Reverse Wire Bonding With Ball Bumps
download the technical paper!
Gold Bump Technologies: Plating vs. Ball
Email (we will keep your email completely private)
Where are you located?
What are you looking for?
To purchase die attach and/or wire bonding equipment
To hire Palomar's contract Assembly Services
To speak with an engineer about products, services & solutions
What application challenge are you trying to meet?
Ball bumping can be more economical than plating processes
Ball bumping supports a variety of substrate interconnect methods
Ball bumping offers unique benefits compared to plating
Various bump shapes are available depending on the application
Ball bumping uses existing peripheral pad die type and associated infrastructure
Can be significantly quicker turn for prototype
Unique flat bump and low-profile bump shapes
NEWS & EVENTS
© 2013 Palomar Technologies, Inc.
News & Events
Webcasts & Video Demos
Terms & Conditions
Copyright 1995-2013 Palomar Technologies