PTI Blog

[For the English version, click here.] Le micro-câblage par fil d’or (ball bonding) est toujours la méthode prédominante pour les ...

Posted by Janine Powell on October 28

[For the English version, click here.] Soldagem de fio de bola de ouro Ouro (Au) ainda é o método predominante para interconexões em ...

Posted by Janine Powell on July 16

SEMICON West 2013 is barely two weeks away; attendees are just days away from over 50 hours of technical programs and focused access to ...

Posted by Janine Powell on June 25

[For the English version, click here.] Gold (Au) Ball- Drahtbonden ist immer noch die beherrschende Verbindungsmethode in der ...

Posted by Janine Powell on May 7

Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel ...

Posted by Janine Powell on April 16

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...

Posted by Janine Powell on February 5

Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...

Posted by Janine Powell on January 22

In microelectronics production environments, bond testing can provide a means of evaluating bond quality and verifying bond consistency and ...

Posted by Janine Hueners on November 13

IMAPS 2012 delivered another great conference covering a wide array of topics. Held this year in San Diego, hundreds of industry peers, ...

Posted by Palomar Technologies MarCom Team on September 18

I would like to take a moment and thank you for your subscription to the PTI Blog. I hope you have found each weekly post both insightful ...

Posted by Palomar Technologies MarCom Team on December 27

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