by providing high-precision wire bonding and die attach solutions and significantly increasing our bandwidth to address new opportunities. Our performance in 2011 has provided a solid foundation for continued expansion of the company to better serve our customers.”

In addition to fully automated wire bonders and die attach systems, Palomar Technologies offers prototyping, test and contract assembly packaging solutions through Palomar Technologies Assembly ServicesTM. Palomar Technologies Customer Services provides services such as bonder training and on-site support from Field Service Engineers and Process Development Consultants to ensure customers are achieving maximum performance on their systems.

Palomar Technologies was recognized for seven awards in 2011, including the New Product Introduction Award for the 3800 Die Bonder—the ultra flexible, high accuracy die attach machine launched in 2010—and the 2011 IMAPS Corporate Recognition Award.

Palomar Technologies continues its strong alliance channels with Hybond (manual bonder systems), GPD Global (precision fluid dispensing systems) and Royce Instruments (pull/shear testing equipment) to further support the complex microelectronic packaging needs among its large worldwide installed base.

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore, employing a highly specialized staff of service technicians located around the world. For more information on current open positions, please email resumes@bonders.com.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, capital equipment, contract assembly in microelectronics, Awards, Hybond, Royce Instruments, GPD Global