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INNOVATION CENTER - usa

Serving Customers' Advanced Photonics and Microelectronics Packaging and Assembly Needs

Our Innovation Center – USA, run by our Assembly Services business unit, is strategically located within our headquarters’ in Carlsbad, CA.  Here, our highly skilled in-house engineering staff and technicians remain close to Palomar Technologies design and manufacturing engineers, providing a close feedback loop and reducing any downtime. Together, we’ll help you become the leader in your market by providing state-of-the-art assembly services that are capable of ultra-high precision die attach, wire bonding, ribbon bonding, and die sorting.

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Assembly Services lab

Turnkey die attach and wire bonding services. We’ll help you become the leader in your market by providing state-of-the-art assembly services that are capable of ultra-high precision die attach, wire bonding, ribbon bonding, and die sorting.

Our laboratories offer:

  • Experienced engineering, purchasing and technical staff
  • Cost-effective alternative to investing in capital equipment
  • Immediate access to manufacturing expertise and increased capacity without staffing increases
  • Prototyping devices and manufacturing methods quickly and efficiently evaluated
  • Class 1000-10000 clean room spaces
  • Secure work areas with ITAR certification
  • Temperature, humidity, ionization control
  • Electro-static discharge (ESD)
  • Secure warehouse
  • Strict IP confidentiality

Die Attach

  • Epoxy Die Attach
    • Conductive
    • Non-conductive
    • UV cure
    • Snap cure
    • Anisotropic adhesive
  • Eutectic Die Attach
    • Preform
    • Pre-deposited / Back-side metalized
    • Solder paste
    • Void-free soldering, flux-free attach
  • High Accuracy Component Placement
  • Flip Chip
  • Thermo-Compression
  • Glass Sealing
  • Wafer (up to 12”)
  • Deep Access

Machines used: Palomar 3880, 6500 Die Bonders; SST 5100 Vacuum Reflow System

Wire Bonding

  • Gold Wire, Gold Ball Bonding
  • Gold Ball Bumping
  • Stud Bumping
  • Ultrasonic wire bonding
  • Wedge Bond, Gold Wedge Bonding
  • Aluminum Wedge Bonding
  • Ribbon Bonding
  • Deep Access Wire Bonding
  • TAB Bonding

Machines used: Palomar 8000i, 9000 Wire Bonders

Additional Capabilities

  • Hermetic Package Sealing
  • High Vacuum MEMS Packaging
  • Die Sorting
  • Wire Pull Testing
  • Die/Shear Testing
  • Plasma Cleaning: single gas, multiple gas, argon, oxygen, forming gas
  • Encapsulation
  • Video Measurement
  • Scanning Acoustic Microscope (SAM)
  • Scanning Electron Microscope 

*Consigned test equipment floor space for special applications available

Machines used: Royce Tester, Royce Die Sorter, SST Vacuum Reflow, SCI Plasma Cleaning, Keyence VHX-1000, Nikon VMR, Sonix CSAM

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Data Sheet White@2x.png 3880 Die Bonder
Data Sheet White@2x.png Technical Papers & eBooks
Data Sheet White@2x.png 8000i Wire Bonder
Data Sheet White@2x.png Process Development Services