The relentless increase in data processing requirements, network/cloud services, computing and web bandwidth advances, and soon-to-be-seen ...

Posted by Janine Powell on November 7

[For the English version of this blog, click here.] Les interconnexions en câblage filaire dans l’électronique on traditionnellement été ...

Posted by Janine Powell on July 18

Wire bonding is a well-known process that has been around for many decades. It was all performed manually from the mid-1950s to the late ...

Posted by Janine Powell on January 3

Have your engineers ever encountered challenges with locating parts while working with a die or wire bond application? This can be a ...

Posted by Janine Powell on August 23

A short case study in the shift from manual to automation is a good reminder of where we came from and where we are going in technology. It ...

Posted by Janine Powell on August 19

Microelectronic programs come with many forms of risk. If the design is manufacturable, the list is reduced, but a number of items still ...

Posted by Janine Powell on July 22

[For the English version, click here.] Cela nous est tous arrivez un jour : Votre micro-câbleuse fonctionne parfaitement et la production ...

Posted by Janine Powell on July 8

For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...

Posted by Janine Powell on June 24

Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps, and specialty interconnects for RF, ...

Posted by Janine Powell on April 1

Much has been written about using Design of Experiments to optimize the input parameters to an automatic wire bonder in order identify the ...

Posted by Janine Powell on February 5