Palomar Technologies to Exhibit at SEMICON China in Shanghai

Palomar Technologies to Present and Exhibit at IMAPS 2016

Wedge and Die Bond Demos at SEMICON West 2016

Palomar Technologies to Exhibit at SEMICON Southeast Asia and SMT Nuremberg

Palomar Technologies' 3880 Die Bonder Wins the NPI Award for Bonders

Visit Palomar Technologies at OFC 2016

Palomar Technologies Performs Live Demonstrations at SEMICON China 2016

Palomar Technologies Performs Live Demonstrations at Productronica 2015

Palomar Technologies Exhibits at the IMAPS 48th Annual Symposium on Microelectronics

Palomar Technologies Introduces the Latest in Die Bonding Technology: The 3880 Die Bonder

Palomar Technologies Inc. Files Patent Infringement Lawsuit Against MRSI to Protect Ultra-High Accuracy Placement and Die Attach Capability

Palomar Technologies Exhibits at SEMICON West 2015 Showcasing Bonder Demos

Palomar Technologies’ President and CEO, Bruce Hueners, is an EY Entrepreneur of The Year® 2015 Award Finalist

Palomar Technologies to Exhibit at the 2015 International Microwave Symposium

Palomar Technologies Introduces the 9000 Wedge Bonder to Germany at SMT Hybrid Packaging 2015

Palomar Technologies to Exhibit at the Optical Fiber Communication Conference 2015

Palomar Technologies’ CTO to Present at SEMICON China 2015

Palomar Technologies Acquires SST International

Palomar Technologies to Exhibit at 2015 Strategies in Light Exhibition and Conference

Palomar Technologies Announces the Latest in Wedge Bonding Technology: The 9000 Wedge Bonder

Palomar Technologies Exhibits “The Future of Packaging” at IMAPS 2014

SEMICON Taiwan 2014 Highlights Advanced Packaging Technology

Palomar Technologies Exhibits at SEMICON West 2014 Showcasing Wire Bond Demos

Palomar Technologies Announces Alliance Partnership with NCDMM

Automated Wire Bonding Production System Demonstrations at SEMICON China 2014

Upcoming Microelectronic Packaging Courses to be Held in Singapore

Palomar Technologies Announces Alliance with SCI Automation Plasma Cleaning

New Wire Bonder Demos at productronica 2013 – 8000i Wire Bonder with i2GiTM Technology

Wire Bonding & Stud Bumping Technical Track Plus New Product Demos at IMAPS 2013

SEMICON Taiwan 2013 Echoes Increases in Regional Advanced Packaging

New Palomar Asia Facility for Demonstrations, Support & Training

New Products at SEMICON West 2013 – 8000i Wire Bonder with i2Gi(TM) Technology & VisionPilot(TM) Software For Automated Die Attach

Palomar Technologies Selected as 2012 Exporter of the Year at San Diego North Economic Development Council Annual Business Luncheon

High-Accuracy Processes for RF, Optoelectronics & Automotive Microelectronics Assembly

Live Wire Bonding & Die Attach Demonstrations in Booth #6157 at SEMICON West 2012

Palomar Technologies President and CEO, Bruce Hueners, Named Finalist in Ernst & Young Entrepreneur Of The Year® 2012 Award for San Diego

Palomar Technologies Presents Sub-5um Die Attach Placement Accuracy Webcast

New Demonstration Center & Expanded Spare Parts Depot to Further Support Palomar Technologies Die Bonder & Wire Bonder Customers in Asia-Pacific Region

Hi-Rel Wire Bonder & Universal Bond Tester Demonstrations at SMT Nuremberg 2012

National Hockey League Uncompressed HD Video Goal Capturing Enabled by Palomar Technologies and VubIQ

Palomar Technologies 3800 Die Bonder Offers Flexible Solutions to Support LED Development in China

Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs

Palomar Technologies Achieves Fifth Consecutive Year-Over-Year Revenue Growth and Profitability

Palomar Technologies gibt die Teilnahme an der Productronica 2011 bekannt und stellt Large Work Area Wire- u. Die Bonder vor

Palomar Technologies Named TechAmerica High Tech Awards 2011 Finalist

Palomar Technologies Discusses Pulsed Heat Eutectic Solder and Chain Wire Bonding for HB LEDs at IMAPS 2011

Palomar Technologies Exhibits at SEMICON Taiwan 2011 and Offers a Laser Interferometer Technology for Wire Bonder Ultrasonic Calibration System

Palomar Technologies Meets and Exceeds ITAR Compliance Regulations

Palomar Technologies Exhibits at SEMICON West 2011 and Offers Trade-In Credit for Used Die Attach Systems

Palomar Technologies To Exhibit at Electronic Components and Technology Conference and Discusses HB LED Assembly in Free On-Demand Webcast

Palomar Technologies Performs Live Demonstrations of 3800 Die Bonder and 8000 Wire Bonder at SMT Hybrid Packaging 2011 and Hosts Free On-Demand HB LED Webcast

Palomar Technologies President and CEO Named Semi-Finalist in Ernst & Young Entrepreneur Of The Year® 2011 Award for San Diego

Palomar Technologies To Exhibit at MEPTEC Thermal Symposium and Shares Article on AuSi/AuSn Eutectic Die Attach

Palomar Technologies to Provide Live Demonstrations of the 3500-III Die Bonder at SEMICON China 2011

Palomar Technologies to Exhibit at IMAPS Device Packaging and Shares Prominent Technical Papers for Download

Palomar Technologies Highlights Improved High Volume HB LED Assembly at Strategies in Light Conference

Palomar Technologies Again Achieves Year-Over-Year Revenue Growth and Profitability

Wire Bonding Company, Palomar Technologies, Forms Alliances With GPD Global, Royce Instruments and Hybond

Palomar Technologies To Exhibit at 2009 Strategies in Light Exhbition and Conference

Palomar Technologies Presents Latest Version of Award-Winning Automatic 3500-III Die Bonder

Honored for 3500-II Die Bonder Automatic Component Placement Cell