Automated Wire Bonder and Die Attach Equipment for Advanced Packaging

Automated Die Bonder For Assembly Services

3800 Die Bonder for automated assembly services packaging
Palomar Technologies Assembly ServicesTM performs automated assembly for an array of applications, including HB LEDs, MEMS, Laser Diodes, LED Printhead and RF devices.

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Equipment for Advanced Packaging

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Automated microelectronic and photonic manufacturing equipment is the engine that propels today's product concepts from the laboratory into large-scale commercial, military and industrial prominence

In the leading edge of the market, emerging packaging methods and novel materials provide the impetus for innovative packaging and interconnection processes and equipment.

Download to read more from Palomar Technologies' CEO, Bruce Hueners.

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