This paper discusses the modern manufacturers' challenge in packaging assembles that require mixed interconnect technologies of SMT and Microeletronics services.

• Mixing Applications
• Required Processes
• Thermal Considerations
• Consideration of Particular Boards
• Package and Die-Level Interconnect
• Taking product from design to production at lower cost in shorter time
• Case History of a Detector Panel
• Planning for SMT and Microelectronics Assembly