Gold Wire Ball Bump versus Wire Plating Technologies

Reverse Wire Bonding With Ball Bumps

reverse wire bonding

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Gold Bump Technologies: Plating vs. Ball

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What's Inside...

  • Ball bumping can be more economical than plating processes
  • Ball bumping supports a variety of substrate interconnect methods
  • Ball bumping offers unique benefits compared to plating
  • Various bump shapes are available depending on the application
  • Ball bumping uses existing peripheral pad die type and associated infrastructure
  • Can be significantly quicker turn for prototype
  • Unique flat bump and low-profile bump shapes