Press Release

Carlsbad, CA – March 18, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at the Microelectronic Packaging and Test Engineering Council
Posted by Palomar Technologies MarCom Team on Fri, Mar 18, 2011 @ 01:00 PM
CARLSBAD, CA - March 14, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will showcase live demonstrations of the 3500-III Die Bonder at SEMICON China
Posted by Palomar Technologies MarCom Team on Mon, Mar 14, 2011 @ 12:00 PM
CARLSBAD, CA - March 4, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its involvement in the IMAPS Device Packaging conference on March 8-9 in Scottsdale,
Posted by Palomar Technologies MarCom Team on Fri, Mar 04, 2011 @ 02:00 PM