CARLSBAD, CA - April 22, 2009 - Palomar Technologies, a world leader in providing solutions for microelectronic and optoelectronic packaging and experts in precision wire bonding, gold wire bond and high accuracy component placement systems, announced today it has formed alliances with GPD Global, Hybond, Inc., and Royce Instruments, Inc.
"The systems that these firms provide are very complementary to our precision wire bonding, automatic wire bonders and die bonders," said Bruce W. Hueners, President and CEO of Palomar Technologies. "These alliances will enable us to offer our worldwide customer base the most comprehensive options available, and truly make Palomar the 'one-stop-solution-shop' for microelectronic and optoelectronic packaging solutions."
GPD Global, headquartered in Grand Junction, CO, is a premier manufacturer of automated precision fluid dispensing systems. "We are excited about our new relationship with Palomar. With this alliance, our advanced precision dispense systems are now available as part of a complete microelectronics assembly line," said Sven Wedekin, Vice-President and General Manager of GPD Global.
Hybond, Inc., based in Escondido, CA, is a world-renowned designer and manufacturer of manual wire bonders, die bonders and wedge bonders. Since 1980, Hybond products have been instrumental in microelectronics development and production. Felix Mayorca, Vice-President of Sales and Marketing, said, "It's a natural alliance... wherever you see a Palomar system you could also see a Hybond system."
Royce Instruments, Inc., located in Napa, CA, is an industry leader in bond testers and die sorters. The company provides compact bond testers with built-in SPC and networking, and versatile, low cost die sorters. Diane Cox, President, said, "With a 25 year record of innovation and excellent customer support, Royce Instruments looks forward to a fruitful and dynamic collaboration with Palomar."
About Palomar Technologies
Palomar Technologies, formerly part of Hughes Aircraft, is the world's foremost provider of high-precision wire bonders, gold wire bonders, die bonders and automated component placement systems. Palomar combines process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers in the telecommunications, medical, defense and aerospace and commercial high technology industries. For more information, visit www.palomartechnologies.com.