Reverse Wire Bonding With Ball Bumps
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Gold Bump Technologies: Plating vs. Ball
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What are you looking for?
To purchase die attach and/or wire bonding equipment
To hire Palomar's contract Assembly Services
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What application challenge are you trying to meet?
Ball bumping can be more economical than plating processes
Ball bumping supports a variety of substrate interconnect methods
Ball bumping offers unique benefits compared to plating
Various bump shapes are available depending on the application
Ball bumping uses existing peripheral pad die type and associated infrastructure
Can be significantly quicker turn for prototype
Unique flat bump and low-profile bump shapes
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