Automated Wire Bonding, Die Attach, and Contract Assembly Services
High-Accuracy Die Attach. High-Rel Wire Bonding. Automated microelectronic and optoelectronic component packaging systems.

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PTI Blog

Extending Bonder Life and Performance
Tuesday, May 14, 2013
Just as routine medical exams and checkups can help us live longer and healthier lives, routine checkups of bonders can extend the life of the equipment, which certainly provides...Read More
Gold Ballbonden mit beheizter Kapillare
Tuesday, May 7, 2013
[For the English version, click here .] Gold (Au) Ball- Drahtbonden ist immer noch die beherrschende Verbindungsmethode in der Mikroelektronik. Die Industrie arbeitet weiter...Read More
Multi-Chip Modules & Stacked Die Assemblies
Tuesday, Apr 30, 2013
Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further miniaturization of consumer products,...Read More

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