Bonder Performance Upgrade - 3500 Die Bonder

The Bonder Performance Upgrade (BPU) brings 3500-I and 3500-II Die Bonder customers up the most recent operating system and pattern recognition software.

BPU includes:

• Latest bonder software, Windows XP OS installed on a P4 PC
• Bright, high resolution 19" LCD monitors
• Cognex 8000 Vision System

These upgrades offer customers continued product support, improvement in the ergonomics of the system and faster, more accurate pattern recognition.

*Contact your Account Manager for incentive discounts 

Product Enhancing Options

In addition to the above-stated features and benefits, this upgrade allows its user to add the following productivity enhancing options:

• Pulse Heat System - enables superior control for eutectic bonding
• Off-Line Programming - requires less down-time for new program setup; increases productivity in a high-mix, low-volume production environment
• Wafer Die Eject Systems (Punch Ups) - accurately lifts think and/or odd aspect ratio die from wafer
• Digital Dispensing - dispenses very precise, low-volume applications
• Automated Handling - various handling systems built specifically to support differing applications