Wire Bonder data sheet. Die Bonder data sheet. Semiconductor equipment spec sheets

Palomar Technologies Product and Services Data Sheets

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spare-parts

Product and Services Data Sheets

• 3800 Die Bonder - ultra-versatile component placement / die attach systemr
• 6500 Die Bonder - high-precision component placment / die attach system
• 8000 Wire Bonder - high-reliability ball-and-stitch wire bonder
• 3500-III Die Bonder - high-accuracy component placement / die attach system
• Assembly Services - precision microelectronic packaging solutions
• 2100C Interferometer - high-quality ultrasonic monitor and calibration system
• Field Services Support - optimizing your equipment performance
• Bonder Boot Camp - wire bonder & die bonder training courses

Bonder Options Data Sheets

• Bonder Buy-Back Program – trade in used bonders for credit towards a 3800 Die Bonder
• Pulsed Heat System – high-precision eutectic die attach process
• Steady State Heat System
• Hot Rail Hander

Palomar Technologies Alliances

• GPD Global – precision fluid dispensing systems
• Hybond – thermosonic ball and wedge bonders, and universal bonder test units
• Royce Instruments – pull, shear and die sorting systems

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