Latest news in micoelectronics, optoelectronics, LED assembly and complex hybrid packaging from Palomar Technologies.

PTI Press Releases

Palomar Technologies Named TechAmerica High Tech Awards 2011 Finalist

Posted by Palomar Technologies MarCom Team on Thu, Oct 20, 2011

Awards Event to Showcase San Diego’s Finest Technology Companies

Carlsbad, CA – October 20, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it has been selected as a finalist in the Semiconductors category for the upcoming 18th Annual TechAmerica High Tech Awards. As the leading voice representing the U.S. technology industry, TechAmerica takes pride in recognizing outstanding regional companies every year at its annual awards ceremony. Finalists will be acknowledged for their achievements during a luncheon reception on October 28th at the Hilton La Jolla Torrey Pines in La Jolla, CA.

“Palomar Technologies specializes in automated high-precision die attach and wire bonding systems for microelectronic production. Our team of experts is constantly pushing the envelope to help our customers create that ‘next big thing’,” stated Bruce Hueners, president and CEO of Palomar Technologies. “Our fellow 2011 TechAmerica finalists are a remarkable group of San Diego’s semiconductor organizations, and Palomar is proud to be recognized among them.”

Palomar Technologies was selected as a finalist in the Semiconductor category for its high-accuracy wire and die attach services via fully automated component packaging systems and precision contract assembly, process development, test and prototyping divisions.

This year, several San Diego-based companies were nominated for their technological or business innovation; exceptional products or service; product marketplace validation; perseverance in the face of adversity; and community involvement for consideration in nine categories.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About TechAmerica
TechAmerica is the driving force behind productivity growth and jobs creation in the United States and the foundation of the global innovation economy. Representing approximately 1,500 member companies of all sizes from the public and commercial sectors of the economy, it is the industry’s largest advocacy organization and is dedicated to helping members’ top and bottom lines. It is also the technology industry's only grassroots-to-global advocacy network, with offices in state capitals around the United States, Washington, D.C., Europe (Brussels) and Asia (Beijing). TechAmerica was formed by the merger of AeA (formerly the American Electronics Association), the Cyber Security Industry Alliance (CSIA), the Information Technology Association of America (ITAA) and the Government Electronics & Information Technology Association (GEIA). Learn more at www.aeanet.org or www.itaa.org.

 ###

Topics: Announcements, capital equipment, semiconductor industry, automated packaging systems, TechAmerica, Awards

Palomar Technologies Discusses Pulsed Heat Eutectic Solder and Chain Wire Bonding for HB LEDs at IMAPS 2011

Posted by Palomar Technologies MarCom Team on Tue, Oct 04, 2011

Carlsbad, CA – October 4, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at IMAPS 2011 in Long Beach, California on October 11-13, in booth #231.

Palomar Technologies is presenting two HB LED technical papers in the Advanced Technologies Track at IMAPS 2011. Palomar Assembly ServicesTM general manager, Donald Beck, has co-authored “High-Yield Process Improvements for High-Reliability HB-LED Automated Assembly” and “Evaluation of AuSn Eutectic Die Attach Materials Designed for High-Brightness LED Packaging.” Beck will be on-site at IMAPS to discuss recent advancements in the LED industry.

“Today’s HB LED applications require maximum thermal transfer to achieve performance results. Precision eutectic soldering provides high-quality, low-risk performance,” stated Beck. “Reaching performance and cost targets requires continuous improvements in LED devices and packaging designs. Close LED proximity is one of several paths that help to extract every possible lumen per watt. This is best achieved using a pulsed heat eutectic die attach and chain wire bonding.”

Palomar Technologies offers a Pulsed Heat System (PHS), designed especially for the ultra-flexible 3800 Die Bonder. The PHS allows for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. Computer-controlled software provides a highly regulated temperature profile and data feedback throughout the process.

Chain bonding has become a reliable and cost-effective alternative to wedge bonding. Using ball bond technology on the high-reliability 8000 Wire Bonder, chain bonding follows a ball-loop-stitch-loop-stitch process, producing “chains” of loop shapes traditionally generated by a wedge bonder. Wedge emulation with a ball bonder using chain bonding can be an excellent alternative to using a wedge bonder to perform interconnects. To learn more, download "The Great Debate: Ball vs. Wedge" technical paper.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

###

Topics: 3800 die bonder, LED matrix assembly, trade shows, 8000 wire bonder, IMAPS, HB LED, AuSn, hi-rel wire bonds

Something Powerful

Tell The Reader More

The headline and subheader tells us what you're offering, and the form header closes the deal. Over here you can explain why your offer is so great it's worth filling out a form for.

Remember:

  • Bullets are great
  • For spelling out benefits and
  • Turning visitors into leads.

Subscribe to Email Updates

Posts by Topic

see all